Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/22/2010US7741177 Method and apparatus transporting charges in semiconductor device and semiconductor memory device
06/22/2010US7741176 Method for fabricating a cylindrical capacitor including implanting impurities into the upper sections of the lower electrode to prevent the formation of hemispherical grain silicon on the upper sections
06/22/2010US7741175 Methods of forming capacitors
06/22/2010US7741174 Methods of forming pad structures and related methods of manufacturing recessed channel transistors that include such pad structures
06/22/2010US7741173 Method for forming a metal oxide film
06/22/2010US7741172 Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode
06/22/2010US7741171 Oxygen-rich layers underlying BPSG
06/22/2010US7741170 Dielectric structure in nonvolatile memory device and method for fabricating the same
06/22/2010US7741169 Mobility enhancement by strained channel CMOSFET with single workfunction metal-gate and fabrication method thereof
06/22/2010US7741168 Systems and methods for fabricating nanometric-scale semiconductor devices with dual-stress layers using double-stress oxide/nitride stacks
06/22/2010US7741167 Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain
06/22/2010US7741166 Oxidation method for altering a film structure
06/22/2010US7741165 Polycrystalline SiGe Junctions for advanced devices
06/22/2010US7741164 Method for fabricating SOI device
06/22/2010US7741163 Method of fabricating thin film transistor and organic electro-luminescent display device
06/22/2010US7741162 Method for manufacturing high-frequency module device
06/22/2010US7741161 Method of making integrated circuit package with transparent encapsulant
06/22/2010US7741160 Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
06/22/2010US7741159 Semiconductor device having channel with cooling fluid and manufacturing method thereof
06/22/2010US7741158 Method of making thermally enhanced substrate-base package
06/22/2010US7741157 System and method for direct bonding of substrates
06/22/2010US7741156 Semiconductor device and method of forming through vias with reflowed conductive material
06/22/2010US7741155 Method of manufacturing semiconducting device with stacked dice
06/22/2010US7741154 Integrated circuit package system with stacking module
06/22/2010US7741153 Modular chip integration techniques
06/22/2010US7741152 Three-dimensional package and method of making the same
06/22/2010US7741151 Integrated circuit package formation
06/22/2010US7741150 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
06/22/2010US7741149 Method of fabricating chip package structure
06/22/2010US7741148 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
06/22/2010US7741147 Method of field-controlled diffusion and devices formed thereby
06/22/2010US7741146 Demounting of inverted metamorphic multijunction solar cells
06/22/2010US7741145 Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing the same
06/22/2010US7741142 Method of fabricating a biosensor
06/22/2010US7741141 Photodiode having increased proportion of light-sensitive area to light-insensitive area
06/22/2010US7741140 Methods, apparatus, and rollers for cross-web forming of optoelectronic devices
06/22/2010US7741139 Solar cell manufacturing method
06/22/2010US7741138 Semiconductor device and fabricating method thereof
06/22/2010US7741137 Method of manufacturing electro-optical device
06/22/2010US7741136 Method of fabricating turning mirror using sacrificial spacer layer and device made therefrom
06/22/2010US7741135 Method of manufacturing light emitting display
06/22/2010US7741134 Inverted LED structure with improved light extraction
06/22/2010US7741133 Resistance measurements of a helical coil
06/22/2010US7741132 Display panel, display panel inspection method, and display panel manufacturing method
06/22/2010US7741131 Laser processing of light reflective multilayer target structure
06/22/2010US7741016 Method for fabricating semiconductor device and exposure mask
06/22/2010US7741014 e.g a glass surface, comprises a thiol molecule attached thereon, exposing the surface to electromagnetic radiation, and altering the layer of molecules to form a pattern comprising a first, second, and third region, differ from each other in physical and chemical properties
06/22/2010US7740993 including first, second, third and fourth windows, each window has a length extending longitude on the mask, 2nd window is aligned to the 1st window, width of the 1st window is greater than 3rd window, 4th window is aligned to 3rd window and width of 3rd window is greater than 4th window
