| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/03/2009 | CN101447456A Method for fabricating semiconductor device |
| 06/03/2009 | CN101447455A Method of manufacturing LCD driver ic |
| 06/03/2009 | CN101447454A Method for adjusting grid work function of fully-silicified metal grid |
| 06/03/2009 | CN101447453A Method for preventing gate oxide damage of a trench MOSFET during wafer processing |
| 06/03/2009 | CN101447452A Method for manufacturing semiconductor device |
| 06/03/2009 | CN101447451A Image sensor and method for manufacturing the sensor |
| 06/03/2009 | CN101447450A Method for preparing single chip integrated GaAs-based MHEMT and PIN diode |
| 06/03/2009 | CN101447449A Method for manufacturing single-chip-integrated GaAs base PHEMT and PIN diode |
| 06/03/2009 | CN101447448A Etching method and uses of hole formation in stack of layers |
| 06/03/2009 | CN101447447A Method of intrinsic gettering for trench isolation |
| 06/03/2009 | CN101447446A Clamp ring for wafer and method of manufacturing semiconductor apparatus |
| 06/03/2009 | CN101447445A Workpiece supporting device |
| 06/03/2009 | CN101447444A Processing apparatus and positioning method |
| 06/03/2009 | CN101447443A Method for manufacturing high-frequency integrated circuit encapsulation structure |
| 06/03/2009 | CN101447442A Method for making a device including placing a semiconductor chip on a substrate |
| 06/03/2009 | CN101447441A Integrated circuit package system including die having relieved active region |
| 06/03/2009 | CN101447440A Method for eliciting sub-micron HBT emitter/HEMT grid |
| 06/03/2009 | CN101447439A Lead for integrated circuit package |
| 06/03/2009 | CN101447438A Manufacturing method of semiconductor device |
| 06/03/2009 | CN101447437A Encapsulation structure for reconfiguring crystal grain and preconfigured fan-out structure used thereinto |
| 06/03/2009 | CN101447436A Multi-wafer dual-surface stacking method and structure thereof |
| 06/03/2009 | CN101447435A Manufacturing method of gate-splitting type flash memory |
| 06/03/2009 | CN101447434A Manufacturing method of double diffusion field effect transistor |
| 06/03/2009 | CN101447433A Manufacturing method of double diffusion field effect transistor |
| 06/03/2009 | CN101447432A Manufacturing method of double diffusion field effect transistor |
| 06/03/2009 | CN101447431A Method for manufacturing semiconductor devices |
| 06/03/2009 | CN101447430A Formation method for side wall |
| 06/03/2009 | CN101447429A Manufacturing method of double diffusion field effect transistor |
| 06/03/2009 | CN101447428A Method for preparing heterojunction bipolar transistor |
| 06/03/2009 | CN101447427A Method for forming tungsten film and method for forming wiring of semiconductor device using the same |
| 06/03/2009 | CN101447426A Plasma etching method |
| 06/03/2009 | CN101447425A Method of preventing etch profile bending and bowing by treating a polymer formed on the opening sidewalls |
| 06/03/2009 | CN101447424A Manufacturing method of STI structure |
| 06/03/2009 | CN101447423A Manufacturing method for semiconductor device |
| 06/03/2009 | CN101447422A Method for manufacturing flash memory device |
| 06/03/2009 | CN101447421A Method for preparing metal grid electrode |
| 06/03/2009 | CN101447420A Method for preparing high-dielectric-coefficient grid medium membrane hafnium silicon oxygen nitrogen |
| 06/03/2009 | CN101447419A Film formation method, thin-film transistor, solar battery, manufacture device and display device |
| 06/03/2009 | CN101447418A Method for preparing semiconductor conducting film by doping boron on surface of diamond |
| 06/03/2009 | CN101447417A Forming method of high-resistance polysilicon |
| 06/03/2009 | CN101447416A Method for cleaning semiconductor silicon wafer |
| 06/03/2009 | CN101447415A Semiconductor silicon wafer cleaning device and cleaning method thereof |
| 06/03/2009 | CN101447414A Vacuum-resistant and high-pressure resistant movable sealing device with gas protection |
| 06/03/2009 | CN101447413A Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device |
| 06/03/2009 | CN101447412A Method for manufacturing semiconductor device |
| 06/03/2009 | CN101447411A Method for disconnecting adhesive bonding film with backmounted wafer and adhesive bonding film |
| 06/03/2009 | CN101447410A Manufacturing method for semiconductor device |
| 06/03/2009 | CN101447409A Protective tape cutting method for semiconductor wafer and device of the same |
| 06/03/2009 | CN101447408A Substrate processing system and substrate processing method |
