| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/04/2009 | DE10360874B4 Feldeffekttransistor mit Heteroschichtstruktur sowie zugehöriges Herstellungsverfahren Field effect transistor with a heterostructure as well as associated production method |
| 06/04/2009 | DE10335622B4 Harzversiegelte Halbleiterbaugruppe The resin-sealed semiconductor device |
| 06/04/2009 | DE10309728B4 Verfahren zur Herstellung von Si-Wafern mit einer Lanthanoid-Silikat-Schicht A process for production of Si wafers with a lanthanide silicate layer |
| 06/04/2009 | DE102008060051A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 06/04/2009 | DE102008057982A1 Verfahren zur Herstellung eines Systems Process for the preparation of a system |
| 06/04/2009 | DE102008057707A1 Verfahren zum Herstellen eines Bauelements einschließlich des Plazierens eines Halbleiterchips auf einem Substrat A method of manufacturing a device including the placing of a semiconductor chip on a substrate |
| 06/04/2009 | DE102008054320A1 Halbleitereinrichtungen und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation |
| 06/04/2009 | DE102008053427A1 Durchsubstratverbindungskontakt-Halbleiterkomponenten Substrate compound by contacting semiconductor components |
| 06/04/2009 | DE102008046729A1 Halbleiterbauelement mit leitendem Die-Attach-Material Semiconductor device with conductive die attach material |
| 06/04/2009 | DE102008042772A1 Flexible LED-Verbindung mittels Metallbahnen Flexible LED connection using metal tracks |
| 06/04/2009 | DE102008032175A1 Adressentreiber und Herstellungsverfahren sowie diesen verwendendes Anzeigebauelement Address drivers, processes and these display-use device |
| 06/04/2009 | DE102008012928B3 Solar cell wafer transportation box, has supporting base provided with external configuration that is designed such that supporting base is guided at centering bars, and opening provided at base in centre axis |
| 06/04/2009 | DE102008005935A1 Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 06/04/2009 | DE102007058053A1 Diffusion furnace with reaction chamber for treating substrates, comprises first unit for generating a gas flow, and second- and funnel-shaped third unit for influencing the flow, where first and second units are arranged in the chamber |
| 06/04/2009 | DE102007058002A1 Vorrichtung zum thermischen Behandeln von Halbleitersubstraten Apparatus for the thermal treatment of semiconductor substrates |
| 06/04/2009 | DE102007057904A1 Sensormodul und Verfahren zur Herstellung des Sensormoduls Sensor module and process for producing the sensor module |
| 06/04/2009 | DE102007057902A1 Sensormodul und Verfahren zu seiner Herstellung Sensor module and process for its preparation |
| 06/04/2009 | DE102007057728A1 Halbleiterbauelement mit einer Kurzschlussstruktur, die einen Teiltransistor des Halbleiterbauelements umfasst, der eine geringe Temperaturabhängigkeit aufweist und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device comprising a short-circuit structure, the transistor comprises part of the semiconductor device which has a small temperature dependence, and methods of manufacturing such a semiconductor device |
| 06/04/2009 | DE102007057689A1 Halbleiterbauelement mit einem Chipgebiet, das für eine aluminiumfreie Lothöckerverbindung gestaltet ist, und eine Teststruktur, die für eine aluminiumfreie Drahtverbindung gestaltet ist A semiconductor device having a chip area which is designed for an aluminum-free Lothöckerverbindung, and a test structure that is designed for an aluminum-free wire connection |
| 06/04/2009 | DE102007057687A1 Verfahren zum Erzeugen einer Zugverformung durch selektives Anwenden von Verspannungsgedächtnisverfahren auf NMOS-Transistoren A method for creating tensile strain by selectively applying stress memorization process on NMOS transistors |
| 06/04/2009 | DE102007057685A1 Reduzieren von Kupferdefekten während einer nasschemischen Reinigung von freiliegenden Kupferoberflächen in einer Metallisierungsschicht eines Halbleiterbauelements Copper reducing defects during a wet chemical cleaning of the exposed copper surfaces in a metallization layer of a semiconductor device |
| 06/04/2009 | DE102007057684A1 Verfahren und Teststruktur zur Überwachung von CMP-Prozessen in Metallisierungsschichten von Halbleiterbauelementen The method and test structure for monitoring of CMP processes in metallization of semiconductor components |
