Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/17/2010US20100148349 Semiconductor Package Having Support Chip And Fabrication Method Thereof
06/17/2010US20100148347 Chip scale package structure with can attachment
06/17/2010US20100148346 Semiconductor die package including low stress configuration
06/17/2010US20100148345 Electronic devices including flexible electrical circuits and related methods
06/17/2010US20100148344 Integrated circuit package system with input/output expansion
06/17/2010US20100148343 Side stacking apparatus and method
06/17/2010US20100148341 Semiconductor device and method for manufacturing the same
06/17/2010US20100148340 Semiconductor device and method of manufacturing the same
06/17/2010US20100148337 Stackable semiconductor package and process to manufacture same
06/17/2010US20100148336 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof
06/17/2010US20100148335 Semiconductor package, method of manufacturing same, semiconductor device and electronic device
06/17/2010US20100148333 Packaging millimeter wave modules
06/17/2010US20100148332 Semiconductor apparatus and manufacturing method thereof
06/17/2010US20100148329 Quad flat no lead (qfn) integrated circuit (ic) package having a modified paddle and method for designing the package
06/17/2010US20100148328 Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
06/17/2010US20100148327 Semiconductor die package with clip interconnection
06/17/2010US20100148326 Thermally Enhanced Electronic Package
06/17/2010US20100148325 Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same
06/17/2010US20100148323 Impurity introducing method using optical characteristics to determine annealing conditions
06/17/2010US20100148321 Micro-Electro-Mechanical-System Device with Particles Blocking Function and Method for Making Same
06/17/2010US20100148320 Vicinal gallium nitride substrate for high quality homoepitaxy
06/17/2010US20100148319 Substrates for High-Efficiency Thin-Film Solar Cells Based on Crystalline Templates
06/17/2010US20100148318 Three-Dimensional Semiconductor Template for Making High Efficiency Thin-Film Solar Cells
06/17/2010US20100148317 Critical dimension reduction and roughness control
06/17/2010US20100148316 Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
06/17/2010US20100148315 Semiconductor wafer and a method of separating the same
06/17/2010US20100148314 Semiconductor device and method for manufacuring the same
06/17/2010US20100148313 Semiconductor apparatus and method of manufacturing the same
06/17/2010US20100148312 Reinforced smart cards & methods of making same
06/17/2010US20100148310 Semiconductor wafer, semiconductor device using the same, and method and apparatus for producing the same
06/17/2010US20100148309 Method for manufacturing semiconductor device
06/17/2010US20100148308 Dopant Profile Control for Ultrashallow Arsenic Dopant Profiles
06/17/2010US20100148306 Capacitor and Method of Manufacturing the Same
06/17/2010US20100148305 Semiconductor Device and Fabricating Method Thereof
06/17/2010US20100148303 Semiconductor device and method for fabricating the same
06/17/2010US20100148301 Semiconductor device and manufacturing method thereof
06/17/2010US20100148299 Method of manufacturing semiconductor device, and semiconductor device
06/17/2010US20100148295 Back-illuminated cmos image sensors
06/17/2010US20100148293 Miniaturized implantable sensor platform having multiple devices and sub-chips
06/17/2010US20100148290 Cmos image sensors and related devices and fabrication methods
06/17/2010US20100148287 Truss structure and manufacturing method thereof
06/17/2010US20100148286 Contact-force sensor package and method of fabricating the same
06/17/2010US20100148285 MEMS Component and Method for Production
06/17/2010US20100148283 Integrated structure of mems device and cmos image sensor device and fabricating method thereof
06/17/2010US20100148282 Wafer joining method, wafer composite, and chip
06/17/2010US20100148281 Semiconductor device and method for fabricating the same
06/17/2010US20100148280 Semiconductor device and method for fabricating the same
06/17/2010US20100148278 Semiconductor Device and Fabricating Method Thereof
06/17/2010US20100148276 Bipolar integration without additional masking steps
06/17/2010US20100148275 Semiconductor device and method for fabricating the same
06/17/2010US20100148274 Semiconductor device and method for manufacturing same
06/17/2010US20100148272 Semiconductor device and manufacturing method thereof
06/17/2010US20100148271 Method for gate leakage reduction and Vt shift control and complementary metal-oxide-semiconductor device
