| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/29/2005 | US20050211276 Lid for a semiconductor device processing apparatus and methods for using the same |
| 09/29/2005 | US20050211273 Method for operating vacuum installations under pressure changes |
| 09/29/2005 | US20050211269 Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid |
| 09/29/2005 | US20050211267 rinsing and drying substrates on a semiconductor wafer, comprising dispensing rinsing fluids onto the substrate during a rinsing cycle and spinning the wafer about an axis of rotation during a drying cycle to dry the wafer, while dispensing dry gases under pressure against the substrate |
| 09/29/2005 | US20050211266 enclosures having a wafer liquid baths containing cleaning solutions, vapor generators, supply pipes and controllers |
| 09/29/2005 | US20050211236 Dicing saw with variable indexing capability |
| 09/29/2005 | US20050211169 Apparatus for manufacturing substrate |
| 09/29/2005 | US20050211168 Mixing box, and apparatus and method for producing films |
| 09/29/2005 | US20050211167 Processing device and processing method |
| 09/29/2005 | US20050211161 Printing apparatus and device manufacturing method |
| 09/29/2005 | US20050211160 Method for making large-volume CaF2 single cystals with reduced scattering and improved laser stability, the crystals made by the method and uses thereof |
| 09/29/2005 | US20050211158 Silicon wafer for epitaxial growth, epitaxial wafer, and its manufacturing method |
| 09/29/2005 | US20050211135 Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions |
| 09/29/2005 | US20050210974 Substrate heating device and manufacturing method for the same |
| 09/29/2005 | US20050210700 Dummy substrate and substrate processing method using the same |
| 09/29/2005 | US20050210672 Method to contact patterned electrodes on porous substrates and devices thereby |
| 09/29/2005 | US20050210669 Substrate gripping apparatus, substrate gripping method and substrate releasing method |
| 09/29/2005 | US20050210667 Electronic component mounting apparatus and electronic component mounting method |
| 09/29/2005 | US20050210666 Substrate holding method and method of manufacturing electronic part |
| 09/29/2005 | US20050210665 Tray for storing and transporting semi-conductor and other microelectronic components |
| 09/29/2005 | DE3812135B4 Verfahren zum Herstellen von elektrischen Kontakten hoher Ausbeute an amorphes N+-Silizium A method for producing electrical contacts high yield of amorphous N + -silicon |
| 09/29/2005 | DE20320996U1 Probing apparatus for measuring electrical characteristics of integrated circuit, has signal contact tip for selective engagement with signal contact pad of device under test and coupled to impedance matching resistor |
| 09/29/2005 | DE202005011367U1 Transfer-ESC for moving ultra-thin chips during manufacture has a base material wafer with a multiplicity of grouped electrode cells each with an electrode tip, insulator, outer electrode cover and dielectric cover |
| 09/29/2005 | DE202005010867U1 Soldered joint`s shape and height manipulating body, has laser holes that are annealed vertically into silicone elastomer band, where solder joints are coated by body to determine shape and height of joints which can be controlled |
| 09/29/2005 | DE19818024B4 Halbleitervorrichtung mit einer Trennstruktur für eine hohe Haltespannung A semiconductor device comprising a separation structure for a high withstand voltage |
| 09/29/2005 | DE19802404B4 Vorrichtung zur Gasreinigung sowie Verfahren zur Behandlung eines zu reinigenden Gases A device for gas purification and method of treating a gas to be purified |
| 09/29/2005 | DE19758533B4 Verfahren zum Strukturieren einer Oberflächenschicht A method for patterning a surface layer |
| 09/29/2005 | DE19731944B4 Testmusterbereich bzw. eine Testelementgruppe zur Lebensdauerauswertung von Ladungsträgern in einem Halbleitersubstrat Test pattern area or a test element group for lifetime evaluation of charge carriers in a semiconductor substrate |
| 09/29/2005 | DE19723096B4 Verfahren zum Bilden einer Verbindungsleitung A method of forming an interconnector |
| 09/29/2005 | DE112004000057T5 Plasmabehandlungsapparat, Verfahren zur Herstellung eines Reaktionsgefäßes zur Plasmaerzeugung und Plasmabehandlungsverfahren Plasma processing apparatus, method for the preparation of a reaction vessel for the plasma generation and plasma treatment process |
| 09/29/2005 | DE10393523T5 Behälter zum Lagern von Präzision erfordernden Substratscheiben mit Halbleiter-Wafern Containers for the storage of requiring precision substrate wafers with semiconductor wafers |
| 09/29/2005 | DE10393176T5 Verfahren zum Evaluieren eines kernbasierten Systems auf einem Chip A method for evaluating a core based system on a chip |
| 09/29/2005 | DE10392461T5 Packaging-System für Halbleitervorrichtungen Packaging system for semiconductor devices |
| 09/29/2005 | DE10302625B4 Bipolartransistor und Verfahren zum Herstellen desselben Of the same bipolar transistor and method for producing |
