Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2008
04/10/2008WO2008041507A1 Semiconductor package, and display
04/10/2008WO2008041484A1 Elastic contact and method for bonding between metal terminals using the same
04/10/2008WO2008041476A1 Resist protective film forming composition and process for the formation of resist patterns
04/10/2008WO2008041468A1 Method of forming pattern
04/10/2008WO2008041462A1 Thin film transistor, method for manufacturing the same, and display
04/10/2008WO2008041461A1 Etching liquid for conductive polymer and method for patterning conductive polymer
04/10/2008WO2008041446A1 Tape cartridge for cleaning work
04/10/2008WO2008041445A1 Work cleaning method
04/10/2008WO2008041431A1 Method for resin seal molding, and resin seal molding apparatus for use in the method
04/10/2008WO2008041334A1 Electronic component testing apparatus
04/10/2008WO2008041306A1 Nonvolatile semiconductor storage apparatus, reading method thereof, writing method thereof and erasing method thereof
04/10/2008WO2008041303A1 Nonvolatile semiconductor storage apparatus, reading method thereof, writing method thereof and erasing method thereof
04/10/2008WO2008041301A1 Semiconductor device and its manufacturing method
04/10/2008WO2008041294A1 Chuck device for substrate bonding machine and method of neutralizing charges on substrate
04/10/2008WO2008041293A1 Work transferring method, electrostatic chuck device, and board joining method
04/10/2008WO2008041277A1 Compound semiconductor device and process for producing the same
04/10/2008WO2008041275A1 Semiconductor device and process for producing the same
04/10/2008WO2008041273A1 Method of pickup and pickup apparatus
04/10/2008WO2008041169A2 Redundantable robot assembly for workpiece transfer
04/10/2008WO2008041027A1 Distortion-tolerant processing
04/10/2008WO2008040782A1 Device for separating a stacked structure and related method
04/10/2008WO2008040632A1 Local collector implant structure for heterojunction bipolar transistors and method of forming the same
04/10/2008WO2008024566A3 Overall defect reduction for pecvd films
04/10/2008WO2008024322A9 Shielding floating gate tunneling element structure
04/10/2008WO2008021403A3 Method for deposition of magnesium doped (al, in, ga, b)n layers
04/10/2008WO2008021269A3 Device chip carriers, modules, and methods of forming thereof
04/10/2008WO2008020911A3 High power insulated gate bipolar transistors
04/10/2008WO2008018956A3 Coating composition, article, and associated method
04/10/2008WO2008018026A3 Active matrix displays and other electronic devices having plastic substrates
04/10/2008WO2008016818A3 System and method for manufacturing a thin-film device
04/10/2008WO2008016650A3 Methods of forming carbon-containing silicon epitaxial layers
04/10/2008WO2008012737A3 Method of manufacturing a semiconductor device and a device manufactured by the method
04/10/2008WO2008010949A3 Method and apparatus for forming an oxide layer on semiconductors
04/10/2008WO2008008159A3 Electron induced chemical etching and deposition for circuit repair
04/10/2008WO2008007258A3 Power amplifier assembly
04/10/2008WO2007149113A3 Friction reducing aid for cmp
04/10/2008WO2007146782A3 Apparatus and method for controlling the temperature of a substrate in a high vacuum processing system
04/10/2008WO2007144539A3 Holder for electrical component and electrical device including the holder and component
04/10/2008WO2007143072B1 Wet etch suitable for creating square cuts in si and resulting structures
04/10/2008WO2007142911A3 Semiconductor on insulator structure made using radiation annealing
04/10/2008WO2007136619A3 Solution processible materials and their use in electronic devices
04/10/2008WO2007127866A3 An integrated thermal unit having vertically arranged bake and chill plates
04/10/2008WO2007127825A3 Fabrication tool for bonding
04/10/2008WO2007120988A3 Gate-coupled eprom cell for printhead
04/10/2008WO2007120282A3 Stackable molded packages and methods of making the same
04/10/2008WO2007090135A3 Nwell to nwell isolation
04/10/2008WO2007081549A3 Monitoring photodetector for integrated photonic devices
04/10/2008WO2007056224A3 Technique and apparatus for depositing layers of semiconductor for solar cell and module fabrication
04/10/2008US20080086715 Method for interlayer and yield based optical proximity correction
04/10/2008US20080086712 Method of designing a pattern
04/10/2008US20080086229 Substrate processing system
04/10/2008US20080086228 Method of optimizing process recipe of substrate processing system
