Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/10/2010US20100144119 Method of producing bonded wafer
06/10/2010US20100144118 Method for Stacking Semiconductor Dies
06/10/2010US20100144117 Semiconductor device having device characteristics improved by straining surface of active region and its manufacture method
06/10/2010US20100144116 Method of forming high lateral voltage isolation structure involving two separate trench fills
06/10/2010US20100144115 Non-volatile semiconductor memory device and method of manufacturing the same
06/10/2010US20100144114 Method for Producing a Semiconductor Component with Two Trenches
06/10/2010US20100144113 Method of forming semiconductor devices
06/10/2010US20100144112 Methods of Manufacturing Semiconductor Devices
06/10/2010US20100144111 Process for production of soi substrate and process for production of semiconductor device
06/10/2010US20100144110 Method of forming a MOS transistor
06/10/2010US20100144109 Transistor in a semiconductor substrate having high-concentration source and drain region formed at the bottom of a trench adjacent to the gate electrode
06/10/2010US20100144108 Method of manufacturing a nonvolatile semiconductor memory device, and a nonvolatile semiconductor memory device
06/10/2010US20100144107 Semiconductor Memory Device
06/10/2010US20100144106 Dynamic random access memory (dram) cells and methods for fabricating the same
06/10/2010US20100144105 Methods for fabricating stressed mos devices
06/10/2010US20100144104 Semiconductor device and method of manufacturing the same
06/10/2010US20100144103 Method, System and Apparatus for Gating Configurations and Improved Contacts in Nanowire-Based Electronic Devices
06/10/2010US20100144102 Forming Floating Body RAM Using Bulk Silicon Substrate
06/10/2010US20100144101 Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
06/10/2010US20100144100 Method of Forming Quad Flat Package
06/10/2010US20100144099 Method for manufacturing passive device and semiconductor package using thin metal piece
06/10/2010US20100144098 Method for Fabricating Flip-Attached and Underfilled Semiconductor Devices
06/10/2010US20100144097 Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective film
06/10/2010US20100144096 Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective film
06/10/2010US20100144095 Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective film
06/10/2010US20100144094 Method of Forming Stacked Dies
06/10/2010US20100144093 Integrated Circuit Device and Method of Manufacturing Thereof
06/10/2010US20100144092 Semiconductor device and fabrication method thereof
06/10/2010US20100144091 Semiconductor device and method of manufacturing the same
06/10/2010US20100144090 Phase change memory devices having dual lower electrodes and methods of fabricating the same
06/10/2010US20100144089 Method of fabricating oxide semiconductor device
06/10/2010US20100144088 Method for forming metal oxide and method for forming transistor structure with the same
06/10/2010US20100144087 Methods of forming phase-changeable memory devices including an adiabatic layer
06/10/2010US20100144079 Method for the precision processing of substrates
06/10/2010US20100144077 Substrate processing apparatus and method and a manufacturing method of a thin film semiconductor device
06/10/2010US20100144076 Thin film transistor array panel and method for manufacturing the same
06/10/2010US20100144074 Method of fabricating an array substrate for liquid crystal display device
06/10/2010US20100144070 Ic card and booking-account system using the ic card
06/10/2010US20100144069 Methods and Apparatus For Thinning, Testing And Singulating A Semiconductor Wafer
06/10/2010US20100144068 High Throughput Die-to-Wafer Bonding Using Pre-Alignment
06/10/2010US20100144067 Circuit and method for interconnecting stacked integrated circuit dies
06/10/2010US20100144066 System and method for recycling a gas used to deposit a semiconductor layer
06/10/2010US20100144065 Method for recycling/reclaiming a monitor wafer
06/10/2010US20100144064 Semiconductor device having a ferroelectric capacitor
06/10/2010US20100144063 Seminconductor device
06/10/2010US20100144062 Fabricating method of nonvolatile semiconductor storage apparatus
06/10/2010US20100143850 Method of Manufacturing a Semiconductor Device
06/10/2010US20100143831 Photomask blank and photomask