| 09/29/2005 | DE10233607B4 Anordnung mit einem Halbleiterchip und einem mit einer Durchkontaktierung versehenen Träger sowie einem ein Anschlusspad des Halbleiterchips mit der Durchkontaktierung verbindenden Draht und Verfahren zum Herstellen einer solchen Anordnung Arrangement with a semiconductor chip and a carrier provided with a via hole and a connection pad of a semiconductor chip to the plated-through hole connecting wire and method of manufacturing such an arrangement |
| 09/29/2005 | DE102005011703A1 pn-Diode auf der Basis von Silicumcarbid und Verfahren zu deren Herstellung pn-diode on the basis of silicon carbide and methods for their preparation |
| 09/29/2005 | DE102005008272A1 Sensorvorrichtung Sensor device |
| 09/29/2005 | DE102005008058A1 Verfahren zum Herstellen von Halbleiterspeicherbauelementen und integriertes Speicherbauelement A method for the manufacture of semiconductor memory devices and integrated memory device |
| 09/29/2005 | DE102004063610A1 Color photoresist removing method for use during color filter fabrication, involves performing sequentially plasma ashing, wet etching, and plasma ashing processes on substrate to remove residue of color photoresist on substrate |
| 09/29/2005 | DE102004060922A1 Klebstofffilm zum Herstellen einer Halbleitereinrichtung Adhesive film for manufacturing a semiconductor device |
| 09/29/2005 | DE102004060707A1 Rotes Fluoreszenz-Material, Weißlicht emittierende Diode, die rotes Fluoreszenz-Material verwendet und Beleuchtungssystem, das eine Weißlicht emittierende Diode verwendet Red fluorescent material, white light emitting diode using red fluorescent material and illumination system which includes a white light emitting diode used |
| 09/29/2005 | DE102004046788A1 Pufferschicht auf Basis eines ternären Nitrids eines Lichtemissions-Bauteils auf Nitridbasis, und Verfahren zum Herstellen derselben Buffer layer on the basis of a ternary nitride of a nitride-based light-emitting component, and method for manufacturing the same |
| 09/29/2005 | DE102004035343A1 Contacting card for use in testing integrated circuits, has a substrate carrier with contacts matching those of a wafer substrate to be tested and connects from these contacts to a testing device |
| 09/29/2005 | DE102004032170A1 Circuit structure, is formed on a substrate by forming a metal structure on the substrate, applying an anti-reflection layer, forming a mask, etching and polishing |
| 09/29/2005 | DE102004031304A1 Transistor for semiconductor device, comprises insulating film spacer that fills space between lower surface of gate electrode and upper surface of substrate, and source/drain region disposed on substrate at both sides of gate electrode |
| 09/29/2005 | DE102004027425A1 Forming a trench in a substrate surface layer, comprises covering a primary layer with a mask, applying a second layer to the mask structure, etching, and polishing |
| 09/29/2005 | DE102004012238A1 Arrangement of semiconductor elements on a wafer has capacitors near sawing edge and fuse elements near chips for testing |
| 09/29/2005 | DE102004011996A1 Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken Apparatus for simultaneous double-side grinding of disk-shaped workpieces |
| 09/29/2005 | DE102004011929A1 Electrical contact surfaces connection establishing method, involves arranging contact surfaces by irradiating surfaces with laser radiation having power density within specific range |
| 09/29/2005 | DE102004011808A1 Power module for automotive application, has molded housing surrounding semiconductor component and wire bond, and connection area left out from housing and suspended on layer |
| 09/29/2005 | DE102004011432A1 Semiconductor memory cell e.g. for field effect transistors, has ferroelectric material zone designed with different remanent ferroelectric polarization states |
| 09/29/2005 | DE102004011431A1 Halbleiterspeicherzelle, Verfahren zu deren Herstellung sowie Halbleiterspeichereinrichtung A semiconductor memory cell, process for their preparation as well as the semiconductor memory device |
| 09/29/2005 | DE102004011430A1 Halbleiterspeicherzelle, Verfahren zu deren Herstellung und Halbleiterspeichereinrichtung A semiconductor memory cell, process for their preparation and the semiconductor memory device |
| 09/29/2005 | DE102004011203A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system |
| 09/29/2005 | DE102004011175A1 Implanted doping atom e.g. boron atom, activating method for use during manufacturing of e.g. thyristor, involves subjecting semiconductor having doping material to specific temperature that does not exceed preset, during curing treatment |
| 09/29/2005 | DE102004010840A1 Verfahren zum Betreiben einer elektrischen beschreib- und löschbaren nicht flüchtigen Speicherzelle und eine Speichereinrichtung zum elektrischen nicht flüchtigen Speichern A method of operating an electrical writable and erasable non-volatile memory cell and a memory device for storing nonvolatile electric |
