Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/17/2005DE19629249B4 Verfahren zum Analysieren von Defekten von Halbleitereinrichtungen mit drei Dimensionen A method for analyzing defects of semiconductor devices in three dimensions
11/17/2005DE10394006T5 Verfahren zum Herstellen einer integrierten, einen reduzierten Stress aufweisenden Schaltung und Halbleiterchip A method of fabricating an integrated, reduced stress having circuit and semiconductor chip
11/17/2005DE10393798T5 Ausheilprozess und Vorrichtung eines Halbleiter-Wafers Anneal process and apparatus of a semiconductor wafer
11/17/2005DE10324081B4 Speichervorrichtung zur Speicherung elektrischer Ladung und Verfahren zur Herstellung derselben Storage means for storing electric charge and methods for making the same
11/17/2005DE10306597B4 Verfahren zum Herstellen einer Halbleiterstruktur mit erhöhter Durchbruchspannung durch tieferliegenden Subkollektorabschnitt A method of manufacturing a semiconductor structure with increased breakdown voltage by underlying subcollector
11/17/2005DE102005019702A1 Schmelzsicherungsanordnung und Herstellungsverfahren Fuse assembly and manufacturing processes
11/17/2005DE102005019552A1 Halbleiterspeicher und Verfahren zu seiner Herstellung A semiconductor memory and method for its preparation
11/17/2005DE102005018735A1 Fabrication of trench for dynamic random access memory cell, by epitaxially growing monocrystalline semiconductor layer and laterally overgrowing opening surface covered by sealing material, and etching partial trench in semiconductor layer
11/17/2005DE102005018378A1 Halbleitervorrichtung der Bauart mit dielektrischer Isolierung Semiconductor device of the type dielectric insulation
11/17/2005DE102005018366A1 Rückwärtsleitende Halbleitervorrichtung und Herstellungsverfahren dafür Reverse conducting semiconductor device and manufacturing method thereof
11/17/2005DE102005015001A1 Schwellenspannungsdetektor zur Prozesseffektkompensation Threshold voltage detector for process effect compensation
11/17/2005DE102005002787A1 Leistungs-Metalloxid-Halbleitervorrichtung in Vertikal-Bauart mit Überstrom-Schutzfunktion Power metal oxide semiconductor device in vertical design with over-current protection function
11/17/2005DE102005002410A1 New top anti-reflective coating polymer for use in immersion lithography for fabrication of sub-nanomicron semiconductor device
11/17/2005DE102004063912A1 Verfahren zum versandfertigen Verpacken von Halbleiterscheiben A method for shipping the finished packaging of semiconductor wafers
11/17/2005DE102004036143A1 Linsenmodul und Verfahren zur Herstellung desselben Lens module and method of manufacturing the same
11/17/2005DE102004031920B4 Mehrchippackung und Herstellungsverfahren Multi-chip package and manufacturing processes
11/17/2005DE102004029297A1 Vertical field effect power transistor has field of mesa strips a body and semiconductor element with trenches and vertical gate electrodes in chessboard pattern
11/17/2005DE102004023646A1 Standard cell arrangement e.g. for DRAM semiconductor chip, has standard cell and open space for connection for cross connection between current supply and arranged on edge of standard cell
11/17/2005DE102004021261A1 Halbleiterbauelement mit einem Hybrid-Metallisierungsschichtstapel für eine verbesserte mechanische Festigkeit während und nach dem Einbringen in ein Gehäuse A semiconductor device with a hybrid metallization layer for improved mechanical strength during, and after insertion in a housing
11/17/2005DE102004021241A1 Verfahren zur Herstellung eines planaren Spacers, eines zugehörigen Bipolartransistors und einer zugehörigen BiCMOS-Schaltungsanordnung A process for producing a planar spacer, an associated bipolar transistor and an associated BiCMOS circuit arrangement
11/17/2005DE102004021240A1 Verfahren zur Herstellung einer Halbleiter-Schaltungsanordnung A method for fabricating a semiconductor circuit arrangement
11/17/2005DE102004021239A1 Lange getemperte integrierte Schaltungsanordnungen und deren Herstellungsverfahren Long tempered integrated circuit assemblies and their method of preparation
11/17/2005DE102004021228A1 Process for introduction of a trench into a specific conduction type semiconductor body by etching useful in semiconductor production
