Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2006
09/14/2006US20060202247 SRAM cell structure and manufacturing method thereof
09/14/2006US20060202241 D/A converter circuit, semiconductor device incorporating the D/A converter circuit, and manufacturing method of them
09/14/2006US20060202239 Methods for providing gate conductors on semiconductors and semiconductors formed thereby
09/14/2006US20060202238 Lateral junction field effect transistor and method of manufacturing the same
09/14/2006US20060202237 Metal gate semiconductor device and manufacturing method
09/14/2006US20060202229 Semiconductor device and method of manufacturing such a device
09/14/2006US20060202223 Increased light extraction from a nitride led
09/14/2006US20060202217 Nitride semiconductor light emitting device and method of manufacturing the same
09/14/2006US20060202213 Device mounting substrate and image display device
09/14/2006US20060202210 LED mounting having increased heat dissipation
09/14/2006US20060202204 Thin film transistor, thin film transistor panel, and method of manufacturing the same
09/14/2006US20060202203 Structure of TFT electrode for preventing metal layer diffusion and manufacturing method therefor
09/14/2006US20060202201 Wafer-level package having test terminal
09/14/2006US20060202200 Organic thin film transistor array panel and manufacturing method thereof
09/14/2006US20060202131 Forming a semiconductor device feature using acquired parameters
09/14/2006US20060202119 Semiconductor device tester
09/14/2006US20060201997 Fine pad pitch organic circuit board with plating solder and method for fabricating the same
09/14/2006US20060201927 Heating device for heating semiconductor wafers in thermal processing chambers
09/14/2006US20060201913 Methods and compositions for removing Group VIII metal-containing materials from surfaces
09/14/2006US20060201911 Methods of etching photoresist on substrates
09/14/2006US20060201907 etching to form a plurality of electrically conductive islands in a working layer of a multilayer structure made from semiconductor materials; selectively masking certain regions to define several islands therein; use in microelectronics, optics and optoelectronics
09/14/2006US20060201847 Protective shipper
09/14/2006US20060201540 Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
09/14/2006US20060201535 Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
09/14/2006US20060201533 Cvd apparatus and method for cleaning cvd apparatus
09/14/2006US20060201427 CVD coating device
09/14/2006US20060201422 Workpiece Holder for Semiconductor Manufacturing Apparatus
09/14/2006US20060201414 Low temperature load and bake
09/14/2006US20060201413 Method for producing silicon epitaxial wafer and silicon epitaxial wafer
09/14/2006US20060201375 Transfer system and semiconductor manufacturing system
09/14/2006US20060201363 Method of processing substrate and substrate processing apparatus
09/14/2006US20060200985 Underfill method
09/14/2006US20060200958 Method of manufacture of ceramic composite wiring structures for semiconductor devices
09/14/2006DE4324325B4 Verfahren zur Herstellung eines Bauelementes, optisches Bauelement, Verwendung desselben und Vakuumbehandlungsanlage zu seiner Herstellung A method for producing a component, an optical component, using the same and vacuum treatment plant for its production
09/14/2006DE4321590B4 Dünnschicht-Transistor und Verfahren zu seiner Herstellung Thin-film transistor and method for its preparation
09/14/2006DE19602436B4 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens Method for mounting a frame on a carrier material and apparatus for carrying out the method
09/14/2006DE112004002180T5 Ein Bauelement und ein Verfahren zum Ausbilden von ferroelektrischen Kondensatorbauelementen und FeRAM-Bauelementen A device and a method for forming ferroelectric capacitor devices and FeRAM devices
09/14/2006DE112004002156T5 Verfahren zum Verhindern der Vergrößerung einer Kontaktlochbreite während der Kontaktherstellung A method for preventing the enlargement of a contact hole width during contact Preparation
09/14/2006DE112004001001T5 Optische Messung von auf Halbleiterwafern gebildeten Strukturen unter Verwendung von Maschinenlernsystemen Optical measurement of formed on semiconductor wafers structures using machine learning systems
09/14/2006DE10354717B4 TEOS-unterstütztes Oxid-CMP-Verfahren TEOS-supported oxide CMP process
09/14/2006DE10338017B4 Verfahren zum Füllen eines Kontaktdurchgangs einer Bitleitung A method for filling a contact via a bit line
09/14/2006DE10334434B4 Verfahren und Gerät zum Reinigen eines Halbleitersubstrats Method and apparatus for cleaning a semiconductor substrate
09/14/2006DE10308968B4 Verfahren zur Herstellung einer leitenden Barrierenschicht mit verbesserter Bedeckung innerhalb kritischer Öffnungen A method for producing a conductive barrier layer with an improved cover within critical openings
09/14/2006DE10244862B4 Verfahren zur Herstellung eines elektronischen Bauelements mit einer Praseodymoxid-Schicht A process for producing an electronic component with a praseodymium oxide layer
09/14/2006DE10208249B4 Halbleiterspeicher mit vertikalem Auswahltransistor A semiconductor memory with a vertical selection transistor
09/14/2006DE102006010766A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine
09/14/2006DE102006010761A1 Halbleitermodul Semiconductor module
09/14/2006DE102005063112A1 Verfahren zur Herstellung eines Hochspannungs-Transistors A process for producing a high-voltage transistor
