| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/16/2008 | CN101162708A Nonvolatile semiconductor memory device to realize multi-bit cell and method for manufacturing the same |
| 04/16/2008 | CN101162707A Structure and method of forming transistor density based stress layers in cmos devices |
| 04/16/2008 | CN101162706A Planar-type semiconductor device and method of manufacturing the same |
| 04/16/2008 | CN101162705A Multifunctional filmistor-electric capacity array |
| 04/16/2008 | CN101162704A Chip packaging body, chip structure and manufacturing method thereof |
| 04/16/2008 | CN101162703A Method for manufacturing display device, and etching apparatus |
| 04/16/2008 | CN101162702A Jet printing type aggregates removing equipment |
| 04/16/2008 | CN101162701A Thimble for silicon chip up-down in etching equipment |
| 04/16/2008 | CN101162700A Wafer inspecting equipment |
| 04/16/2008 | CN101162699A Semiconductor device and manufacturing method of the same |
| 04/16/2008 | CN101162698A Sensing type packaging member and its manufacturing method |
| 04/16/2008 | CN101162697A Lateral power mosfet with high breakdown voltage and low on-resistance |
| 04/16/2008 | CN101162696A Preparation method of silicon transistor on source body Ohm contacting isolator |
| 04/16/2008 | CN101162695A Process for gallium nitride HEMT device surface passivation and improving device electric breakdown strength |
| 04/16/2008 | CN101162694A Chemical passivation method for measuring minority carrier lifetime of crystalline silicon |
| 04/16/2008 | CN101162693A Gallium nitride surface low damnification etching |
| 04/16/2008 | CN101162692A Silicon chip etching method |
| 04/16/2008 | CN101162691A Floating grid preparation method used for grid dividing structure flash memory |
| 04/16/2008 | CN101162690A Polysilicon thin film transistor and method of fabricating the same |
| 04/16/2008 | CN101162689A Focus ring and plasma processing apparatus |
| 04/16/2008 | CN101162688A Plasma processing device and running processing method and method for manufacturing electric device |
| 04/16/2008 | CN101162687A Method for fabricating a semiconductor device, method for fabricating an electronic device, and semiconductor fabricating apparatus |
| 04/16/2008 | CN101162686A Heat treatment apparatus |
| 04/16/2008 | CN101162685A Apparatus and method to improve uniformity and reduce local effect of process chamber |
| 04/16/2008 | CN101162684A Cleaning method afterSemi-conductor crystal round etching ashing |
| 04/16/2008 | CN101162679A Ion injector |
| 04/16/2008 | CN101162481A Semiconductor integrated circuit layout designing apparatus |
| 04/16/2008 | CN101162368A Method, an alignment mark and use of a hard mask material |
| 04/16/2008 | CN101162367A Stage device |
| 04/16/2008 | CN101162366A Method of forming lithographic and sub-lithographic dimensioned structures |
| 04/16/2008 | CN101162337A Pixel structure of semi-penetrate reflection type liquid crystal display array substrates and manufacturing method thereof |
| 04/16/2008 | CN101162314A Display device and method for manufacturing mask plate and display device |
| 04/16/2008 | CN101162306A Liquid crystal display device and manufacturing method thereof |
| 04/16/2008 | CN101162240A Detecting probe card testing system |
| 04/16/2008 | CN101161748A Slurry composition for forming tungsten pattern and method for manufacturing semiconductor device using the same |
| 04/16/2008 | CN101161570A Engaging-disengaging apparatus for bridge conveying car |
| 04/16/2008 | CN101161414A Method for grinding a same membrane material by end-point detecting system |
| 04/16/2008 | CN101161412A Substrate retaining ring for cmp |
| 04/16/2008 | CN101161411A 晶片的磨削加工方法 Wafer grinding method |
| 04/16/2008 | CN101161391A Welding flux film forming device and smoothing method for welding flux surface |
| 04/16/2008 | CN100382353C Magneto-resistive effect element, magnetic head and magnetic reproducing device |
| 04/16/2008 | CN100382345C 光半导体装置 The optical semiconductor device |
| 04/16/2008 | CN100382343C Manufacture of a semiconductor light-emitting device |
| 04/16/2008 | CN100382342C Light-emitting diode support and producing method thereof |
| 04/16/2008 | CN100382339C LED and fabrication method thereof |
| 04/16/2008 | CN100382332C Semiconductor device and method of manufacturing semiconductor device |
| 04/16/2008 | CN100382331C Sectional field effect transistor and method of fabrication |
| 04/16/2008 | CN100382325C Semiconductor integrated circuit device |
