Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2008
04/10/2008US20080085551 Multicompartment apparatus for use in qualitative typing of blood; diagnostic medicine
04/10/2008US20080085477 Method and apparatus for processing a wafer
04/10/2008US20080085473 lithographic photoresist; deep UV, x-ray, electon beam: alpha-cyano- or an alpha-trifluoro methacrylate monomer and a vinyl ether monomer; 157 nm.
04/10/2008US20080085457 Exposure mask and method of manufacturing a film pattern
04/10/2008US20080085409 Heat-resistant dicing tape or sheet
04/10/2008US20080085377 Plasma treatment apparatus and method for plasma treatment
04/10/2008US20080085173 Linear semiconductor processing facilities
04/10/2008US20080085120 Optical transceiver integratable with silicon vlsi
04/10/2008US20080084808 Submount, semiconductor laser device, manufacturing method therefor, hologram laser device and optical pickup device
04/10/2008US20080084762 Method of identifying logical information in a programming and erasing cell by on-side reading scheme
04/10/2008US20080084745 Dual-gate device and method
04/10/2008US20080084744 Method of making and operating a semiconductor memory array of floating gate memory cells with program/erase and select gates
04/10/2008US20080084728 Semiconductor device
04/10/2008US20080084726 Semiconductor integrated circuit device and method for designing the same
04/10/2008US20080084650 Apparatus and method for substrate clamping in a plasma chamber
04/10/2008US20080084603 Display substrate and method of manufacturing the same
04/10/2008US20080084567 System for Scatterometric Measurements and Applications
04/10/2008US20080084563 Polarization evaluation mask, polarization evaluation method, and polarization determination device
04/10/2008US20080084514 Liquid crystal display and method of fabricating the same
04/10/2008US20080084226 Operation voltage supply apparatus and operation voltage supply method for semiconductor device
04/10/2008US20080084122 Moving apparatus, exposure apparatus, and device manufacturing method
04/10/2008US20080084016 Support jig for a chip product
04/10/2008US20080083996 Semiconductor device and an information management system therefor
04/10/2008US20080083993 Gold-Tin Solder Joints Having Reduced Embrittlement
04/10/2008US20080083992 Novel bonding and probing pad structures
04/10/2008US20080083990 Semiconductor device and method of manufacturing the same
04/10/2008US20080083989 Semiconductor Device and Method for Fabricating the Same
04/10/2008US20080083988 Top layers of metal for high performance IC's
04/10/2008US20080083987 Top layers of metal for high performance IC's
04/10/2008US20080083985 Low fabrication cost, fine pitch and high reliability solder bump
04/10/2008US20080083983 Bump electrode including plating layers and method of fabricating the same
04/10/2008US20080083981 Thermally Enhanced BGA Packages and Methods
04/10/2008US20080083980 Cmos image sensor chip scale package with die receiving through-hole and method of the same
04/10/2008US20080083977 Edge connect wafer level stacking
04/10/2008US20080083976 Edge connect wafer level stacking
04/10/2008US20080083975 Stacked structures and methods of fabricating stacked structures
04/10/2008US20080083973 Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these
04/10/2008US20080083970 Method and materials for growing III-nitride semiconductor compounds containing aluminum
04/10/2008US20080083968 Bipolar Transistor And Method Of Manufacturing The Same
04/10/2008US20080083965 Wafer level chip scale package of image sensor and manufacturing method thereof
04/10/2008US20080083964 Semiconductor image sensor die and production method thereof, semiconductor image sensor module, image sensor device, optical device element, and optical device module
04/10/2008US20080083962 Force input control device and method of fabrication
04/10/2008US20080083961 Semiconductor microphone unit
04/10/2008US20080083960 Package structure and packaging method of mems microphone
04/10/2008US20080083956 Semiconductor device and manufacturing method thereof
04/10/2008US20080083954 Semiconductor device and manufacturing method thereof
04/10/2008US20080083953 Method of manufacturing a semiconductor device
04/10/2008US20080083952 Semiconductor structures including multiple crystallographic orientations and methods for fabrication thereof
04/10/2008US20080083950 Fused nanocrystal thin film semiconductor and method
04/10/2008US20080083948 SiGe selective growth without a hard mask
04/10/2008US20080083947 Semiconductor device and method of fabricating the same
04/10/2008US20080083946 Memory cell system with charge trap
04/10/2008US20080083945 Semiconductor memory array of floating gate memory cells with program/erase and select gates
04/10/2008US20080083944 Nand-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the same
04/10/2008US20080083943 Dual-gate memory device and optimization of electrical interaction between front and back gates to enable scaling
04/10/2008US20080083938 Image sensors and methods of fabricating image sensors
04/10/2008US20080083933 Semiconductor device and method for fabricating the same
04/10/2008US20080083928 Crystallization apparatus and method, manufacturing method of electronic device, electronic device, and optical modulation element
04/10/2008US20080083927 Display device and method of manufacturing the same
04/10/2008US20080083926 Printing device structures using nanoparticles
04/10/2008US20080083924 Thin film transistor having chalcogenide layer and method of fabricating the thin film transistor
04/10/2008US20080083916 Nonvolatile Memory Device and Fabrication Method Thereof
04/10/2008US20080083840 Edge remover having a gas sprayer to prevent a chemical solvent from splashing
04/10/2008US20080083736 Method of tuning thermal conductivity of electrostatic chuck support assembly
