| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/04/2007 | US20070000428 Laser irradiation apparatus |
| 01/04/2007 | US20070000125 Component mounting device and component mounting method |
| 01/04/2007 | US20070000109 Chamber inserts and apparatuses for processing a substrate |
| 01/04/2007 | DE4421077B4 Halbleitergehäuse und Verfahren zu dessen Herstellung Semiconductor package and method for its production |
| 01/04/2007 | DE4417289B4 Leistungsunabhängige, statische Speicher Independent power, static memory |
| 01/04/2007 | DE212005000023U1 Mobiles PVD/CVD-Beschichtungszentrum Mobile PVD / CVD coating center |
| 01/04/2007 | DE202006015531U1 Wafer testing card contains wafer testing interface wth conductive sprung matrix coupled to wide side of card forming base plate, for testing electric properties of wafers |
| 01/04/2007 | DE112005000487T5 Verfahren zur Herstellung eines Kondensators und ein monolithisch integrierter Schaltkreis, der einen solchen Kondensator umfasst A method for manufacturing a capacitor, and a monolithically integrated circuit comprising such a capacitor |
| 01/04/2007 | DE112005000226T5 Metalltransistor Bauteil Metal transistor device |
| 01/04/2007 | DE112004002633T5 Schmalkörper-Damaszener-Tri-Gate-FinFET mit gedünntem Körper Narrow-body damascene tri-gate FinFET with gedünntem body |
| 01/04/2007 | DE112004002013T5 Paste für die Bildung einer Verknüpfung und die Verknüpfung gebildet aus der Paste Paste formed for the formation of a link and the link from the paste |
| 01/04/2007 | DE10345460B4 Verfahren zur Herstellung eines Lochgraben-Speicherkondensators in einem Halbleitersubstrat A method for producing a hole-trench storage capacitor in a semiconductor substrate, |
| 01/04/2007 | DE10261466B4 Verfahren zur Herstellung einer leitenden Barrierenschicht mit verbesserten Haft- und Widerstandseigenschaften A method for producing a conductive barrier layer with improved adhesion and resistance properties |
| 01/04/2007 | DE10253938B4 Verfahren zur gleichzeitigen Herstellung einer Bonding-Pad-Struktur und eines Stapelkondensators in einer Halbleitervorrichtung Process for the simultaneous production of a bonding pad structure and a stacked capacitor in a semiconductor device |
| 01/04/2007 | DE10250888B4 Halbleiterelement mit verbesserten Dotierprofilen und ein Verfahren zur Herstellung der Dotierprofile eines Halbleiterelements Semiconductor element with improved doping profiles and a method for producing the doping profiles of a semiconductor element |
| 01/04/2007 | DE10235000B4 Verfahren zur Bildung einer Kanalzone eines Transistors und NMOS-Transistor A method of forming a channel region of a transistor and NMOS transistor |
| 01/04/2007 | DE10234956B4 Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie A method for controlling the chemical mechanical polishing of stacked layers with a surface topology |
| 01/04/2007 | DE10213296B4 Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens Electronic component having a semiconductor chip, a process for its preparation and process for the preparation of a benefit |
| 01/04/2007 | DE10202311B4 Vorrichtung und Verfahren zur Plasmabehandlung von dielektrischen Körpern Apparatus and method for plasma treatment of dielectric bodies |
| 01/04/2007 | DE102006018644A1 Halbleiterwafer und Bearbeitungsverfahren für denselben A semiconductor wafer processing method and for the same |
| 01/04/2007 | DE102005055488A1 Electronic structure and production process use lead-free solder columns comprising two materials for interconnections with the core material having the lower melting temperature |
| 01/04/2007 | DE102005040883B3 Pitch periods partitioning method for e.g. semiconductor memory, involves applying complementary layer to fill free spaces, forming even surface on upper side of spacers and complementary layer, and removing spacers or complementary layer |
| 01/04/2007 | DE102005030946A1 Semiconductor component for manufacturing switching power supply, has connecting unit with base ball and balls of solder stacked on base ball, where balls of solder have soldering material and electrical connected with contact pin surface |
| 01/04/2007 | DE102005030875A1 Halbleiterprodukt und Verfahren zur Herstellung eines Halbleiterprodukts Semiconductor product and process for producing a semiconductor product |
