Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2006
09/19/2006US7108121 Intermediate product transferring apparatus and carrying system having the intermediate product transferring apparatus
09/19/2006US7108009 Semiconductor manufacturing apparatus enabling inspection of mass flow controller maintaining connection thereto
09/19/2006US7108003 First mode is used when cleaning substrates not-resistant to vibration, and the second mode is used when cleaning substrates resistant to vibration
09/19/2006US7108001 Method and apparatus for rotation of a workpiece in supercritical fluid solutions for removing photo resist, residues and particles therefrom
09/19/2006US7107999 Substrate processing apparatus for removing organic matter by removal liquid
09/19/2006US7107929 Ion implantation ion source, system and method
09/19/2006US7107826 Scanning probe device and processing method by scanning probe
09/19/2006US7107701 Substrate drying method and apparatus
09/19/2006US7107674 Method for manufacturing a chip carrier
09/19/2006US7107672 Method of mounting electronic parts on a flexible printed circuit board
09/19/2006CA2243438C Gas pressure adjustable diebonding apparatus and method
09/14/2006WO2006096865A2 Multivariable control system with state feedback
09/14/2006WO2006096818A1 Methods and apparatus for enabling multiple process steps on a single substrate
09/14/2006WO2006096813A2 Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties
09/14/2006WO2006096749A2 Semiconductor device manufacture using a sidewall spacer etchback
09/14/2006WO2006096718A1 Leadframe, coining tool, and method
09/14/2006WO2006096639A2 Semiconductor package fabrication
09/14/2006WO2006096528A2 Stabilized photoresist structure for etching process
09/14/2006WO2006096433A1 Semiconductor component and method of manufacture
09/14/2006WO2006096380A1 Integrated circuit and method for its manufacture
09/14/2006WO2006096267A1 Integrated circuit chip package and method
09/14/2006WO2006096138A1 Integrated mask
09/14/2006WO2006096009A1 High-pressure hydrogen annealing for mosfet
09/14/2006WO2006095915A1 Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure
09/14/2006WO2006095890A1 Semiconductor device and method for manufacturing same
09/14/2006WO2006095817A1 Base material processing apparatus and base material processing method
09/14/2006WO2006095805A1 Electronic circuit and method for manufacturing same
09/14/2006WO2006095791A1 Element substrate, inspecting method, and manufacturing method of semiconductor device
09/14/2006WO2006095772A1 Method of forming zinc oxide layer, zinc oxide layer forming apparatus and zinc oxide layer
09/14/2006WO2006095759A1 Method of forming connection pin, probe, connection pin, probe card, and method of producing probe card
09/14/2006WO2006095752A1 Semiconductor device manufacturing method and substrate treatment device
09/14/2006WO2006095738A1 Ultrasonic cleaning device
09/14/2006WO2006095677A1 Composition having metal particles dispersed therein, and method for flip chip mounting and method for forming bump using the same
09/14/2006WO2006095655A1 Semiconductor integrated circuit
09/14/2006WO2006095643A1 Polishing pad
09/14/2006WO2006095642A1 Process for target production
09/14/2006WO2006095605A1 Light source unit for alignment, alignment apparatus, exposure apparatus, digital exposure apparatus, alignment method, exposure method and method for setting lighting apparatus condition
09/14/2006WO2006095602A1 Mounting body and method for manufacturing same
09/14/2006WO2006095591A1 Polishing pad and process for producing the same
09/14/2006WO2006095581A1 Semiconductor device
09/14/2006WO2006095577A1 Metal material and its manufacturing method, thin-film device and its manufacturing method, element-side substrate and its manufacturing method, and liquid crystal display and its manufacturing method
09/14/2006WO2006095575A1 Plasma treatment apparatus and semiconductor thin film manufacturing method using same
09/14/2006WO2006095569A1 Load port and load port control method
09/14/2006WO2006095560A1 Method of substrate treatment, recording medium and substrate treating apparatus
09/14/2006WO2006095540A1 Positive resist composition and method for forming resist pattern
09/14/2006WO2006095425A1 Nonvolatile semiconductor storage and method for manufacturing same
09/14/2006WO2006095399A1 Photolithography method
09/14/2006WO2006095383A1 Semiconductor device having p-channel impurity region and method for manufacturing same