| 06/04/2009 | DE102007057682A1 Hybridkontaktstruktur mit Kontakt mit kleinem Aspektverhältnis in einem Halbleiterbauelement Hybrid contact structure with contact with small aspect ratio in a semiconductor device |
| 06/04/2009 | DE102007057429A1 Vorrichtung und Verfahren zum Drahtbonden Apparatus and method for wire bonding |
| 06/04/2009 | DE102007057241A1 Method for producing a stack of layers on a crystalline substrate, which is free from nitride compound semiconductor by using metal organic gas-phase deposition, comprises forming a nitride-containing buffer layer on the substrate |
| 06/04/2009 | DE102007048414A1 Aufnehmen einer Mehrzahl von elektronischen Bauelementen mittels Saugkanälen mit pneumatischem Verstellelement Receiving a plurality of electronic components by means of suction channels with pneumatic adjustment |
| 06/04/2009 | DE102007041124B4 Thyristor mit verbessertem Einschaltverhalten, Thyristoranordnung mit einem Thyristor, Verfahren zur Herstellung eines Thyristors und einer Thyristoranordnung Thyristor having an improved switch-on, thyristor having a thyristor, method for producing a thyristor and a thyristor |
| 06/04/2009 | DE102006008332B4 Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit A process for preparing a functional unit and functional unit |
| 06/04/2009 | DE102005011300B4 Vorspannungsschaltung, Festkörper-Abbildungssystem und zugehöriges Herstellungsverfahren Bias, solid-state imaging system and manufacturing method thereof |
| 06/04/2009 | DE102004064081B9 Gehäuse für einen optischen Empfänger Housing for an optical receiver |
| 06/04/2009 | DE102004030848B4 LDMOS-Transistor-Vorrichtung in einem integrierten Schaltkreis und Verfahren zur Herstellung eines integrierten Schaltkreises mit einem LDMOS-Transistor LDMOS transistor device in an integrated circuit and method for producing an integrated circuit with a LDMOS transistor |
| 06/04/2009 | DE102004027074B4 Verfahren zur Herstellung eines BGA (Ball Grid Array)-Bauteils mit einer dünnen metallischen Kühlfolie A method for preparing a BGA (Ball Grid Array) component with a thin metallic film cooling |
| 06/04/2009 | DE10030481B4 Halbleiter-Fabrikautomatisierungssystem und Verfahren zur Bearbeitung eines Postens von Halbleiterwafern in einer vollautomatischen oder halbautomatischen Betriebsart Semiconductor factory automation system and method for processing an item of semiconductor wafers in a fully automatic or semi-automatic mode |
| 06/04/2009 | CA2706434A1 Separation of nanostructures |
| 06/03/2009 | EP2065937A2 Display device and method for manufacturing thereof |
| 06/03/2009 | EP2065929A1 Semiconductor sensor device and method for manufacturing same |
| 06/03/2009 | EP2065928A2 Semiconductor device and manufacturing method thereof |
| 06/03/2009 | EP2065927A1 Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer |
| 06/03/2009 | EP2065926A1 Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck |
| 06/03/2009 | EP2065925A1 Field-effect transistor |
| 06/03/2009 | EP2065924A1 Silicon wafer heat treatment method |
| 06/03/2009 | EP2065923A2 Methods for adjusting critical dimension uniformity in an etch process |
| 06/03/2009 | EP2065922A1 Cutting method |
| 06/03/2009 | EP2065921A1 Method for fabricating a semiconductor substrate with areas with different crystal orienation |
| 06/03/2009 | EP2065920A1 Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
| 06/03/2009 | EP2065906A1 Process for moderating deformation |
| 06/03/2009 | EP2065490A1 GaN substrate manufacturing method, GaN substrate, and semiconductor device |
| 06/03/2009 | EP2065489A1 PROCESS FOR PRODUCING GaN SINGLE-CRYSTAL, GaN THIN-FILM TEMPLATE SUBSTRATE AND GaN SINGLE-CRYSTAL GROWING APPARATUS |
| 06/03/2009 | EP2065428A1 Silicone resin composition and method for forming trench isolation |
| 06/03/2009 | EP2065132A2 Polishing apparatus and method |
| 06/03/2009 | EP2065131A1 Method of manufacturing wafer carrier |
| 06/03/2009 | EP2065120A1 Laser processing method and laser processing apparatus |
| 06/03/2009 | EP2065115A1 Device and method for bonding a wire containing copper with the use of at least a plasma nozzle |
| 06/03/2009 | EP2064930A2 Electronic component mounting structure |