06/10/2010US20100143830 Sulfonium salt, acid generator, resist composition, photomask blank, and patterning process
06/10/2010US20100143828 Method of mask forming and method of three-dimensional microfabrication
06/10/2010US20100143811 Water Oxidation Catalyst
06/10/2010US20100143744 Systems and Methods of Laser Texturing of Material Surfaces and their Applications
06/10/2010US20100143088 Handling tools for components, in particular eletronic components
06/10/2010US20100143082 Portable stocker and method of using same
06/10/2010US20100143081 Semiconductor manufacturing apparatus and method
06/10/2010US20100143079 Vacuum processing apparatus
06/10/2010US20100142881 Optical link circuit and method of making same
06/10/2010US20100142878 Absorption modulator and manufacturing method thereof
06/10/2010US20100142580 Laser device with coupled laser source and waveguide
06/10/2010US20100142575 Edge-emitting semiconductor laser with photonic-bandgap structure formed by intermixing
06/10/2010US20100142294 Vertical Transistor Memory Cell and Array
06/10/2010US20100142266 Vertical field-effect transistor
06/10/2010US20100142265 Magnetic structure with multiple-bit storage capabilities
06/10/2010US20100142263 Semiconductor Switching Device
06/10/2010US20100142259 Nanogaps: methods and devices containing same
06/10/2010US20100142255 Method to program a memory cell comprising a carbon nanotube fabric element and a steering element
06/10/2010US20100142174 Integrated circuit packaging system and method of manufacture thereof
06/10/2010US20100142155 Preferentially Cooled Electronic Device
06/10/2010US20100142114 Electrostatic chuck with compliant coat
06/10/2010US20100142113 De-clamping wafers from an electrostatic chuck
06/10/2010US20100141888 Liquid crystal display and method for manufacturing the same
06/10/2010US20100141621 Semiconductor device
06/10/2010US20100141229 Semiconductor Device
06/10/2010US20100140815 Semiconductor device and method of forming an interconnect structure for 3-d devices using encapsulant for structural support
06/10/2010US20100140814 Rf device and method with trench under bond pad feature
06/10/2010US20100140813 Integrated circuit packaging system and method of manufacture thereof
06/10/2010US20100140811 Semiconductor die interconnect formed by aerosol application of electrically conductive material
06/10/2010US20100140810 Chip package with coplanarity controlling feature
06/10/2010US20100140809 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
06/10/2010US20100140808 Power Distribution In A Vertically Integrated Circuit
06/10/2010US20100140807 Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof
06/10/2010US20100140806 Method for Forming Super Contact in Semiconductor Device
06/10/2010US20100140805 Bump Structure for Stacked Dies
06/10/2010US20100140804 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance
06/10/2010US20100140803 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/10/2010US20100140802 Film forming method and film forming apparatus
06/10/2010US20100140800 Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device
06/10/2010US20100140797 Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
06/10/2010US20100140796 Manufacturing method of semiconductor device, and semiconductor device
06/10/2010US20100140795 Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
06/10/2010US20100140794 Apparatus and method for packaging circuits
06/10/2010US20100140789 Integrated circuit packaging system with exposed terminal interconnects and method of manufacture thereof
06/10/2010US20100140788 Manufacturing fan-out wafer level packaging
06/10/2010US20100140785 Semiconductor device
06/10/2010US20100140784 Accessing or interconnecting integrated circuits
06/10/2010US20100140783 Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
06/10/2010US20100140782 Printed circuit board having built-in integrated circuit package and fabrication method therefor
06/10/2010US20100140781 Quad flat non-leaded package and manufacturing method thereof
06/10/2010US20100140780 Semiconductor Device and Method of Forming an IPD Beneath a Semiconductor Die with Direct Connection to External Devices
06/10/2010US20100140779 Semiconductor Package with Semiconductor Core Structure and Method of Forming Same
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