Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/16/2010CN101740487A Method for forming metal wiring of semiconductor device
06/16/2010CN101740486A Method for manufacturing a metal line of an image sensor
06/16/2010CN101740485A Method for manufacturing semiconductor device with vertical gate
06/16/2010CN101740484A Method of forming through-silicon vias
06/16/2010CN101740483A Interconnection process of metalized Mo, Si-Al double-layer structure of integrated circuits
06/16/2010CN101740482A Method for reducing space between line endings
06/16/2010CN101740481A Method for forming interconnection line in semiconductor device
06/16/2010CN101740480A Method for copper interconnection by semiconductor processing
06/16/2010CN101740479A Method for manufacturing semiconductor device
06/16/2010CN101740478A Dual mosaic method
06/16/2010CN101740477A Method for forming through hole and double-embedded structure
06/16/2010CN101740476A Method for forming dual mosaic structure
06/16/2010CN101740475A Semiconductor device with dual-mosaic structure and forming method thereof
06/16/2010CN101740474A Method for manufacturing semiconductor device and dual-damascene structure
06/16/2010CN101740473A Interlayer dielectric layer, interconnection structure and manufacturing method thereof
06/16/2010CN101740472A Method for manufacturing semiconductor device with copper wiring and semiconductor device
06/16/2010CN101740471A Methods for filling gap groove and forming semiconductor device
06/16/2010CN101740470A Method for forming contact hole and semiconductor device
06/16/2010CN101740469A Method for manufacturing aluminum wiring
06/16/2010CN101740468A Secondarily etched deep groove contact hole and etching method
06/16/2010CN101740467A Processing procedure of semiconductor manufactured aluminium metal wire
06/16/2010CN101740466A Method for preparing contact hole in semiconductor device
06/16/2010CN101740465A Method for improving process window of metal contact hole in SONOS technology
06/16/2010CN101740464A Method for improving process window of self-aligned cell module in SONOS technology
06/16/2010CN101740463A Method to prepare strained silicon materials in insulators by anneal through oxygen implantation.
06/16/2010CN101740462A Manufacturing method of shallow trench isolation structure
06/16/2010CN101740461A Method for manufacturing semiconductor device
06/16/2010CN101740460A Forming method of shallow trench isolation area and manufacturing method of NMOS (N-Mental-Oxide-Semiconductor) transistor
06/16/2010CN101740459A Shallow trench isolation structure and manufacturing method thereof
06/16/2010CN101740458A Manufacturing method of shallow trench structure
06/16/2010CN101740457A Groove filling method and shallow groove isolation structure manufacturing method
06/16/2010CN101740456A Manufacturing method of shallow trench structure and flash memory
06/16/2010CN101740455A Electrical isolation method for preparing multi-regional structure superluminescent light-emitting tubes
06/16/2010CN101740454A Shallow slot isolation process for precisely controlling line width
06/16/2010CN101740453A Substrate chucking member, substrate processing apparatus having the member, and method of processing substrate using the member
06/16/2010CN101740452A Spin head and method of chucking substrate using the same
06/16/2010CN101740451A Ejector pin mechanism of chip sorting equipment
06/16/2010CN101740450A Substrate supporting unit, and apparatus and method for polishing substrate using the same
06/16/2010CN101740449A Vortex flow silicon slice holder
06/16/2010CN101740448A Plasma processing equipment and substrate support plate thereof
06/16/2010CN101740447A Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method
06/16/2010CN101740446A Wafer transportation and detection machine and wafer transportation and detection method
06/16/2010CN101740445A Wafer transportation machine
06/16/2010CN101740444A Conveying mechanism
06/16/2010CN101740443A Roller for guiding of flexible printed circut film and apparatus for packaging semiconductor with the same
06/16/2010CN101740442A Conveying device of sheet-shaped workpiece
06/16/2010CN101740441A Method and device for dispatching mechanical hand and plasma processing equipment
06/16/2010CN101740440A Feeding, conveying and stacking system for bearing disks of circuit components
