Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/04/2006US7071506 Device for inhibiting hydrogen damage in ferroelectric capacitor devices
07/04/2006US7071504 Thin film transistor device and method of manufacturing the same
07/04/2006US7071503 Semiconductor structure with a switch element and an edge element
07/04/2006US7071500 Semiconductor device and manufacturing method for the same
07/04/2006US7071499 Heterojunction field effect type semiconductor device having high gate turn-on voltage and low on-resistance and its manufacturing method
07/04/2006US7071498 Gallium nitride material devices including an electrode-defining layer and methods of forming the same
07/04/2006US7071488 Active matrix display device and thin film transistor display device
07/04/2006US7071487 Wafer-level package having test terminal
07/04/2006US7071477 Superresolution in microlithography and fluorescence microscopy
07/04/2006US7071476 Illumination system with a plurality of light sources
07/04/2006US7071468 Circuit pattern inspection method and its apparatus
07/04/2006US7071422 Electronic circuit comprising conductive bridges and method for making such bridges
07/04/2006US7071281 Heat resistance; curing; annealing
07/04/2006US7071129 Enhancing adhesion of silicon nitride films to carbon-containing oxide films
07/04/2006US7071128 Plasma CVD method
07/04/2006US7071127 Methods for improving quality of semiconductor oxide composition formed from halogen-containing precursor
07/04/2006US7071126 Densifying a relatively porous material
07/04/2006US7071125 Precursors for film formation
07/04/2006US7071124 Method to reduce PEB sensitivity of resist
07/04/2006US7071123 Fabrication method for organic semiconductor transistor having organic polymeric gate insulating layer
07/04/2006US7071122 Field effect transistor with etched-back gate dielectric
07/04/2006US7071121 Patterned ceramic films and method for producing the same
07/04/2006US7071120 Method for producing water for use in manufacturing semiconductors
07/04/2006US7071119 Method for making a semiconductor device including band-engineered superlattice having 3/1-5/1 germanium layer structure
07/04/2006US7071118 Method and apparatus for fabricating a conformal thin film on a substrate
07/04/2006US7071117 Semiconductor devices and methods for depositing a dielectric film
07/04/2006US7071116 Semiconductor device and method for manufacturing same
07/04/2006US7071115 Use of multiple etching steps to reduce lateral etch undercut
07/04/2006US7071114 efficiency pumping speed of gas flow in vacuum enclosure; etching patterned sidewall; process control; forming semiconductor
07/04/2006US7071113 Process for removal of photoresist mask used for making vias in low K carbon-doped silicon oxide dielectric material, and for removal of etch residues from formation of vias and removal of photoresist mask
07/04/2006US7071112 BARC shaping for improved fabrication of dual damascene integrated circuit features
07/04/2006US7071111 Sealed nitride layer for integrated circuits
07/04/2006US7071110 Process for the plasma etching of materials not containing silicon
07/04/2006US7071109 Methods for fabricating spatial light modulators with hidden comb actuators
07/04/2006US7071108 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
07/04/2006US7071107 Method for manufacturing a semiconductor device
07/04/2006US7071106 Method for CMP removal rate compensation
07/04/2006US7071105 Method of polishing a silicon-containing dielectric
07/04/2006US7071104 Laser alignment target
07/04/2006US7071103 Chemical treatment to retard diffusion in a semiconductor overlayer
07/04/2006US7071102 Method of forming a metal silicide layer on non-planar-topography polysilicon
07/04/2006US7071101 Sacrificial TiN arc layer for increased pad etch throughput
07/04/2006US7071100 Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
07/04/2006US7071099 Forming of local and global wiring for semiconductor product
07/04/2006US7071098 Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
07/04/2006US7071097 Method for improved process latitude by elongated via integration
07/04/2006US7071096 Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition
07/04/2006US7071095 Barrier metal re-distribution process for resistivity reduction
07/04/2006US7071094 Dual layer barrier film techniques to prevent resist poisoning