| 06/03/2009 | CN101447407A Method for cutting protective tape of semiconductor wafer and protective tape cutting device |
| 06/03/2009 | CN101447406A Loadlock designs and methods for using same |
| 06/03/2009 | CN101447405A Wafer position correction with a dual, side-by-side wafer transfer robot |
| 06/03/2009 | CN101447404A Method for limiting expansion of earthquake damage and system for limiting expansion of earthquake damage for use in semiconductor manufacturing apparatus |
| 06/03/2009 | CN101447403A Reflow apparatus and method |
| 06/03/2009 | CN101447402A Chamber and associated methods for wafer processing |
| 06/03/2009 | CN101447401A Substrate treating apparatus and method for manufacturing the same |
| 06/03/2009 | CN101447400A Chip-to-wafer bonder and bonding method |
| 06/03/2009 | CN101447399A Integrated circuit design |
| 06/03/2009 | CN101447398A Method for forming a hard mask pattern in a semiconductor device |
| 06/03/2009 | CN101447397A Inactive atmosphere device in wet cleaning |
| 06/03/2009 | CN101447396A Supercritical CO2 cleaning device for semiconductor refrigeration |
| 06/03/2009 | CN101447395A Focusing ring, semiconductor facility comprising same and application thereof |
| 06/03/2009 | CN101447394A Method for improving back pollution of work piece during manufacturing process of semiconductor |
| 06/03/2009 | CN101446773A Maskless photon-electron spot-grid array printer |
| 06/03/2009 | CN101446761A Pattern formation method |
| 06/03/2009 | CN101446753A Photomask and detecting device, detecting method, manufacturing method and pattern transferring method for the same |
| 06/03/2009 | CN101444993A Devices and methods for integrated circuit manufacturing |
| 06/03/2009 | CN101444900A Vacuum-assisted pad conditioning system |
| 06/03/2009 | CN101444899A Method of manufacturing wafer carrier |
| 06/03/2009 | CN101444897A 抛光设备和方法 Polishing apparatus and method |
| 06/03/2009 | CN100496204C Electronic component mounting apparatus and electronic component mounting method |
| 06/03/2009 | CN100495747C Gallium nitride based III-V group compound semiconductor device |
| 06/03/2009 | CN100495743C Thin film transistor array panel for X-ray detector |
| 06/03/2009 | CN100495740C Photovoltaic element |
| 06/03/2009 | CN100495739C Stacked photovoltaic device |
| 06/03/2009 | CN100495732C Local-length nitride SONOS device and method of manufacturing the same |
| 06/03/2009 | CN100495710C Nonvolatile semiconductor memory device for increasing coupling ratio, and fabrication method thereof |
| 06/03/2009 | CN100495709C Memory arrays, methods of forming memory arrays, and methods of forming contacts to bitlines |
| 06/03/2009 | CN100495703C Inductor for a system-on-a-chip and method for manufacturing the same |
| 06/03/2009 | CN100495689C Method of packaging an optical sensor and image sensor device |
| 06/03/2009 | CN100495687C Double-stress SOI substrate |
| 06/03/2009 | CN100495686C Capacitor contact structure and technique for dynamic random access memory |
| 06/03/2009 | CN100495685C Method for fabricating dual-metal gate device |
| 06/03/2009 | CN100495684C Semiconductor device and electronic device |
| 06/03/2009 | CN100495683C A method for making resistor random memory unit array |
| 06/03/2009 | CN100495682C Method for realizing RTD and HEMT single chip integration using dry etching technology |
| 06/03/2009 | CN100495681C Method for fabricating semiconductor device |
| 06/03/2009 | CN100495680C Non-contact type suction holding device |
| 06/03/2009 | CN100495679C Chip transport box and operation method of chip transport box |
| 06/03/2009 | CN100495678C Semiconductor test management system and method |
| 06/03/2009 | CN100495677C 倒装芯片封装方法及其焊锡点形成方法 Flip-chip packaging method and a method of forming solder points |
| 06/03/2009 | CN100495676C Flip chip mounting method and method for connecting substrates |
| 06/03/2009 | CN100495675C Package equipped with semiconductor chip and method for producing same |
| 06/03/2009 | CN100495674C 半导体器件 Semiconductor devices |
| 06/03/2009 | CN100495673C Plasma processing method and method for fabricating electronic component module using the same |
| 06/03/2009 | CN100495672C Semiconductor chip resin encapsulation method |
| 06/03/2009 | CN100495671C Resin paste for wafer bonding |
| 06/03/2009 | CN100495670C Method of manufacturing wafer level stack package |
| 06/03/2009 | CN100495669C Common drain dual semiconductor chip scale package and method of fabricating same |
| 06/03/2009 | CN100495668C Method of making exposed pad ball grid array package |