Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/17/2010US20100151659 Method of forming core-shell type structure and method of manufacturing transistor using the same
06/17/2010US20100151658 Method for manufacturing nitride semiconductor device
06/17/2010US20100151657 Method of improving intrinsic gettering ability of wafer
06/17/2010US20100151656 Method for manufacturing a semiconductor device
06/17/2010US20100151655 Method of forming a fine pattern of a semiconuctor device using a double patterning technique
06/17/2010US20100151654 Nitride film forming method, semiconductor device fabrication method, capacitor fabrication method and nitride film forming apparatus
06/17/2010US20100151653 Methods Of Forming A Plurality Of Capacitors
06/17/2010US20100151652 Multi-level memory cell having phase change element and asymmetrical thermal boundary
06/17/2010US20100151651 Back end thin film capacitor having plates at thin film resistor and first metallization layer levels
06/17/2010US20100151650 Method for manufacturing a power semiconductor device
06/17/2010US20100151649 Method of forming a minute pattern and method of manufacturing a transistor using the same
06/17/2010US20100151648 Strained Channel Transistor
06/17/2010US20100151647 Mos device resistant to ionizing radiation
06/17/2010US20100151646 Process of forming an electronic device including a trench and a conductive structure therein
06/17/2010US20100151645 Semiconductor device and method of fabricating the same
06/17/2010US20100151644 Semiconductor device and method for manufacturing the same
06/17/2010US20100151643 Method for producing an integrated circuit including a trench transistor and integrated circuit
06/17/2010US20100151642 Fabrication method of trenched metal-oxide-semiconductor device
06/17/2010US20100151641 Semiconductor device and method for manufacturing the same
06/17/2010US20100151640 Semiconductor Devices with Active Regions of Different Heights
06/17/2010US20100151639 Method for making a thermally-stable silicide
06/17/2010US20100151638 Anisotropic stress generation by stress-generating liners having a sublithographic width
06/17/2010US20100151637 Resistive memory architectures with multiple memory cells per access device
06/17/2010US20100151636 Methods to make fine patterns by exploiting difference of threshold laser fluence of materials and tft fabrication methods using the same
06/17/2010US20100151635 Vertical floating body cell of a semiconductor device and method for fabricating the same
06/17/2010US20100151634 Display Device
06/17/2010US20100151633 Processes for forming channels in thin-film transistors
06/17/2010US20100151632 Semiconductor device and manufacturing method of a semiconductor device
06/17/2010US20100151631 Fabrication method of semiconductor package having heat dissipation device
06/17/2010US20100151630 Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages
06/17/2010US20100151629 Manufacturing method for semiconductor devices
06/17/2010US20100151628 Manufacturing method for semiconductor device
06/17/2010US20100151627 Fabrication method of thin film device
06/17/2010US20100151626 Locking Feature and Method for Manufacturing Transfer Molded IC Packages
06/17/2010US20100151625 Buried via technology for three dimensional integrated circuits
06/17/2010US20100151624 Fabricating process of a chip package structure
06/17/2010US20100151623 Phase change memory
06/17/2010US20100151619 Recessed Germanium (Ge) Diode
06/17/2010US20100151618 Growth Substrates for Inverted Metamorphic Multijunction Solar Cells
06/17/2010US20100151614 Wafer level method of forming side fiber insertion optoelectronic packages
06/17/2010US20100151612 Group III-V semiconductor device and method for producing the same
06/17/2010US20100151611 Method for manufacturing semiconductor laser
06/17/2010US20100151610 Composition for photoresist stripper and method of fabricating thin film transistor array substrate
06/17/2010US20100151607 Liquid Crystal Electro-Optic Device
06/17/2010US20100151606 Method of forming array substrate for LCD
06/17/2010US20100151604 Light emitting diode having plurality of light emitting cells and method of fabricating the same
06/17/2010US20100151602 Laser roughening to improve led emissions
06/17/2010US20100151600 Method of bonding selected integrated circuit to adhesive substrate