07/04/2006US7071093 Integrated treatment method for obtaining robust low dielectric constant materials
07/04/2006US7071092 Method of manufacturing antenna proximity lines
07/04/2006US7071091 Method of forming air gaps in a dielectric material using a sacrificial film
07/04/2006US7071090 Semiconductor element having protruded bump electrodes
07/04/2006US7071089 Method of making a semiconductor chip assembly with a carved bumped terminal
07/04/2006US7071088 Method for fabricating bulbous-shaped vias
07/04/2006US7071087 Technique to grow high quality ZnSe epitaxy layer on Si substrate
07/04/2006US7071086 Method of forming a metal gate structure with tuning of work function by silicon incorporation
07/04/2006US7071085 Predefined critical spaces in IC patterning to reduce line end pull back
07/04/2006US7071084 Methods for forming wiring and electrode
07/04/2006US7071083 Method of fabricating polysilicon film by excimer laser crystallization process
07/04/2006US7071082 Silicon crystallization method
07/04/2006US7071081 Method of forming semiconductor device
07/04/2006US7071080 Process for producing silicon on insulator structure having intrinsic gettering by ion implantation
07/04/2006US7071079 Epitaxial wafer and a method for producing it
07/04/2006US7071078 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials
07/04/2006US7071077 Method for preparing a bonding surface of a semiconductor layer of a wafer
07/04/2006US7071076 Method of manufacturing semiconductor device
07/04/2006US7071075 STI forming method for improving STI step uniformity
07/04/2006US7071074 Structure and method for placement, sizing and shaping of dummy structures
07/04/2006US7071073 Process for manufacturing low-cost and high-quality SOI substrates
07/04/2006US7071072 Forming shallow trench isolation without the use of CMP
07/04/2006US7071071 Method of manufacturing semiconductor device
07/04/2006US7071070 Method of fabricating capacitor
07/04/2006US7071069 Shallow amorphizing implant for gettering of deep secondary end of range defects
07/04/2006US7071068 Transistor and method for fabricating the same
07/04/2006US7071067 Fabrication of integrated devices using nitrogen implantation
07/04/2006US7071066 Method and structure for forming high-k gates
07/04/2006US7071065 Strained silicon PMOS having silicon germanium source/drain extensions and method for its fabrication
07/04/2006US7071064 U-gate transistors and methods of fabrication
07/04/2006US7071063 Dual-bit non-volatile memory cell and method of making the same
07/04/2006US7071062 Integrated device with Schottky diode and MOS transistor and related manufacturing process
07/04/2006US7071061 Method for fabricating non-volatile memory
07/04/2006US7071060 EEPROM with split gate source side infection with sidewall spacers
07/04/2006US7071059 Method for forming recess gate of semiconductor device
07/04/2006US7071058 Methods of forming capacitors, and methods of forming DRAM circuitry
07/04/2006US7071057 Methods of fabricating MIM capacitors of semiconductor devices
07/04/2006US7071056 Method of forming a dual-sided capacitor
07/04/2006US7071055 Method of forming a contact structure including a vertical barrier structure and two barrier layers
07/04/2006US7071054 Methods of fabricating MIM capacitors in semiconductor devices
07/04/2006US7071053 Method of forming capacitor with ruthenium top and bottom electrodes by MOCVD
07/04/2006US7071052 Resistor with reduced leakage
07/04/2006US7071051 Method for forming a thin, high quality buffer layer in a field effect transistor and related structure
07/04/2006US7071050 Semiconductor integrated circuit device having single-element type non-volatile memory elements
07/04/2006US7071049 Silicon rich barrier layers for integrated circuit devices
07/04/2006US7071048 Methods of fabricating fin field effect transistors having capping insulation layers
07/04/2006US7071047 Method of forming buried isolation regions in semiconductor substrates and semiconductor devices with buried isolation regions
07/04/2006US7071046 Method of manufacturing a MOS transistor
07/04/2006US7071045 Process of manufacturing thin film transistor
07/04/2006US7071044 Method of making a test structure for gate-body current and direct extraction of physical gate length using conventional CMOS
07/04/2006US7071043 Methods of forming a field effect transistor having source/drain material over insulative material