11/17/2005DE102004021227A1 Uniquely recordable semiconductor memory, for preventing stored information that are deleted or changed, comprises a fuse, which is a self-organized monologue of an organic compound
11/17/2005DE102004020834A1 Herstellungsverfahren für eine Halbleiterstruktur Manufacturing method of a semiconductor structure
11/17/2005DE102004020657A1 Verfahren zum Bilden eines Strukturgrößen-Messwertes A method of forming a structure size measuring value
11/17/2005DE102004020580A1 Verfahren zur Herstellung eines BGA-Chipmoduls und BGA-Chipmodul Process for the preparation of a BGA chip module and BGA-chip module
11/17/2005DE102004020547A1 Composite consisting of a semiconductor device and a carrier substrate, and elastically deformable wave-like protruberances, useful in semiconductor technology
11/17/2005DE102004020466A1 Verfahren zum Beschichten von Substraten in Inline-Anlagen A process for coating substrates in inline installations
11/17/2005DE102004020297A1 Verfahren zur Herstellung resistiv schaltender Speicherbauelemente A process for producing resistive switching memory devices
11/17/2005DE102004020173A1 Mikrostrukturiertes Bauelement und ein Verfahren zum Herstellen eines mikrostrukturierten Bauelements Microstructured component and a method for producing a microstructured component
11/17/2005DE102004019862A1 Sub-lithographic contact structure used in a memory cell in a semiconductor component comprises an insulating layer with a through hole arranged between contact electrodes, and a resistance changing layer
11/17/2005DE102004019732A1 Vorrichtung und Verfahren für die Bearbeitung eines Substrats in der Halbleitertechnik sowie System, das eine Vorrichtung für die Bearbeitung eines Substrats umfasst Apparatus and method for processing a substrate in semiconductor technology and system comprising an apparatus for processing a substrate
11/17/2005DE102004019664A1 Ready-for-dispatch package for semiconductor wafer, has shock absorbing element with recesses in which sheathed container is embedded in positive fitting manner, and outer package surrounding embedded container
11/17/2005DE102004019597A1 Production of a self-adjusting contact for an integrated semiconductor circuit comprises preparing a wafer with a substrate, etching a recess in an insulating layer, depositing a liner layer, and further processing
11/17/2005DE102004019588A1 Verfahren zur Strukturierung von zumindest einer Schicht sowie elektrisches Bauelement mit Strukturen aus der Schicht Method for structuring at least one layer and electrical component with structures from the layer
11/17/2005DE102004019568A1 Substrate for a power semiconductor module has electronic components and connections on metal conductor on an isolation layer and recesses beneath or next to these
11/17/2005DE102004019357A1 Verfahren zur Funktionalisierung von Biosensor-Chips A process for the functionalization of biosensor chips
11/17/2005DE102004019231A1 Delivery and loading station e.g. for mobile, electrostatic substrate holders, has thin substrates placed manually, by mobile, electrostatic handling equipment with table having nozzles for producing air cushion by substrates
11/17/2005DE102004018483A1 Vorrichtung und Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung Apparatus and method for applying coatings to the band-shaped structures in the semiconductor devices fabrication
11/17/2005DE102004014487A1 Speicherbauelement mit in isolierendes Material eingebettetem, aktiven Material Memory device having embedded in insulating material, active material
11/17/2005DE102004005992B3 Herstellungsverfahren für eine Halbleiterstruktur Manufacturing method of a semiconductor structure
11/17/2005DE10148794B4 Verfahren zum Herstellen eines MOS-Transistors und MOS-Transistor A method of manufacturing a MOS transistor, and MOS transistor
11/17/2005DE10008004B4 Schutzblende für eine elektrostatische Haltevorrichtung Shield for an electrostatic chuck apparatus
11/17/2005CA2564196A1 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
11/16/2005EP1596445A1 Process for doping organic semiconductors with derivatives of diiminoquinones
11/16/2005EP1596437A1 Method for manufacturing soi wafer and soi wafer
11/16/2005EP1596435A2 A pattern form object and a manufacturing method thereof
11/16/2005EP1596433A1 A method for creating neo-wafers from singulated integrated circuit die and a device made according to the method