| 01/04/2007 | DE102005030588A1 Technik zum Reduzieren des Ätzschadens während der Herstellung von Kontaktdurchführungen und Gräben in Zwischenschichtdielektrika Technique for reducing the Ätzschadens during the production of vias and trenches in interlayer |
| 01/04/2007 | DE102005030585A1 Halbleiterbauelement mit einem vertikalen Entkopplungskondensator A semiconductor device with a vertical decoupling capacitor |
| 01/04/2007 | DE102005030583A1 Technik zur Herstellung von Kontaktisolationsschichten und Silizidgebieten mit unterschiedlichen Eigenschaften Technology for the production of insulating layers and silicide contact with different properties |
| 01/04/2007 | DE102005030466A1 Semiconductor wafer with wiring structure for use in e.g. power diode, has coating material with self-supporting, stable-shaped carrier layer and containing ternary carbide, ternary nitride and carbon to cover wiring structure |
| 01/04/2007 | DE102005030465A1 Semiconductor stack for use as data processing optical semiconductor component, has semiconductor components stacked on each other with laminar wiring structure on coplanar surface in active upper side of semiconductor chip |
| 01/04/2007 | DE102005028837A1 Feldeffekttransistor und Verfahren zur Herstellung eines Feldeffekttransistors Field effect transistor and method of manufacturing a field effect transistor |
| 01/04/2007 | DE102005026176B3 Verfahren zur flächigen Kontaktierung von Halbleiterbauelementen mit reduzierter Durchbiegung sowie entsprechendes Halbleiterbauelement und Herstellungsvorrichtung Method for planar bonding of semiconductor devices with reduced deflection and corresponding semiconductor device and manufacturing apparatus |
| 01/04/2007 | DE102005026098B3 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung derselben Benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and method of making same |
| 01/04/2007 | DE102005014596B3 Surface inspection device for semiconductor wafer, has evaluation circuit that assigns signals of light receiving mechanism to appropriate partial surfaces as function of scanning operation of optical sensing system |
| 01/04/2007 | DE102005006121A1 Vertikalthyristor zum ESD-Schutz und Verfahren zur Herstellung eines Vertikalthyristor zum ESD-Schutz Vertikalthyristor for ESD protection and process for producing a Vertikalthyristor for ESD protection |
| 01/04/2007 | DE102004057809B4 Verfahren zur Herstellung von Seitenwandabstandselementen Process for the preparation of sidewall spacers |
| 01/04/2007 | DE102004051842B4 Bemassung eines ausgedehnten Defekts Dimensioning of an extended defect |
| 01/04/2007 | DE102004045768B4 Verfahren zur Herstellung eines Randabschlusses eines Halbleiterbauelements A process for the preparation of a edge termination of a semiconductor device |
| 01/04/2007 | DE102004022800B4 MOSFET-Gate-Treiberschaltung MOSFET gate driver circuit |
| 01/04/2007 | DE102004013926B4 Trenchspeicherstruktur und Verfahren zum Ausbilden eines selbstjustierenden Buried-Strap-Kontakts unter Verwendung von dotiertem HDP-Oxid Trench memory structure and method for forming a self-aligned buried strap contact using doped HDP oxide |
| 01/04/2007 | DE102004009567B4 Verdrahtungsträger zur Aufnahme von Chips Wiring carrier to hold chips |
| 01/04/2007 | DE10164884B4 Semiconductor device e.g., dynamic random access memory device, includes silicon oxide spacers on sides of conductor structures, and silicon nitride spacers on partially exposed upper side portions of conductor structures |
| 01/04/2007 | DE10139111B4 Verfahren für das Verbinden eines leitfähigen Klebers und einer Elektrode sowie einer verbundenen Struktur A method of bonding a conductive adhesive and an electrode as well as a connected structure |
| 01/04/2007 | CA2612213A1 Semiconductor device including shallow trench isolation (sti) regions with a superlattice therebetween and associated methods |
| 01/03/2007 | EP1740026A2 Foreign matter removing apparatus |
| 01/03/2007 | EP1739760A2 Gallium nitride signal crystal substrate and method of producing the same |
| 01/03/2007 | EP1739759A2 Gallium nitride single crystal substrate and method of producing the same |
| 01/03/2007 | EP1739754A2 Semiconductor device and method for fabricating the same |
| 01/03/2007 | EP1739753A1 Process for producing schottky junction type semiconductor device |
| 01/03/2007 | EP1739750A2 Semiconductor device and writing method for semiconductor device |
| 01/03/2007 | EP1739749A2 Memory cell with an isolated-body MOS transistor with prolongated memory effect |