| 04/16/2008 | CN100382324C Memory cell, memory cell arrangement and method for the production of a memory cell |
| 04/16/2008 | CN100382323C Charge trapping memory cell |
| 04/16/2008 | CN100382322C Semiconductor memory device and portable electronic apparatus |
| 04/16/2008 | CN100382321C Semiconductor memory matrix of flating gate memory unit |
| 04/16/2008 | CN100382320C Storage matrix layer and method for programming 3D RRAM |
| 04/16/2008 | CN100382319C 静态随机存取存储器 Static random access memory |
| 04/16/2008 | CN100382318C Integrated semiconductor memory |
| 04/16/2008 | CN100382316C Semiconductor device having a HMP metal gate and its manufacture method |
| 04/16/2008 | CN100382315C Semiconductor device |
| 04/16/2008 | CN100382312C Semiconductor device and method of manufacturing semiconductor device |
| 04/16/2008 | CN100382309C Molecule component |
| 04/16/2008 | CN100382307C Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 04/16/2008 | CN100382306C Economical high-frequency package |
| 04/16/2008 | CN100382305C Metal interconnecting structure and manufacture method thereof |
| 04/16/2008 | CN100382304C Semiconductor device and manufacturing method thereof |
| 04/16/2008 | CN100382303C Semiconductor device |
| 04/16/2008 | CN100382302C Dual inlay interconnection structure and its making method |
| 04/16/2008 | CN100382301C Method to generate porous organic dielectric |
| 04/16/2008 | CN100382299C Hybrid integrated circuit device and method of manufacturing the same |
| 04/16/2008 | CN100382297C Method for cutting lead terminal of package type electronic component |
| 04/16/2008 | CN100382296C Lead frame, resin sealed semiconductor device and its manufacturing method |
| 04/16/2008 | CN100382294C Encapsulation body of semiconductor chip and encapsulation method |
| 04/16/2008 | CN100382291C Semiconductor device and making method thereof |
| 04/16/2008 | CN100382285C Printing circuit board and production method and electronic parts |
| 04/16/2008 | CN100382284C Semiconductor device |
| 04/16/2008 | CN100382283C Integrated circuit chip and manufacturing method thereof |
| 04/16/2008 | CN100382282C Method for manufacturing non-volatile memory unit |
| 04/16/2008 | CN100382281C Wafer cutting method |
| 04/16/2008 | CN100382280C Wafer cutting method |
| 04/16/2008 | CN100382279C Semiconductor device and method for manufacturing the same |
| 04/16/2008 | CN100382278C Method for fabrication of in-laid metal interconnects |
| 04/16/2008 | CN100382277C Method of manufacturing a semiconductor device |
| 04/16/2008 | CN100382276C Substrate mounting table, substrate processing apparatus and substrate processing method |
| 04/16/2008 | CN100382275C Substrate mounting table, substrate processing apparatus and substrate temperature control method |
| 04/16/2008 | CN100382274C Eliminating systematic process yield loss via precision wafer placement alignment |
| 04/16/2008 | CN100382273C Double staight-liue motor redundant synchronous-driven T-shape operating table |
| 04/16/2008 | CN100382272C Semiconductor device tester |
| 04/16/2008 | CN100382271C Chip checking system and method |
| 04/16/2008 | CN100382270C Short detection circuit and short detection method |
| 04/16/2008 | CN100382269C Method and device for defining substrate position prelatively to supporting table |
| 04/16/2008 | CN100382268C Electronic component joint device |
| 04/16/2008 | CN100382267C Recovery processing method of an electrode |
| 04/16/2008 | CN100382266C Ball mounting method and apparatus for ball grid array packaging substrate |
| 04/16/2008 | CN100382265C Mounting method of bump-equipped electronic component and mounting structure of the same |
| 04/16/2008 | CN100382264C Semiconductor device and electronic equipment using the same |
| 04/16/2008 | CN100382263C Semiconductor wafer device having multilayer wiring structure and packaging method thereof |
| 04/16/2008 | CN100382262C Semiconductor device and its producing method |
| 04/16/2008 | CN100382261C Bump forming device for electric charge generating semiconductor substrate, method of removing electric charge from electric charge generating semiconductor substrate, and electric charge generating s |
| 04/16/2008 | CN100382260C Method of manufacturing semiconductor packaging device |
| 04/16/2008 | CN100382259C Radiating fin and heat pipe jointing method and apparatus |
| 04/16/2008 | CN100382258C 高阻抗射频功率塑料封装 High impedance RF power plastic package |
| 04/16/2008 | CN100382257C Self-healing polymer compositions |