| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/08/2010 | US20100171158 Method of forming ferromagnetic material, transistor and method of manufacturing the same |
| 07/08/2010 | US20100171156 Method for Forming Semiconductor Contacts |
| 07/08/2010 | US20100171155 Body-biased Silicon-On-Insulator Junction Field-Effect Transistor Having A Fully Depleted Body and Fabrication Method Therefor |
| 07/08/2010 | US20100171154 Silicon-On-Insulator Junction Field-Effect Transistor Having A Fully Depleted Body and Fabrication Method Therefor |
| 07/08/2010 | US20100171153 Method and structure of monolithically integrated pressure sensor using ic foundry-compatible processes |
| 07/08/2010 | US20100171151 Heterojunction bipolar transistor and manufacturing method thereof |
| 07/08/2010 | US20100171144 Light emitting device package and manufacturing method thereof |
| 07/08/2010 | US20100171136 Light emitting diode and method of fabricating the same |
| 07/08/2010 | US20100171130 Semiconductor device and fabrication method |
| 07/08/2010 | US20100171127 Optically coupled device and method of manufacturing the same |
| 07/08/2010 | US20100171126 In situ dopant implantation and growth of a Ill-nitride semiconductor body |
| 07/08/2010 | US20100171124 Low-defect density gallium nitride semiconductor structures and fabrication methods |
| 07/08/2010 | US20100171123 Display apparatus and manufacturing method thereof |
| 07/08/2010 | US20100171121 Thin film array panel and manufacturing method thereof |
| 07/08/2010 | US20100171120 Display and method for manufacturing display |
| 07/08/2010 | US20100171118 Junction Field-Effect Transistor Having Insulator-Isolated Source/Drain Regions and Fabrication Method Therefor |
| 07/08/2010 | US20100171103 Ferro-Electric Device And Modulatable Injection Barrier |
| 07/08/2010 | US20100171097 Detection device and method for manufacturing the same |
| 07/08/2010 | US20100171096 Segmented Nanowires Displaying Locally Controllable Properties |
| 07/08/2010 | US20100171092 Method for controlling optic interband transition of carbon nanotubes, the carbon nanotubes resulting therefrom and devices that comprise the carbon nanotubes |
| 07/08/2010 | US20100171089 Dielectric layers and memory cells including metal-doped alumina |
| 07/08/2010 | US20100171088 Resistance variable memory device with sputtered metal-chalcogenide region and method of fabrication |
| 07/08/2010 | US20100171087 Semiconductor device and process for producing the same |
| 07/08/2010 | US20100171044 Vapor Compression Refridgeration Chuck for Ion Implanters |
| 07/08/2010 | US20100171038 Sensor unit for an x-ray detector and associated production method |
| 07/08/2010 | US20100170803 Method and Apparatus for Plating Semiconductor Wafers |
| 07/08/2010 | US20100170795 Electrochemical gas sensor |
| 07/08/2010 | US20100170568 Ag electrode paste, solar battery cell, and method of manufacturing the same |
| 07/08/2010 | US20100170567 Conductive paste and grid electrode for silicon solar cells |
| 07/08/2010 | US20100170563 Method and Apparatus for Light Absorption and Charged Carrier Transport |
| 07/08/2010 | US20100170558 Thin Layer Solar Cell Module and Method for Producing It |
| 07/08/2010 | US20100170442 Remote plasma apparatus for processing substrate with two types of gases |
| 07/08/2010 | US20100170441 Method of Forming Metal Oxide and Apparatus for Performing the Same |
| 07/08/2010 | US20100170440 Surface treatment apparatus |
| 07/08/2010 | US20100170436 Substrate treatment equipment and manufacturing method of substrate |
| 07/08/2010 | DE112004002137B4 Herstellungsverfahren für einen Transistor mit bipolarem Übergang mit verbesserter extrinsischer Basisregion Manufacturing process for a transistor with a bipolar junction with improved extrinsic base region |
| 07/08/2010 | DE10324530B4 Schleifverfahren für eine Doppelscheibenflächenschleifmaschine mit vertikalem Vorschub und Schleifvorrichtung Grinding method for a double disc surface grinding machine with vertical feed and grinder |
| 07/08/2010 | DE10226583B4 DRAM-Speicherzelle für schnellen Schreib-/Lesezugriff und Speicherzellenfeld DRAM memory cell for fast read / write access and the memory cell array |
| 07/08/2010 | DE10216016B4 Halbleitervorrichtung zum Messen einer physikalischen Größe Semiconductor device for measuring a physical quantity |
| 07/08/2010 | DE102009058844A1 Halbleitervorrichtung mit selbstjustierten Kontakten, integrierte Schaltung und Herstellungsverfahren A semiconductor device with self-aligned contacts, integrated circuit, and manufacturing method |