06/17/2010US20100151599 Apparatus and method for manufacturing semiconductor device
06/17/2010US20100151598 Temporary package for at-speed functional test of semiconductor chip
06/17/2010US20100151597 Method for smoothing wafer surface and apparatus used therefor
06/17/2010US20100151596 Method for aligning optical packages
06/17/2010US20100151595 Magnetic ram
06/17/2010US20100151323 Electrode, electrode paste and electronic parts using the same
06/17/2010US20100151248 Fabrication of light emitting film coated fullerenes and their application for in-vivo emission
06/17/2010US20100151202 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
06/17/2010US20100150695 Method and System for Centering Wafer on Chuck
06/17/2010US20100150688 Workpiece transfer system
06/17/2010US20100150687 Substrate processing apparatus
06/17/2010US20100150199 Nitride semiconductor light-emitting device
06/17/2010US20100150197 Laser diode epitaxial wafer and method for producing same
06/17/2010US20100150196 Laser Diode
06/17/2010US20100149929 Time dependent-temperature independent color changing label
06/17/2010US20100149874 Non-volatile memory apparatus and method with deep n-well
06/17/2010US20100149865 Scr matrix storage device
06/17/2010US20100149855 Integrated circuitry for semiconductor memory
06/17/2010US20100149854 Semiconductor device storage cell structure, method of operation, and method of manufacture
06/17/2010US20100149806 Led lighting device and method of manufacturing the same
06/17/2010US20100149775 Tape circuit substrate with reduced size of base film
06/17/2010US20100149773 Integrated circuit packages having shared die-to-die contacts and methods to manufacture the same
06/17/2010US20100149720 Bipolar electrostatic chuck
06/17/2010US20100149625 Method of Fabricating an Integrated Device
06/17/2010US20100149473 Pixel array and manufacturing method thereof
06/17/2010US20100149449 Viewing angle-controllable liquid crystal display device and fabrication method thereof
06/17/2010US20100149448 Display substrate, method of manufacturing the same and liquid crystal display device having the same
06/17/2010US20100149286 Printing device and method of manufacturing a light emitting device
06/17/2010US20100148979 System and method for introducing a substrate into a process chamber
06/17/2010US20100148978 System and method for introducing a substrate into a process chamber
06/17/2010US20100148845 Limiter and semiconductor device using the same
06/17/2010US20100148825 Semiconductor devices and methods of fabricating the same
06/17/2010US20100148809 Probe card for testing semiconductor device, probe card built-in probe system, and method for manufacturing probe card
06/17/2010US20100148415 Thermal treatment apparatus, method for manufacturing semiconductor device, and method for manufacturing substrate
06/17/2010US20100148381 Semiconductor device
06/17/2010US20100148377 Intermediate structure of semiconductor device and method of manufacturing the same
06/17/2010US20100148376 Flip chip mounting process and flip chip assembly
06/17/2010US20100148374 Method for low stress flip-chip assembly of fine-pitch semiconductor devices
06/17/2010US20100148371 Via First Plus Via Last Technique for IC Interconnects
06/17/2010US20100148367 Semiconductor device and method for fabricating the same
06/17/2010US20100148364 Semiconductor device and method for producing semiconductor device
06/17/2010US20100148363 Step cavity for enhanced drop test performance in ball grid array package
06/17/2010US20100148362 Semiconductor device and method for fabricating the same
06/17/2010US20100148361 Semiconductor device and method for fabricating the same
06/17/2010US20100148359 Package on Package Assembly using Electrically Conductive Adhesive Material
06/17/2010US20100148358 Semiconductor device with a high thermal dissipation efficiency
06/17/2010US20100148357 Method of packaging integrated circuit dies with thermal dissipation capability
06/17/2010US20100148356 Stacked semiconductor device and manufacturing method thereof
06/17/2010US20100148354 Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
06/17/2010US20100148353 Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
06/17/2010US20100148352 Grid array packages and assemblies including the same
06/17/2010US20100148350 Semiconductor device and method for manufacturing the same
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