06/22/2010US7740992 detecting a distance between the exposure mask and the object to be exposed, before the exposure, and controlling the distance between the exposure mask and the object to be exposed, to control the amount of flexure of the exposure mask; lithographic exposure based on near-field light
06/22/2010US7740991 Beam dose computing method and writing method and record carrier body and writing apparatus for determining an optimal dose of a charged particle beam
06/22/2010US7740933 Patterned, high surface area substrate with hydrophilic/hydrophobic contrast, and method of use
06/22/2010US7740796 Iron silicide powder and method for production thereof
06/22/2010US7740768 Simultaneous front side ash and backside clean
06/22/2010US7740767 Method and apparatus for manufacturing patterned media
06/22/2010US7740739 Plasma processing apparatus and method
06/22/2010US7740738 Inductively coupled antenna and plasma processing apparatus using the same
06/22/2010US7740737 Plasma processing apparatus and method
06/22/2010US7740736 Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
06/22/2010US7740735 Tools and methods for disuniting semiconductor wafers
06/22/2010US7740721 seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating; oxidation resistance
06/22/2010US7740709 Apparatus for stripping photoresist and method thereof
06/22/2010US7740706 Gas baffle and distributor for semiconductor processing chamber
06/22/2010US7740705 Exhaust apparatus configured to reduce particle contamination in a deposition system
06/22/2010US7740704 High rate atomic layer deposition apparatus and method of using
06/22/2010US7740703 Semiconductor film formation device
06/22/2010US7740702 Silicon wafer and method for manufacturing the same
06/22/2010US7740521 Polishing head, polishing apparatus and polishing method for semiconductor wafer
06/22/2010US7740514 A phosphor layering strategy improves the lumen output and color stability of LED based lamps; putting phosphors that exhibiting lower thermal quenching closer to the LED chip than those that experience higher thermal quenching; also having lower absorption, shorter luminescence decay time; brightnes
06/22/2010US7740465 Casting mold for producing an optical semiconductor module
06/22/2010CA2395608C Junction field effect transistor and method of manufacturing the same
06/22/2010CA2369833C Method of depositing a thick dielectric film
06/17/2010WO2010068941A2 Thin film deposition via a spatially-coordinated and time-synchronized process
06/17/2010WO2010068886A1 Systems and methods for packaging light-emitting diode devices
06/17/2010WO2010068872A1 Via first plus via last technique for ic interconnect
06/17/2010WO2010068825A2 Method for improving motion times of a stage
06/17/2010WO2010068813A2 Carrier head membrane
06/17/2010WO2010068798A2 System and method for recycling a gas used to deposit a semiconductor layer
06/17/2010WO2010068752A2 Platen and adapter assemblies for facilitating silicon electrode polishing
06/17/2010WO2010068718A2 Method for aligning optical packages
06/17/2010WO2010068691A2 Carrier head membrane roughness to control polishing rate
06/17/2010WO2010068625A2 Shaped anode and anode-shield connection for vacuum physical vapor deposition
06/17/2010WO2010068624A2 Chamber shield for vacuum physical vapor deposition
06/17/2010WO2010068623A1 Thin-film deposition and recirculation of a semi-conductor material
06/17/2010WO2010068619A1 Organic semiconductors capable of ambipolar transport
06/17/2010WO2010068598A2 Minimum contact area wafer clamping with gas flow for rapid wafer cooling
06/17/2010WO2010068597A1 Multi-channel developer system
06/17/2010WO2010068542A1 Method and apparatus for growing thin oxide films on silicon while minimizing impact on existing structures
06/17/2010WO2010068535A1 Patterning process
06/17/2010WO2010068530A2 Graded high germanium compound films for strained semiconductor devices
06/17/2010WO2010068523A2 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance
06/17/2010WO2010068488A1 Methods for protecting a die surface with photocurable materials
06/17/2010WO2010068460A2 Particle reflow etching
06/17/2010WO2010068385A1 Low power memory device with jfet device structures
06/17/2010WO2010068384A1 Jfet device structures and methods for fabricating the same
06/17/2010WO2010068337A1 Wet-etchable antireflective coatings
06/17/2010WO2010068331A1 Enhanced vision system for screen printing pattern alignment
06/17/2010WO2010068294A1 Electrostatic chuck with compliant coat
06/17/2010WO2010068268A1 De-clamping wafers from an electrostatic chuck
06/17/2010WO2010068221A1 Memristive device
06/17/2010WO2010068096A1 Preparation of moulded body with electric circuit
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