06/16/2010CN101740439A Device and method for transmitting and processing substrate
06/16/2010CN101740438A Silicon wafer transferring arm and use method thereof
06/16/2010CN101740437A Substrate transport pod
06/16/2010CN101740436A Container for containing sheet
06/16/2010CN101740435A Front-opened wafer box for fixing wafer restriction part module in mode of rotating, resisting and fixing
06/16/2010CN101740434A Nondestructive testing method for oxide semiconductor layer and method for making oxide semiconductor layer
06/16/2010CN101740433A Method for detecting epitaxial defects
06/16/2010CN101740432A Method for manufacturing semiconductor device
06/16/2010CN101740431A Detecting and sorting method for posterior flow of LED (Light Emitting Diode)
06/16/2010CN101740430A Epitaxial auto-doping evaluating method
06/16/2010CN101740429A Flip chip bonding process for base plate
06/16/2010CN101740428A Aluminum thickening process for metal pressure-welding block for bonding copper wire
06/16/2010CN101740427A Bond head for heavy wire bonder
06/16/2010CN101740426A Method of manufacturing semiconductor device
06/16/2010CN101740425A Method for filling metal into fine space
06/16/2010CN101740424A Manufacturing process for a chip package structure
06/16/2010CN101740423A Soldering-pad and forming method thereof
06/16/2010CN101740422A Method for fabricating bump
06/16/2010CN101740421A Wafer and manufacturing method, system-level package structure and package method thereof
06/16/2010CN101740420A Process for manufacturing copper strut
06/16/2010CN101740419A Protective film forming method and apparatus
06/16/2010CN101740418A Component mounting apparatus and component mounting method
06/16/2010CN101740417A Method for producing stackable dies
06/16/2010CN101740416A Quad flat no-lead encapsulation structure and encapsulation method thereof
06/16/2010CN101740415A Integrated circuit structure and method of forming the same
06/16/2010CN101740414A Method for bonding semiconductor dies
06/16/2010CN101740413A Ceramic small outline package (CSOP) method
06/16/2010CN101740412A Manufacturing process for a quad flat non-leaded chip package structure
06/16/2010CN101740411A Manufacturing process for a chip package structure
06/16/2010CN101740410A Manufacturing process for a chip package structure
06/16/2010CN101740409A Method for welding lead of diode and diode
06/16/2010CN101740408A Windowing-type semiconductor packaging member and manufacture method thereof
06/16/2010CN101740407A Process for encapsulating square flat outer-pin-free encapsulating structure
06/16/2010CN101740406A Method for manufacturing square flat pin-free encapsulation
06/16/2010CN101740405A Method for forming insulating layer on metal wire of package
06/16/2010CN101740404A Structure of semiconductor packaging piece and manufacture method thereof
06/16/2010CN101740403A Packaging baseplate structure and manufacture method thereof
06/16/2010CN101740402A Gold removing process of pressure welding area of high-power semiconductor device pipe seat
06/16/2010CN101740401A Method for manufacturing high-precision positioning hole
06/16/2010CN101740400A Method for shaping reflection wall of light-emitting diode module
06/16/2010CN101740399A Method for partially covering insulating layer on metal wire in package
06/16/2010CN101740398A Semiconductor device and method for manufacturing the semiconductor device
06/16/2010CN101740397A Method for preparing ZnO (zinc oxide)-based thin film transistor by using metal organic chemical vapor deposition
06/16/2010CN101740396A Method of manufacturing a semiconductor device
06/16/2010CN101740395A Semiconductor component and method of manufacture
06/16/2010CN101740394A Semiconductor component and method of manufacture
06/16/2010CN101740393A Semiconductor device and manufacture method thereof
06/16/2010CN101740392A LDMOS (Laterally Diffused Metal Oxide Semiconductor) transistor, semiconductor device and manufacture method thereof
06/16/2010CN101740391A Fabricating method of NMOS (N-channel Metal Oxide Semiconductor)
06/16/2010CN101740390A Fabricating method of NMOS (N-channel Metal Oxide Semiconductor) transistor
06/16/2010CN101740389A MOS (Metal Oxide Semiconductor) transistor and forming method thereof
06/16/2010CN101740388A Method for manufacturing metal-semiconductor field effect transistor
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