04/10/2008US20080085663 comprises cerium oxide particles having an average particle size from 0.01 to 0.5 mu m, a water-soluble polyamine having a weight average molecular weight from 100 to 100,000 selected from polyether polyamine, polyalkylene polyamine, polyethyleneimine, polyvinylamine, polyallylamine, polylysine
04/10/2008US20080085662 Polishing tool and polishing method and apparatus using same
04/10/2008US20080085612 Method to deposit conformal low temperature SiO2
04/10/2008US20080085611 Deposition and densification process for titanium nitride barrier layers
04/10/2008US20080085610 atomic layer deposition; metal source chemical is the next reactant provided after the silicon source chemical; separated vapor phase pulses of reactants and an oxidizing agent; SiCL4; hafnium silicate; zirconium silicate
04/10/2008US20080085609 Method for protecting high-topography regions during patterning of low-topography regions
04/10/2008US20080085608 Method for manufacturing semiconductor device
04/10/2008US20080085607 Method for modulating stresses of a contact etch stop layer
04/10/2008US20080085606 Method for Fabricating a Structure for a Semiconductor Component, and Semiconductor Component
04/10/2008US20080085605 Dry etching method of insulating film
04/10/2008US20080085604 Plasma Treatment Method and Plasma Etching Method
04/10/2008US20080085603 Gate etch process for a high-voltage FET
04/10/2008US20080085602 Slurry composition for a chemical mechanical polishing process and method of manufacturing a semiconductor device using the slurry composition
04/10/2008US20080085601 Method of forming fine contact hole and method of fabricating semiconductor device using block copolymers
04/10/2008US20080085600 Method of forming lithographic and sub-lithographic dimensioned structures
04/10/2008US20080085599 Alignment mark, use of a hard mask material, and method
04/10/2008US20080085598 Method of patterning contact holes
04/10/2008US20080085597 Post passivation interconnection schemes on top of IC chips
04/10/2008US20080085596 Post passivation interconnection schemes on top of IC chips
04/10/2008US20080085595 Method of providing solder bumps on a substrate using localized heating
04/10/2008US20080085594 Silver-containing nanoparticles with replacement stabilizer
04/10/2008US20080085593 Method of manufacturing semiconductor device
04/10/2008US20080085592 Method for manufacturing semiconductor device
04/10/2008US20080085591 Novel Gate Structure with Low Resistance for High Power Semiconductor Devices
04/10/2008US20080085590 Method of making FUSI gate and resulting structure
04/10/2008US20080085589 Fabrication of strained silicon film via implantation at elevated substrate temperatures
04/10/2008US20080085588 Method of arranging dies in a wafer for easy inkless partial wafer process
04/10/2008US20080085587 Epitaxial silicon growth
04/10/2008US20080085586 Semiconductor device
04/10/2008US20080085585 Structure and method for creation of a transistor
04/10/2008US20080085584 Oxidation/heat treatment methods of manufacturing non-volatile memory devices
04/10/2008US20080085583 Method of manufacturing a non-volatile memory device
04/10/2008US20080085582 Hand-type nonvolatile memory device and method of forming the same
04/10/2008US20080085581 Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected
04/10/2008US20080085580 Methods for uniform doping of non-planar transistor structures
04/10/2008US20080085579 Semiconductor structure with high-voltage sustaining capability and fabrication method of the same
04/10/2008US20080085578 Method of manufacturing semiconductor integrated circuit
04/10/2008US20080085577 Method of manufacturing complementary metal oxide semiconductor transistor
04/10/2008US20080085576 Manufacturing Method for Semiconductor Device
04/10/2008US20080085575 Dual work-function single gate stack
04/10/2008US20080085574 Antifuse one time programmable memory array and method of manufacture
04/10/2008US20080085573 Underfill dispense at substrate aperture
04/10/2008US20080085572 Semiconductor packaging method by using large panel size
04/10/2008US20080085571 Die bonder and die bonding method thereof
04/10/2008US20080085570 Distinguishing Between Dopant and Line Width Variation Components
04/10/2008US20080085569 Method of using electrical test structure for semiconductor trench depth monitor
04/10/2008US20080085568 Method for repairing bonded metallic structures
04/10/2008US20080085567 Tunneling magnetoresistive element, semiconductor junction element, magnetic memory and semiconductor light emitting element