06/17/2010US20100148270 Methods of channel stress engineering and structures formed thereby
06/17/2010US20100148269 Tunable spacers for improved gapfill
06/17/2010US20100148264 Electrostatic discharge protection device and method of fabricating the same
06/17/2010US20100148263 Semiconductor device structure and fabricating method thereof
06/17/2010US20100148262 Resistors and Methods of Manufacture Thereof
06/17/2010US20100148261 Semiconductor device and method for producing the same
06/17/2010US20100148258 Semiconductor device and method of manufacturing the same
06/17/2010US20100148257 MOS-FET Having a Channel Connection, and Method for the Production of a MOS-FET Having a Channel Connection
06/17/2010US20100148254 Power semiconductor device and method of manufacturing the same
06/17/2010US20100148252 Semiconductor device having transistor and method of manufacturing the same
06/17/2010US20100148251 Semiconductor device and method for manufacturing the same
06/17/2010US20100148249 Method Of Manufacturing A Memory Device
06/17/2010US20100148248 Semiconductor device having gate trenches and manufacturing method thereof
06/17/2010US20100148247 Semiconductor device
06/17/2010US20100148246 Power mosfet device structure for high frequency applications
06/17/2010US20100148241 Semiconductor device and method of manufacturing the same
06/17/2010US20100148240 Semiconductor device and manufacturing method thereof
06/17/2010US20100148239 Gate structure of semiconductor device and methods of forming word line structure and memory
06/17/2010US20100148238 Non-volatile memory and fabricating method thereof
06/17/2010US20100148237 Non-volatile semiconductor storage device and method of manufacturing the same
06/17/2010US20100148236 Semiconductor device and manufacturing method thereof
06/17/2010US20100148235 Semiconductor integrated circuit, standard cell, standard cell library, semiconductor integrated circuit designing method, and semiconductor integrated circuit designing equipment
06/17/2010US20100148233 Semiconductor device and method of forming semiconductor device
06/17/2010US20100148232 Surface treatment of hydrophobic ferroelectric polymers for printing
06/17/2010US20100148230 Trench isolation regions in image sensors
06/17/2010US20100148229 Insulating resin composition
06/17/2010US20100148228 Semiconductor and manufacturing method of the same
06/17/2010US20100148227 Electronic device including an insulating layer having different thicknesses and a conductive electrode and a process of forming the same
06/17/2010US20100148226 Jfet device structures and methods for fabricating the same
06/17/2010US20100148225 Low power memory device with jfet device structures
06/17/2010US20100148223 Semiconductor device and method of manufacturing the same
06/17/2010US20100148217 Graded high germanium compound films for strained semiconductor devices
06/17/2010US20100148216 Semiconductor light receiving element and method for manufacturing semiconductor light receiving element
06/17/2010US20100148215 IGBT Having One or More Stacked Zones Formed within a Second Layer of the IGBT
06/17/2010US20100148212 Method for producing group iii nitride semiconductor crystal, group iii nitride semiconductor substrate, and semiconductor light- emitting device
06/17/2010US20100148207 Semiconductor device, and manufacturing method thereof, and display device and its manufacturing method
06/17/2010US20100148206 LED package and method of assembling the same
06/17/2010US20100148202 Semiconductor light-emitting device and method for manufacturing the same
06/17/2010US20100148198 Light emitting device and method for manufacturing same
06/17/2010US20100148197 Selective decomposition of nitride semiconductors to enhance led light extraction
06/17/2010US20100148193 Systems and methods for packaging light-emitting diode devices
06/17/2010US20100148188 Laser-induced flaw formation in nitride semiconductors
06/17/2010US20100148186 Vertical junction field effect transistors having sloped sidewalls and methods of making
06/17/2010US20100148182 Thin flim transistor substrate and manufacturing method thereof
06/17/2010US20100148181 Nanocrystal silicon layer structures formed using plasma deposition technique, methods of forming the same, nonvolatile memory devices having the nanocrystal silicon layer structures, and methods of fabricating the nonvolatile memory devices
06/17/2010US20100148180 Thin film transistor array panel with common bars of different widths
06/17/2010US20100148179 Semiconductor Device and Method of Manufacturing the Same
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