09/14/2006DE102005052133A1 Verfahren zur Herstellung eines Flash-Speicherbauelements A method for producing a flash memory device
09/14/2006DE102005047413A1 Magnetoresistives Sensorelement und Konzept zum Herstellen und Testen desselben The magnetoresistive sensor element and concept for making and testing the same
09/14/2006DE102005030445A1 Verfahren zur Herstellung eines Flash-Speicherbauelements A method for producing a flash memory device
09/14/2006DE102005010944A1 Verfahren zur Herstellung eines Trägerscheibenkontaktes in grabenisolierten integrierten SOI Schaltungen mit Hochspannungsbauelementen Process for the preparation of a carrier disc contact in grave isolated SOI integrated circuits with high voltage components
09/14/2006DE102005010821A1 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device
09/14/2006DE102005010311A1 Verfahren und Gießform zur Herstellung eines optischen Halbleitermoduls A method and mold for producing an optical semiconductor module
09/14/2006DE102005010308A1 Making solderable connections on the back of semiconductor arrangements involves photolithographic structuring of etching mask on active side of chips situated in wafer composite so that windows beside contact pads are formed
09/14/2006DE102005010272A1 Halbleiterbauelement sowie Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
09/14/2006DE102005008476A1 Leitbahnanordnung sowie zugehörige Herstellungsverfahren Interconnect arrangement and associated manufacturing processes
09/14/2006DE102005007821A1 Wafer e.g. silicone on insulator semiconductor wafer, retaining device, has sub-carrier formed such that it forms adapter wafer, which has concentrically arranged retaining blocks for topographical positioning of wafer to be processed
09/14/2006DE102004050370B9 Schichtdickenmessgerät und Verfahren zur Bestimmung der Schichtdicke einer Linerschicht Coating thickness gauge and method for determining the thickness of a liner
09/14/2006DE10131492B4 Verfahren zum Herstellen einer Halbleiterspeichervorrichtung A method of manufacturing a semiconductor memory device
09/14/2006DE10019601B4 Layer composite material for sliding elements and for plain bearings, particularly crankshaft bearing, camshaft bearings or connecting rod bearings, comprises primary layer made from copper alloy or aluminum alloy
09/14/2006CA2601003A1 Quantum dot template for fast and simultaneous detection of different infectious agents
09/14/2006CA2599412A1 Photovoltaic cell containing a semiconductor photovoltaically active material
09/13/2006EP1701386A1 Method for intergration of two bilopar transistors on an semiconductor substrate, semiconductor structure in an semiconductor body and an cascod circuit
09/13/2006EP1701380A2 Semiconductor power module
09/13/2006EP1701379A2 Semiconductor device and manufacturing method of the same
09/13/2006EP1701378A2 Method of assembling substrate transfer device and a substrate transfer system unit
09/13/2006EP1701377A2 Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusion
09/13/2006EP1701356A1 Memory cell and memory device
09/13/2006EP1701215A2 Coating and developing system
09/13/2006EP1701206A1 Pixel structure, active matrix substrate, method of manufacturing active matrix substrate, electro-optical device, and electronic apparatus
09/13/2006EP1701194A1 Projection optical system and exposure apparatus with the same
09/13/2006EP1700896A1 Hot melt adhesive composition
09/13/2006EP1700893A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
09/13/2006EP1700346A1 Semiconductor device comprising a pn-heterojunction
09/13/2006EP1700345A2 Gate insulating film comprising silicon and oxygen
09/13/2006EP1700343A1 Method for producing electronic chips consisting of thinned silicon
09/13/2006EP1700342A2 Non-volatile ferroelectric memory device and manufacturing method
09/13/2006EP1700341A1 Wafer with optical control modules in ic fields
09/13/2006EP1700340A1 Wafer with optical control modules in dicing paths
09/13/2006EP1700339A2 Integrated circuit memory cells and methods of forming
09/13/2006EP1700338A1 Methods for integrating replacement metal gate structures
09/13/2006EP1700337A2 Process for packaging components and packaged components
09/13/2006EP1700336A1 Semiconductor device comprising a heterojunction
09/13/2006EP1700335A1 Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source
09/13/2006EP1700334A1 Electrostatic chuck and chuck base having cooling path for cooling wafer
09/13/2006EP1700333A1 Method and apparatus for seasoning semiconductor apparatus of sensing plasma equipment
09/13/2006EP1700332A1 Container capacitors and method of forming
09/13/2006EP1700331A1 Method for patterning a ferroelectric polymer layer
09/13/2006EP1700330A2 A method of forming a silicon oxynitride layer
09/13/2006EP1700329A2 Fabricating a set of semiconducting nanowires, and electric device comprising a set of nanowires
09/13/2006EP1700108A1 Surface acoustic wave sensor assemblies
09/13/2006EP1700002A2 High temperature environment tool system and method
09/13/2006EP1699951A2 Method of producing self-supporting substrates comprising iii-nitrides by means of heteroepitaxy on a sacrificial layer
09/13/2006EP1699946A2 Method of improving post-develop photoresist profile on a deposited dielectric film
09/13/2006EP1699945A1 Cvd tantalum compounds for fet gate electrodes
09/13/2006EP1699742A2 High strain point glasses
09/13/2006EP1699596A1 Chemical mechanical polishing method for reducing slurry reflux
09/13/2006EP1699571A1 Water-based cleaning
09/13/2006EP1668686A4 Reversible leadless package and methods of making and using same