Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/16/2005EP0954890B1 Excimer laser with greater spectral bandwidth and beam stability
11/16/2005EP0862793B1 Electronic devices including electrodes comprising chromium nitride and a method of manufacturing such devices
11/16/2005CN2741191Y Image sensor with high quantum efficiency
11/16/2005CN2741190Y Chips of semiconductor and integrated circuit
11/16/2005CN2741189Y Electric capacitor
11/16/2005CN2741182Y Semiconductor
11/16/2005CN1698255A Dc/dc converter using bipolar transistor, method of manufacturing the same and DC power supply module using the same
11/16/2005CN1698242A Method of assembling light-emitting apparatus
11/16/2005CN1698239A 连接器 Connector
11/16/2005CN1698238A Electrical connector having a cored contact assembly
11/16/2005CN1698213A Semiconductor light-emitting element and method for manufacturing same; integrated semiconductor light-emitting device and method for manufacturing same; image display and method for manufacturing sam
11/16/2005CN1698211A Memory cell
11/16/2005CN1698210A P-type nitride semiconductor structure and bipolar transistor
11/16/2005CN1698208A Complementary analog bipolar transistors with trench-constrained isolation diffusion
11/16/2005CN1698207A Solid-state image sensing apparatus and method of manufacturing the same
11/16/2005CN1698206A Substrate, manufacturing method therefor, and semiconductor device
11/16/2005CN1698205A Semiconductor device and process for producing the same
11/16/2005CN1698200A Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
11/16/2005CN1698198A Semiconductor device and method of manufacturing the same
11/16/2005CN1698197A Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package
11/16/2005CN1698196A In-print method and in-print device
11/16/2005CN1698195A Hermetic sealing cap and method for producing same
11/16/2005CN1698194A Electronic device and its manufacturing method
11/16/2005CN1698193A Method for forming a layered semiconductor technology structure and corresponding layered semiconductor technology structure
11/16/2005CN1698192A Substrate holding mechanism using electrostatic chuck and method of manufacturing the same
11/16/2005CN1698191A Transfer device and semiconductor processing system
11/16/2005CN1698190A Joining method and joining device
11/16/2005CN1698189A Method to improve cracking thresholds and mechanical properties of low-k dielectric material
11/16/2005CN1698188A Method for depositing a low dielectric constant film
11/16/2005CN1698187A Semiconductor device producing method
11/16/2005CN1698186A Vaporizer and semiconductor processing apparatus
11/16/2005CN1698185A Substrate holding device and polishing device
11/16/2005CN1698184A Nitride semiconductor device and method for manufacturing same
11/16/2005CN1698183A Probe pin zero-point detecting method and probe device
11/16/2005CN1698182A Method for manufacturing semiconductor device
11/16/2005CN1698181A Method for forming pattern and method for manufacturing semiconductor device
11/16/2005CN1698180A Semiconductor substrate and manufacturing method therefor
11/16/2005CN1698179A Gate valve for semiconductor treatment system and vacuum container
11/16/2005CN1698178A System of transporting and storing containers of semiconductor wafers and transfer mechanism
11/16/2005CN1698160A Method for manufacturing plasma display panel
11/16/2005CN1698159A Method for manufacturing plasma display panel
11/16/2005CN1698135A Electrode material and semiconductor device
11/16/2005CN1698077A Element transfer method and display device
11/16/2005CN1697895A III-v compound semiconductor crystal and method for production thereof
11/16/2005CN1697893A Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
11/16/2005CN1697884A Nanoscaling ordering of hybrid materials using genetically engineered mesoscale virus
11/16/2005CN1697865A Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device com
11/16/2005CN1697781A Silane polymer and method for forming silicon film
11/16/2005CN1697768A Substrate-levitating device
11/16/2005CN1697588A A pattern form object and a manufacturing method thereof
11/16/2005CN1697583A Light-emitting device and display device
11/16/2005CN1697578A Organic electro luminescence device and fabrication method thereof