09/14/2006WO2006094989A1 Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder
09/14/2006WO2006094980A2 Photovoltaic cell containing a semiconductor photovoltaically active material
09/14/2006WO2006094870A1 Method and device for treating wafers on assembly carriers
09/14/2006WO2006094769A2 Method for designing an integrated circuit
09/14/2006WO2006094692A1 Differential pressure sensor array and associated differential pressure sensor
09/14/2006WO2006094574A1 Method for producing a nanostructure on a substrate
09/14/2006WO2006094495A1 Production of a carrier wafer contact in soi trench insulated integrated circuits provided with a high-voltage components
09/14/2006WO2006094408A1 Quantum dot template for fast and simultaneous detection of different infectious agents
09/14/2006WO2006081285A3 Electroprocessing profile control
09/14/2006WO2006081104A3 Semiconductor wafer boat for a vertical furnace
09/14/2006WO2006078071A3 Manufacturing method for semiconductor chips, and semiconductor chip
09/14/2006WO2006060520A3 Membrane-limited selective electroplating of a conductive surface
09/14/2006WO2006060300A3 Method for forming low defect density alloy layers and structure containing such layers
09/14/2006WO2006057645A9 Enhancement of electron and hole mobilities in 110 under biaxial compressive strain
09/14/2006WO2006051993A3 Amorphous oxide and field effect transistor
09/14/2006WO2006050403A3 Gallium nitride/silicon based monolithic microwave integrated circuit
09/14/2006WO2006049892A3 Metal ion-containing cmp composition and method for using the same
09/14/2006WO2006039438B1 Split thin film capacitor for multiple voltages
09/14/2006WO2006025593A3 Growth of nitride semiconductor crystals
09/14/2006WO2006019460A3 Method of assembling a semiconductor component and apparatus therefor
09/14/2006WO2006012174A3 System and method of cleaning and etching a substrate
09/14/2006WO2006011791A3 Method for encapsulating an electronic component using a plastic object, and plastic object
09/14/2006WO2005124858A3 Package and method for packaging an integrated circuit die
09/14/2006WO2005122254A3 Gate stack and gate stack etch sequence for metal gate integration
09/14/2006WO2005119757A3 Packaged integrated circuit devices
09/14/2006WO2005103333A3 Wafer heater assembly
09/14/2006WO2005100976A3 System and method for the identification of chemical mechanical planarization defects
09/14/2006WO2005099388A3 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive
09/14/2006WO2005067412A3 Methods for fabrication of localized membranes on single crystal substrate surfaces
09/14/2006WO2004095522A3 Deep n wells in triple well structures and method for fabricating same
09/14/2006WO2004042795A3 Method of preparing whole semiconductor wafer for analysis
09/14/2006WO2003015129A3 Low-k dielectric thin films and chemical vapor deposition method of making same
09/14/2006US20060206853 Method of producing mask inspection data, method of manufacturing a photo mask and method of manufacturing a semiconductor device
09/14/2006US20060206491 Mask recovering system and mask recovering method
09/14/2006US20060206237 Anti-vibration technique
09/14/2006US20060206229 Substrate processing system managing apparatus information of substrate processing apparatus
09/14/2006US20060205622 For selectively removing photoresist residues from a microstructure
09/14/2006US20060205325 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/14/2006US20060205323 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
09/14/2006US20060205240 Fusing nanowires using in situ crystal growth
09/14/2006US20060205239 Laser treatment apparatus
09/14/2006US20060205238 Silicon-containing structure with deep etched features, and method of manufacture
09/14/2006US20060205237 Preparation of semiconductor device
09/14/2006US20060205236 Intermediate semiconductor device structures using photopatternable, dielectric materials
09/14/2006US20060205235 Semiconductor device and fabrication method thereof
09/14/2006US20060205234 Forming a barrier layer in interconnect joints and structures formed thereby
09/14/2006US20060205233 Method for manufacturing a semiconductor device
09/14/2006US20060205232 Film treatment method preventing blocked etch of low-K dielectrics
09/14/2006US20060205231 Film formation method and apparatus for semiconductor process
09/14/2006US20060205230 Surface preparation prior to deposition
09/14/2006US20060205229 Nitride semiconductor device and a manufacturing method therefor
09/14/2006US20060205228 Atomic layer deposition methods