| 06/03/2009 | EP2064745A1 Method of producing precision vertical and horizontal layers in a vertical semiconductor structure |
| 06/03/2009 | EP2064740A1 Semiconductor device and manufacturing method thereof |
| 06/03/2009 | EP2064739A1 Methods of fabricating shield plates for reduced field coupling in nonvolatile memory |
| 06/03/2009 | EP2064738A1 Manufacturing a contact structure in a semiconductor device |
| 06/03/2009 | EP2064737A1 CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES |
| 06/03/2009 | EP2064736A1 Fabrication of self-assembled nanowire-type interconnects on a semiconductor device |
| 06/03/2009 | EP2064735A1 Active regions with compatible dielectric layers |
| 06/03/2009 | EP2064734A2 Release strategies for making transferable semiconductor structures, devices and device components |
| 06/03/2009 | EP2064733A2 Array of non-volatile memory cells with floating gates formed of spacers in substrate trenches |
| 06/03/2009 | EP2064732A1 Semiconductor device and method for manufacturing the same |
| 06/03/2009 | EP2064731A1 Semiconductor devices and manufacturing method thereof |
| 06/03/2009 | EP2064730A2 Nitride semiconductor structures with interlayer structures and methods of fabricating nitride semiconductor structures with interlayer structures |
| 06/03/2009 | EP2064729A2 Thick nitride semiconductor structures with interlayer structures and methods of fabricating thick nitride semiconductor structures |
| 06/03/2009 | EP2064596A1 Dual stage positioning and switching system |
| 06/03/2009 | EP2033224A4 Self aligned gate and guard ring structure for use in a sit |
| 06/03/2009 | EP1908097A4 Method for controlling dislocation positions in silicon germanium buffer layers |
| 06/03/2009 | EP1794778A4 Feol/meol metal resistor for high end cmos |
| 06/03/2009 | EP1776743B1 Method for fabricating lateral semiconductor device |
| 06/03/2009 | EP1702226A4 Lensed tip optical fiber and method of making the same |
| 06/03/2009 | EP1587029B1 RFID-tag |
| 06/03/2009 | EP1495365A4 Antireflective sio-containing compositions for hardmask layer |
| 06/03/2009 | EP1464074A4 Method for limiting divot formation in post shallow trench isolation processes |
| 06/03/2009 | EP1451877A4 Trench mosfet having low gate charge |
| 06/03/2009 | EP1402242B1 Using scatterometry to develop real time etch image |
| 06/03/2009 | EP1242198A4 Single semiconductor wafer processor |
| 06/03/2009 | CN201252093Y Wafer grabbing arm |
| 06/03/2009 | CN201252092Y Variable-step mechanism before packing semiconductor chips |
| 06/03/2009 | CN101449370A Memory system with switch element |
| 06/03/2009 | CN101449369A Method of detaching a thin film by melting precipitates |
| 06/03/2009 | CN101449368A Electrically conducting connection with insulating connection medium |
| 06/03/2009 | CN101449367A Semiconductor structure pattern formation |
| 06/03/2009 | CN101449366A Buried channel mosfet using iii-v compound semiconductors and high k gate dielectrics |
| 06/03/2009 | CN101449365A Method of film deposition, apparatus for film deposition, memory medium, and semiconductor device |
| 06/03/2009 | CN101449364A Compressive nitride film and method of manufacturing thereof |
| 06/03/2009 | CN101449363A Organic barc etch process capable of use in the formation of low K dual damascene integrated circuits |
| 06/03/2009 | CN101449362A Method of increasing the quality factor of an inductor in a semiconductor device |
| 06/03/2009 | CN101449361A Dry etch stop process for eliminating electrical shorting in mram device structures |
| 06/03/2009 | CN101449360A Method for forming thin film photovoltaic interconnects using self aligned process |
| 06/03/2009 | CN101448607A 抛光垫 Polishing pad |
| 06/03/2009 | CN101447492A Semiconductor display device |
| 06/03/2009 | CN101447491A Thin film transistor array panel |
| 06/03/2009 | CN101447486A High frequency switch circuit device |
| 06/03/2009 | CN101447460A Method of manufacturing electronic apparatus and electronic apparatus |
| 06/03/2009 | CN101447459A Display panel and manufacturing method of display panel |
| 06/03/2009 | CN101447458A Hard mask patterns of a semiconductor device and a method for forming the same |
| 06/03/2009 | CN101447457A Method for manufacturing double-stress membrane complementary metal oxide semiconductor (CMOS) transistor |