04/10/2008US20080083703 Method of plasma processing
04/10/2008US20080083625 forming a pattern for a copper line on a substrate, then forming a barrier metal layer on the pattern, removing oxide layers formed on the barrier layer and depositing copper ions on the barrier metal layer by plating in electrolytic cells
04/10/2008US20080083502 De-fluoridation process
04/10/2008US20080083437 Method and apparatus for wafer cleaning
04/10/2008US20080083436 Method and apparatus for wafer cleaning
04/10/2008US20080083425 Method for Non-Contact Cleaning of a Surface
04/10/2008DE4448052B4 Mask for projecting structure onto semiconductor wafer - has steps which correspond to step structure on semiconductor wafer, e.g. formed using transparent layer structure
04/10/2008DE202006020339U1 Vorrichtung zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben An apparatus for cleaning of objects, in particular thin slices
04/10/2008DE19964317B4 Carrier for wafers or magnetic disks of high functional density, used during manufacture and transport
04/10/2008DE19937742B4 Übertragung eines Musters hoher Strukturdichte durch multiple Belichtung weniger dichter Teilmuster Transferring a pattern of high structural density by multiple exposure less dense partial pattern
04/10/2008DE19928570B4 Verfahren zur Herstellung von Halbleitervorrichtungen A process for the manufacture of semiconductor devices
04/10/2008DE19548845B4 Vorrichtung und Verfahren zum Ziehen von Einkristallen nach dem Czochralski-Verfahren Apparatus and method for pulling single crystals by the Czochralski method
04/10/2008DE112006000241T5 Graben-Gateelektrode für FinFET-Anordnung Trench gate electrode for FinFET arrangement
04/10/2008DE112005003338T5 Niederdruck-Entfernung von Photoresist und Ätzresten A low-pressure removal of photoresist and etching residues
04/10/2008DE10360708B4 Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben Semiconductor module with a semiconductor stack, rewiring, and methods of making the same
04/10/2008DE10260610B4 Vorrichtung und Verfahren zum Ausbilden von Mustern Apparatus and method for forming patterns
04/10/2008DE102007048216A1 Semiconductor device manufacturing method for making semiconductor device e.g. memory module such as dynamic random access memory (DRAM), involves performing etching processes to form deep trench structure and selectively corrode mask layer
04/10/2008DE102007048181A1 Function plate for semiconductor testing device, has sockets fastened to back surface of substrate and to tested devices, and adiabatic covering part fastened to back surface of region of substrate, in which sockets are fastened
04/10/2008DE102007047231A1 Siliziumkarbid-Halbleiterbauelement und Verfahren zu dessen Herstellung Silicon carbide semiconductor device and process for its preparation
04/10/2008DE102007046042A1 Elektrische Prüfsonde und elektrische Prüfsondenanordnung Electrical test probe and electrical Prüfsondenanordnung
04/10/2008DE102007045036A1 Semiconductor component, has protective layer covering transistor, and insulation layer arranged on protective layer and another insulation layer of area, where semiconductor structure is arranged on former insulation layer
04/10/2008DE102007041033A1 Substratverarbeitende Vorrichtung mit einer Puffermechanik und einer Substrattransfervorrichtung Substrate processing apparatus having a buffering mechanism and a substrate transfer apparatus
04/10/2008DE102007030812A1 Metallische Leitung in Halbleitervorrichtung und Verfahren zum Bilden derselben Metallic lead in the semiconductor device and method of forming same
04/10/2008DE102007017604A1 Lamp bunch, lamp strip using the lamp bunch and its method of making
04/10/2008DE102006050889A1 Waferbelichtungseinrichtung und Verfahren Wafer exposure device and method
04/10/2008DE102006048392A1 Verfahren zur Herstellung eines Halbleiterspeicherbauelementes und Halbleiterspeicherbauelement A method of manufacturing a semiconductor memory device and semiconductor memory device
04/10/2008DE102006047761A1 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
04/10/2008DE102006047738A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks
04/10/2008DE102006047735A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks
04/10/2008DE102006047635A1 Sensor blank i.e. high pressure sensor blank, manufacturing method for common rail diesel system, involves polishing surface under application of loose cylindrical and/or spherical polishing bodies in sliding polishing method
04/10/2008DE102006047262A1 Verfahren zum Testen einer Elektronikeinheit A method of testing an electronic unit
04/10/2008DE102006047244A1 Semiconductor device e.g. MOSFET, for use in supply network, has monocrystalline silicon body, which includes semiconductor device structure with regions of porous-microcrystalline silicon
04/10/2008DE102006037510B3 Verfahren zum Herstellen einer Grabenstruktur, die Verwendung dieses Verfahrens zur Herstellung einer Halbleiteranordnung und Halbleiteranordnung mit einer Grabenstruktur A method of manufacturing a grave structure, the use of this method for producing a semiconductor device and semiconductor device structure with a grave
04/10/2008DE102006032455A1 Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit Method for simultaneous double-side grinding plurality of semiconductor wafers and semi-gurdy disc with excellent flatness
04/10/2008DE102006028137B4 Verfahren zur Herstellung einer Nitrid-basierten Verbindungsschicht, eines GaN-Substrats und einer Nitrid-basierten Halbleiter-Leuchtvorrichtung mit vertikaler Struktur A method of manufacturing a nitride-based compound layer, a GaN substrate and a nitride-based semiconductor light-emitting device having a vertical structure
04/10/2008DE102006003100B4 Vorrichtung und Verfahren zur Herstellung eines Halbleiterbauelements Apparatus and method for manufacturing a semiconductor device