Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/23/2010CN101745993A Method for forming windmill-shaped scribing sheet groove structures
06/23/2010CN101745865A Substrate polishing apparatus and method of polishing substrate using the same
06/23/2010CN101745851A Grinding device and grinding method
06/23/2010CN101474774B Method for processing surface and edge of broken film coating epitaxial silicon chip
06/23/2010CN101471411B Method for producing LED stent
06/23/2010CN101452918B Carrier plate module having built-in phase lock loop, integration type system, and manufacturing method thereof
06/23/2010CN101442051B Monocrystallinetype knot-type field effect tube device and preparation method thereof
06/23/2010CN101431017B Method for improving GaN thick film integrality on sapphire substrate
06/23/2010CN101419903B Method for removing granules on wafer
06/23/2010CN101416290B Field effect transistor
06/23/2010CN101410952B Method for seed film formation, plasma film forming apparatus, and memory medium
06/23/2010CN101409320B Method for preparing substrate
06/23/2010CN101399175B Display substrate manufacturing method
06/23/2010CN101395710B Mounting method, board with electrical component, and electrical apparatus
06/23/2010CN101390206B Electronic module and a method of assembling such a module
06/23/2010CN101385154B Switching device, rewritable logic integrated circuit, and memory device
06/23/2010CN101383335B Semiconductor package substrate and fabrication method thereof
06/23/2010CN101383301B Method of forming flip-chip bump carrier type package
06/23/2010CN101379598B 化学机械研磨垫 Chemical mechanical polishing pad
06/23/2010CN101378019B Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatus
06/23/2010CN101375394B Warpage-reducing packaging design
06/23/2010CN101373783B Photodiode array and method for manufacturing same
06/23/2010CN101373741B Semiconductor shielding structure and manufacturing method thereof
06/23/2010CN101364586B Construction for packaging substrate
06/23/2010CN101361166B Apparatus and method for cleaning of objects, in particular of thin discs
06/23/2010CN101359684B Silicon based single electron transistor of wrap gate control construction and manufacturing method thereof
06/23/2010CN101359649B Programmable through-hole devices, maufacturing method thereof and integrated logic circuit
06/23/2010CN101359596B Slot filling method and manufacturing method for shallow slot isolation
06/23/2010CN101359579B Vacuum chamber
06/23/2010CN101351088B Inside imbedded type line structure and technique thereof
06/23/2010CN101349849B Display panel and manufacturing method thereof
06/23/2010CN101341581B Flame-perforated aperture masks
06/23/2010CN101335299B Semiconductor device and method for manufacturing the same
06/23/2010CN101335183B Temperature controlled loadlock chamber
06/23/2010CN101331587B Apparatus and method for depositting material pattern on substrate
06/23/2010CN101325152B Process for cleaning, drying and hydrophilizing a semiconductor wafer
06/23/2010CN101322237B Substrate processing apparatus, substrate placing table used for same, and member exposed to plasma
06/23/2010CN101317260B Device with self aligned gaps for capacitance reduction
06/23/2010CN101310929B Polishing pad, method for manufacturing same and polishing system and method
06/23/2010CN101308818B Method for manufacturing image sensor
06/23/2010CN101308777B Nanostructure and manufacturing method of nanostructure
06/23/2010CN101308771B Gas flow diffuser
06/23/2010CN101300681B Semiconductor device and method for manufacturing same
06/23/2010CN101299908B Method for manufacturing printed circuit board having embedded component
06/23/2010CN101297989B Batch preparation of hollow micro-needle based on molding
06/23/2010CN101295726B Image sensor and method of manufacturing the same
06/23/2010CN101295686B Semiconductor device and method of manufacturing the same
06/23/2010CN101290944B Solid-state image capturing device, method of manufacturing the same, and electronic information device
06/23/2010CN101281883B Method for forming threading hole on substrate
06/23/2010CN101269478B Accurate milling buffing head mechanical device for attenuated polishing
06/23/2010CN101266930B A method for making horizontal dual pervasion field effect transistor
06/23/2010CN101266626B Method for processing IC
06/23/2010CN101256985B Thin-film transistor array substrate and manufacturing method thereof
06/23/2010CN101256951B Method applied for ultra thin wafer backside processing
06/23/2010CN101253633B Method for producing silicon carbide semiconductor device
06/23/2010CN101252146B Semiconductor structure and manufacture method thereof
06/23/2010CN101252079B Substrate processing apparatus
06/23/2010CN101241869B Chip testing classifier
06/23/2010CN101236335B Display device and method of manufacturing the same
06/23/2010CN101233609B Method for manufacturing semiconductor device
06/23/2010CN101231973B Display device and manufacturing method of the same
06/23/2010CN101228621B Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device
06/23/2010CN101226902B Pixel structure of liquid crystal display panel and manufacturing method thereof
06/23/2010CN101221981B Electronic component with mixed high dielectric material layer and manufacturing method thereof
06/23/2010CN101221961B Pixel structure and its production method
06/23/2010CN101217132B Thin-film transistor substrate, its transfer method and display device
06/23/2010CN101217124B A low temperature flip chip welding method of macromolecule electric conducting material of template printing
06/23/2010CN101211957B Alternating current illuminating device and method for making the same
06/23/2010CN101211899B Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
06/23/2010CN101207138B Thin film transistor substrate and fabricating method thereof
06/23/2010CN101207062B Method for manufacturing substrate carrying table
06/23/2010CN101202300B 半导体器件 Semiconductor devices
06/23/2010CN101197385B Image sensor and method for manufacturing the same
06/23/2010CN101197355B Electronic device and method for producing the same, LBD display unit and method for producing the same
06/23/2010CN101197292B Non-volatile memory device and method for forming the same
06/23/2010CN101197257B Method for forming micro-pattern in a semiconductor device
06/23/2010CN101188194B Bonded wafer and method for producing bonded wafer
06/23/2010CN101179111B Organic light emitting display and fabrication method thereof
06/23/2010CN101174534B Ion implanter
06/23/2010CN101171895B Printed wiring board
06/23/2010CN101162707B Semiconductor device structure and method of forming transistor density based stress layers
06/23/2010CN101162481B Semiconductor integrated circuit layout designing apparatus
06/23/2010CN101159303B Double beams laser auxiliary LED chip and heat sink directly linking method
06/23/2010CN101154047B Reworking processing method
06/23/2010CN101153385B Plasma body reinforced chemical vapor deposition method
06/23/2010CN101150147B Printed non-volatile memory
06/23/2010CN101148025B Method for polishing a semiconductor wafer and semiconductor wafer polished by the method
06/23/2010CN101131969B Semiconductor substrate
06/23/2010CN101128908B Stage mechanism
06/23/2010CN101122013B Purge gas unit and purge gas supply integrated unit
06/23/2010CN101116037B Photosensitive composition removing liquid
06/23/2010CN101111575B Polysilazane-treating solvent and method for treating polysilazane by using such solvent
06/23/2010CN101106141B Semiconductor-on-insulator (SOI) structure and its making method
06/23/2010CN101090137B An apparatus and associated method for making a floating gate cell in a virtual ground array
06/23/2010CN101088158B Semiconductor device
06/23/2010CN101088157B Increasing die strength by etching during or after dicing
06/23/2010CN101078746B Border scanning test structure of multiple chip package internal connection and test method
06/23/2010CN101071793B Flat panel display and fabrication method thereof
06/23/2010CN101061257B Method for vaporization of liquid raw material which enables low-temperature vaporization of liquid raw material, and vaporizer using the method
06/23/2010CN101060120B 半导体集成电路 The semiconductor integrated circuit
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