| 01/03/2007 | EP1739739A1 Through wiring board and method for producing the same |
| 01/03/2007 | EP1739738A2 Memory cell with an isolated-body MOS transistor with reinforced memory effect |
| 01/03/2007 | EP1739737A1 Methods of manufacturing air dielectric structures |
| 01/03/2007 | EP1739736A1 Method of manufacturing a semiconductor device |
| 01/03/2007 | EP1739735A1 Container and method of transporting substrates using the same |
| 01/03/2007 | EP1739734A2 Wafer handling system |
| 01/03/2007 | EP1739733A2 Method of producing wire-connection structure, and wire-connection structure |
| 01/03/2007 | EP1739732A1 Method and apparatus for forming oxynitride film and nitride film, oxynitride film, nitride film and base material |
| 01/03/2007 | EP1739731A1 Process for producing group iii nitride substrate |
| 01/03/2007 | EP1739730A1 Substrate cleaning method, substrate cleaning equipment, computer program and program recording medium |
| 01/03/2007 | EP1739729A1 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| 01/03/2007 | EP1739728A1 Method of three-dimensional microfabrication and high-density three-dimensional fine structure |
| 01/03/2007 | EP1739727A2 Composite structure comprising a silicon carbide layer and method of making it |
| 01/03/2007 | EP1739726A1 Bipolar semiconductor device and process for producing the same |
| 01/03/2007 | EP1739718A1 Chamber isolation valve RF grounding |
| 01/03/2007 | EP1739517A2 Semiconductor integrated circuit device |
| 01/03/2007 | EP1739493A1 Metrology apparatus for lithography |
| 01/03/2007 | EP1739492A2 Lithographic apparatus and device manufacturing method |
| 01/03/2007 | EP1739487A1 Bilayer laminated film for bump formation and method of bump formation |
| 01/03/2007 | EP1739485A1 Resist composition |
| 01/03/2007 | EP1739483A2 Positive photosensitive composition and pattern forming method using the same |
| 01/03/2007 | EP1739481A1 Levenson type phase shift mask and production method therefor |
| 01/03/2007 | EP1739475A2 Partition-wall structure for forming a conductive pattern by ink jet printing |
| 01/03/2007 | EP1738871A1 Polishing apparatus |
| 01/03/2007 | EP1738870A1 Polisher |
| 01/03/2007 | EP1738622A1 Circuit board panel with a plurality of circuit carriers, circuit carrier and method for individually separating circuit carriers belonging to a circuit board panel |
| 01/03/2007 | EP1738431A2 Embedded capacitors using conductor filled vias |
| 01/03/2007 | EP1738421A1 Layered resistance variable memory device and method of fabrication |
| 01/03/2007 | EP1738419A1 Production method of compound semiconductor light-emitting device wafer |
| 01/03/2007 | EP1738410A1 Method for fabricating strained silicon-on-insulator structures and strained silicon-on -insulator structures formed thereby |
| 01/03/2007 | EP1738409A1 Laser processing apparatus |
| 01/03/2007 | EP1738408A1 Formation of an interconnect structure by decomposing a photosensitive dielectric layer |
| 01/03/2007 | EP1738407A2 Arrayed ultrasonic transducer |
| 01/03/2007 | EP1738406A1 Method for production of photosensitised thin layer semiconductors |
| 01/03/2007 | EP1738405A1 Field effect transistor and method of manufacturing a field effect transistor |
| 01/03/2007 | EP1738404A2 Method for structuring at least one layer and electric component with structures from said layer |
| 01/03/2007 | EP1738403A1 Methods of forming trench isolation regions |
| 01/03/2007 | EP1738402A1 Laser doping of solid bodies using a linear-focussed laser beam and production of solar-cell emitters based on said method |
| 01/03/2007 | EP1738401A2 Method for machining a workpiece on a workpiece support |
| 01/03/2007 | EP1738394A2 Method for reciprocating a workpiece through an ion beam |
| 01/03/2007 | EP1738393A2 Drive sytem for scanning a workpiece through an ion beam |
| 01/03/2007 | EP1738172A1 Method for functionalizing biosensor chips |
| 01/03/2007 | EP1738100A2 Non-contact thermal platforms |
| 01/03/2007 | EP1738001A2 In situ doped epitaxial films |
| 01/03/2007 | EP1737998A2 Remote chamber methods for removing surface deposits |
| 01/03/2007 | EP1737793A1 Composition for chemo-mechanical polishing (cmp) |
| 01/03/2007 | EP1737763A2 Substrate container with fluid-sealing flow passageway |
| 01/03/2007 | EP1737762A2 Wafer container with sealable door |
| 01/03/2007 | EP1737761A2 Wafer container door with particulate collecting structure |
| 01/03/2007 | EP1737670A1 Device with gates configured in loop structures |