11/16/2005CN1697576A Method for manufacturing display device
11/16/2005CN1697575A Organic light emitting display device and its mfg. method
11/16/2005CN1697199A Semiconductor device and its manufacturing method
11/16/2005CN1697198A Semiconductor device and its manufacturing method
11/16/2005CN1697197A Semiconductor device and method of manufacture thereof
11/16/2005CN1697196A Semiconductor device and manufacturing method thereof
11/16/2005CN1697195A Memory element and memory device
11/16/2005CN1697193A Solid-state imaging device and manufacturing method thereof
11/16/2005CN1697187A Semiconductor integrated circuit, semiconductor device, and method of manufacturing semiconductor integrated circuit
11/16/2005CN1697186A Semiconductor device and manufacturing method therefor
11/16/2005CN1697185A Resistive cell structure for reducing soft error rate and inverter and forming method
11/16/2005CN1697184A Semiconductor memory
11/16/2005CN1697183A Nand flash memory device and method of forming a well of a nand flash memory device
11/16/2005CN1697182A Semiconductor device
11/16/2005CN1697181A Mutual compensating metals-oxides-semiconductor structure and its mfg. method
11/16/2005CN1697180A Semiconductor integrated circuit for reducing crosstalk and method for designing the same
11/16/2005CN1697179A Semiconductor device and method of manufacturing thereof
11/16/2005CN1697174A Semiconductor device and method for fabricating the same
11/16/2005CN1697164A Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
11/16/2005CN1697163A Wiring board and semiconductor package using the same
11/16/2005CN1697159A Method of fabricating split gate flash memory device
11/16/2005CN1697158A Method and system for self-convergent erase in charge trapping memory cells
11/16/2005CN1697157A Method for facilitating transaction of integrated circuit production among various parties through a network platform
11/16/2005CN1697156A Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature
11/16/2005CN1697155A Process of making an integrated circuit comprising shallow trench isolation and corresponding integrated circuit
11/16/2005CN1697154A Method for fabricating semiconductor device having trench isolation
11/16/2005CN1697153A Multiple zone carrier head with flexible membrane
11/16/2005CN1697152A Tray for load bearing IC and preparation method
11/16/2005CN1697151A Method to detect photoresist residue on a semiconductor device
11/16/2005CN1697150A Apparatus and method for mounting electronic components
11/16/2005CN1697149A Method for encapsulating IC
11/16/2005CN1697148A Semiconductor device and method of manufacturing the semiconductor device
11/16/2005CN1697147A Method for fabricating modular wire frames
11/16/2005CN1697146A Method for structuring field effect transistor in multiple channels from Nano carbon tubes
11/16/2005CN1697145A Technique for fabricating bipolar device under improved two-layer wiring
11/16/2005CN1697143A Method for preparing ferroelectric film on silicon substrate through temperature modulation
11/16/2005CN1697142A Method for fabricating semiconductor device
11/16/2005CN1697141A Apparatus and method for treating substrate
11/16/2005CN1697140A Etching technique for preparing ultrathin flexible silicon sustrate through two step method in wet-process etching
11/16/2005CN1697139A Single-layer polishing pad and method of producing the same
11/16/2005CN1697138A Single wafer cleaning apparatus and cleaning method thereof
11/16/2005CN1697137A Method for depositing aluminum to fill in hole in sub micron size applied to semiconductor technology
11/16/2005CN1697136A Method for implanting ions in semiconductor device
11/16/2005CN1697135A Manufacturing method for semiconductor device and semiconductor manufacturing apparatus
11/16/2005CN1697134A Method for preparing graphical substrate in situ by using SIN film
11/16/2005CN1697133A Method for forming polysilicon film through continuous mode solidificatin method in side direction, and pattem of optical mask
11/16/2005CN1697132A Method for preparing nano zinc oxide tube by assistance of radiofrequency plasma
11/16/2005CN1697131A Method of manufacturing semiconductor device and manufacturing line thereof