| 09/29/2005 | DE102004010599A1 Transfer device in manipulation and/or processing centers of clean room systems, has transfer chambers combined to form structural unit |
| 09/29/2005 | DE102004010481A1 Semiconductor substrate`s layer characterizing method, involves making recess at surface of substrate such that cut section and surface of substrate are at pointed angle, and reproducing section by raster capacity microscope |
| 09/29/2005 | DE102004010115A1 Semiconductor circuit manufacturing method, involves bonding discrete semiconductor components on substrate such that base and emitter terminals of corresponding P and N conductive regions on one side of substrate are accessible |
| 09/29/2005 | DE102004009901A1 Vorrichtung zum Singulieren und Bonden von Halbleiterchips und Verfahren zum Singulieren und Bonden Apparatus for singulating and bonding semiconductor chips and method for singulating and bonding |
| 09/29/2005 | DE102004009742A1 Rückseitenbeschichteter, dünner Halbleiterchip und Verfahren zu seiner Herstellung Back-coated, thin semiconductor chip and process for its preparation |
| 09/29/2005 | DE102004009567A1 Wiring carrier for accommodating chip, is divided into function unit, such that bending rigidity of cross board and side band portion is increased |
| 09/29/2005 | DE102004008475A1 Semiconductor chip breaking strength increasing method for use during manufacturing of chips, involves applying coating on backside of wafer for protecting chips from physical or chemical effects, where thickness of coating is large |
| 09/29/2005 | DE102004007410A1 Verfahren zum Herstellen einer Speicherzelle A method for fabricating a memory cell |
| 09/29/2005 | CA2557702A1 Self-aligned silicon carbide semiconductor devices and methods of making the same |
| 09/29/2005 | CA2497933A1 Dissipation of a charge buildup on a wafer portion |
| 09/28/2005 | EP1581040A2 Electronic component mounting apparatus and electronic component mounting method |
| 09/28/2005 | EP1580853A1 Semiconductor laser and method of manufacturing the same |
| 09/28/2005 | EP1580822A1 Organic field-effect-transistor and method for its production |
| 09/28/2005 | EP1580821A2 Magnetoresistance effect element magnetic memory element magnetic memory device, and their manufacturing method |
| 09/28/2005 | EP1580818A1 Process for producing optical semiconductor device |
| 09/28/2005 | EP1580817A2 GaN-based compound semiconductor light emitting device and method of fabricating the same |
| 09/28/2005 | EP1580815A2 Integrated switch device |
| 09/28/2005 | EP1580813A2 Semiconductor substrate, semiconductor device, and manufacturing methods for them |
| 09/28/2005 | EP1580811A2 Passivation films for organic thin film transistors |
| 09/28/2005 | EP1580806A2 Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device |
| 09/28/2005 | EP1580805A2 Process for preparing a silicon dioxide layer by high temperature oxidation of a substrate having at least a germanium surface or a silicon-germanium surface |
| 09/28/2005 | EP1580804A1 Composition for porous film formation, porous films, process for production of the films, interlayer dielectrics, and semiconductor devices |
| 09/28/2005 | EP1580803A1 Method of etching, etching apparatus and process for producing semiconductor device |
| 09/28/2005 | EP1580802A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition |
| 09/28/2005 | EP1580800A1 Method for cutting semiconductor substrate |
| 09/28/2005 | EP1580789A2 Ion implantation method and apparatus |
| 09/28/2005 | EP1580760A1 MRAM with high current density |
| 09/28/2005 | EP1580758A2 Soft-reference three conductor magnetic memory storage device |
| 09/28/2005 | EP1580636A1 Semiconductor device with temperature compensation circuit |
| 09/28/2005 | EP1580607A2 Process solutions containing surfactants |
| 09/28/2005 | EP1580606A1 Rinse liquid for lithography and method for forming resist pattern using same |
| 09/28/2005 | EP1580605A2 Method of determining aberration of a projection system of a lithographic apparatus |
| 09/28/2005 | EP1580604A2 Stage device and exposure apparatus |
| 09/28/2005 | EP1580603A2 Lithographic Apparatus, Device Manufacturing Method and Variable Attenuator |
| 09/28/2005 | EP1580602A1 Lithographic apparatus, Lorentz actuator and device manufacturing method |
| 09/28/2005 | EP1580601A1 Positive resist composition for use with electron beam, EUV light or X ray, and pattern formation method using the same |
| 09/28/2005 | EP1580600A1 Resist composition |
| 09/28/2005 | EP1580596A2 Structure formed with template having nanoscale features |
| 09/28/2005 | EP1580593A1 Method for manufacturing electronic device and electronic device |
| 09/28/2005 | EP1580568A2 Semiconductor device, magnetic sensor, and magnetic sensor unit |
| 09/28/2005 | EP1580567A2 Device and method for nondestructive inspection on semiconductor device |
| 09/28/2005 | EP1580479A1 Raw solution feeding system for vaporizer and method of cleaning the raw solution feeding system |
| 09/28/2005 | EP1580446A1 Method of operating a vacuum system with varying pressure |
| 09/28/2005 | EP1580292A1 Method of producing a substrate |