11/16/2005EP1596432A1 Semiconductor device and manufacturing method thereof
11/16/2005EP1596431A1 Holder for wafers
11/16/2005EP1596430A1 Apparatus and method for replacing a gas in a storage container
11/16/2005EP1596427A1 Method for introducing impurities
11/16/2005EP1596426A1 Carburetor, method of vaporizing material solution, and method of washing carburetor
11/16/2005EP1596422A2 Apparatus and method for semiconductor chip detachment
11/16/2005EP1596421A2 Lithographic apparatus and device manufacturing method
11/16/2005EP1596419A2 High rate etching using fluorine plasma
11/16/2005EP1596251A1 Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method
11/16/2005EP1596241A1 Laser irradiation method, laser irradiation apparatus and method for manufacturing crystalline semiconductor film
11/16/2005EP1596239A2 Measuring device and method for operating the same for optical inspection of a sample
11/16/2005EP1596235A1 Optical device and a microlithography projection exposure system with passive thermal compensation
11/16/2005EP1596212A1 Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
11/16/2005EP1596204A1 Electrical testing facility
11/16/2005EP1595976A1 Film-forming apparatus component and method for cleaning same
11/16/2005EP1595974A2 Plasma uniformity control by gas diffuser hole design
11/16/2005EP1595973A1 Low temperature CVD chamber cleaning using dilute NF3
11/16/2005EP1595859A2 Article comprising a substrate comprising silicon and a top barrier layer comprising hafnium oxide
11/16/2005EP1595637A1 Device and method for laser processing
11/16/2005EP1595624A1 Centrifugal sintering system
11/16/2005EP1595598A1 Confinement of fluids on surfaces
11/16/2005EP1595289A2 Thermal interconnect systems methods of production and uses thereof
11/16/2005EP1595286A1 Polishing apparatus and two-step method of polishing a metal layer of an integrated circuit
11/16/2005EP1595285A1 Soi contact structure(s) and corresponding production method
11/16/2005EP1595284A1 Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
11/16/2005EP1595283A2 Methods for selectively bumping integrated circuit substrates and related structures
11/16/2005EP1595282A1 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method
11/16/2005EP1595281A1 Polishing method
11/16/2005EP1595280A2 Buffer structure for modifying a silicon substrate
11/16/2005EP1595279A1 Electronic part mounting apparatus
11/16/2005EP1595278A1 Random-period chip transfer apparatus
11/16/2005EP1595277A2 Low voltage nmos-based electrostatic discharge clamp
11/16/2005EP1595276A2 Patterning layers comprised of spin-on ceramic films
11/16/2005EP1595275A2 Interconnect structures incorporating low-k dielectric barrier films
11/16/2005EP1595268A1 Capacitor, semiconductor device with a capacitor and method of manufactuing thereof
11/16/2005EP1595266A1 Quantum point made of electrically conducting carbon, production method, and application
11/16/2005EP1595118A2 Focal plane arrays in type-ii superlattices
11/16/2005EP1594653A2 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
11/16/2005EP1502297B1 Double pullback method of filling an isolation trench
11/16/2005EP1502156B1 Method for producing a unit comprising three-dimensional surface structuring and use of said method
11/16/2005EP1428245A4 Monolithic three-dimensional structures
11/16/2005EP1285312A4 Method of controlling photoresist stripping process and regenerating photoresist stripper composition based on near infrared spectrometer
11/16/2005EP1277116B1 Enhanced programmable core model with integrated graphical debugging functionality
11/16/2005EP1274875B1 Method and apparatus for providing uniform gas delivery to substrates in cvd and pecvd processes
11/16/2005EP1186037B1 Multi-chip module for leads-on-chip (loc) assembly and method for production of the same.
11/16/2005EP1130002B1 Method for producing dielectric porcelain composition for electronic device
11/16/2005EP1129471B1 Thermally annealed silicon wafers having improved intrinsic gettering
11/16/2005EP1121706B1 Integrated power modules for plasma processing systems
11/16/2005EP1108216A4 High resolution analytical probe station
11/16/2005EP1060498B1 A method and apparatus that determines charged particle beam shape codes in lithography systems
11/16/2005EP0984485B1 Wiring forming method for semiconductor device
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