| 07/08/2010 | DE102009056981A1 Herstellungsverfahren für Halbleiter-Vorrichtungen Manufacturing method for semiconductor devices |
| 07/08/2010 | DE102009054004A1 Integrated circuit for use with condenser, has lower electrode arranged over semiconductor body, where lower electrode has base region, top region and outer side panel |
| 07/08/2010 | DE102009046750A1 Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung Electrochemical Einebnungssystem with improved electrolyte flow |
| 07/08/2010 | DE102009044605A1 Verfahren zum Herstellen eines Halbleiter-Package unter Verwendung eines Trägers mit einem Hügel A method of manufacturing a semiconductor package using a carrier with a hill |
| 07/08/2010 | DE102009042600A1 Leistungshalbleitermodul und Herstellungsverfahren für dieses The power semiconductor module, and manufacturing method for this |
| 07/08/2010 | DE102009042320A1 Anordnung mit einem Leistungshalbleiterchip Arrangement with a power semiconductor chip |
| 07/08/2010 | DE102009009497A1 Runner disk for holding conductive disks during reciprocal polish, has recesses for supporting conductive disks and depressing openings for polishing agent supplying polish |
| 07/08/2010 | DE102009000001A1 Bildsensor und Verfahren zur Herstellung eines Bildsensors Image sensor and method for manufacturing an image sensor |
| 07/08/2010 | DE102008064428A1 Chipaufbau und Verfahren zur Herstellung eines Chipaufbaus Chip structure and method of manufacturing a chip assembly |
| 07/08/2010 | DE102008063432A1 Einstellen der Verformung, die in einem Transistorkanal hervorgerufen wird, durch für die Schwellwerteinstellung vorgesehenes Halbleitermaterial Adjusting the deformation, which is caused in a transistor channel, provided by the threshold adjustment semiconductor material |
| 07/08/2010 | DE102008063430A1 Metallisierungssystem eines Halbleiterbauelements mit zusätzlich verjüngten Übergangskontakten Metallization of a semiconductor device with additional taper transition contacts |
| 07/08/2010 | DE102008063429A1 Einstellen der Konfiguration eines Mehr-Gatetransistors durch Steuern einzelner Stege Setting the configuration of a multi-gate transistor by controlling individual webs |
| 07/08/2010 | DE102008063427A1 Transistor mit einem eingebetteten verformungsinduzierenden Material mit einer graduell geformten Gestaltung Transistor with an embedded strain-inducing material with a gradually shaped design |
| 07/08/2010 | DE102008063417A1 Lokale Silizidierung an Kontaktlochunterseiten in Metallisierungssystemen von Halbleiterbauelementen Local silicidation of the contact hole bases in metallization of semiconductor devices |
| 07/08/2010 | DE102008063416A1 Wärmeableitung in temperaturkritischen Bauteilbereichen von Halbleiterbauelementen durch Wärmeleitungen, die mit der Substratrückseite verbunden sind Heat dissipation in temperature-critical component regions of semiconductor devices by the heat pipes, which are connected to the substrate rear side |
| 07/08/2010 | DE102008063403A1 SOI-Bauelement mit einem vergrabenen isolierenden Material mit erhöhter Ätzwiderstandsfähigkeit SOI device with a buried insulating material with increased etch resistivity |
| 07/08/2010 | DE102008063402A1 Verringerung der Schwellwertspannungsfluktuation in Transistoren mit einer Kanalhalbleiterlegierung durch Verringern der Abscheideungleichmäßigkeiten Reducing the Schwellwertspannungsfluktuation in transistors with a channel semiconductor alloy by reducing the Abscheideungleichmäßigkeiten |
| 07/08/2010 | DE102008063401A1 Halbleiterbauelement mit einem kosteneffizienten Chipgehäuse, das auf der Grundlage von Metallsäuren angeschlossen ist A semiconductor device comprising a cost-efficient chip housing which is connected on the basis of metal acids |
| 07/08/2010 | DE102008063399A1 Transistor mit einer eingebetteten Halbleiterlegierung mit einer asymmetrischen Anordnung Transistor with an embedded semiconductor alloy with an asymmetrical arrangement |
| 07/08/2010 | DE102008047127B4 Verfahren zur Herstellung integral ausgebildeter Drain- und Source-Gebiete in einem Silizium/Germanium enthaltenden Transistorbauelement und Halbleiterbauelement A process for producing integrally formed drain and source regions in a silicon / germanium-containing transistor device and semiconductor device |
| 07/08/2010 | DE102008026211B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Metallleitungen mit einer selektiv gebildeten dielektrischen Deckschicht A method for producing a semiconductor device having metal lines with a selectively formed dielectric coating layer |
| 07/08/2010 | DE102007057687B4 Verfahren zum Erzeugen einer Zugverformung in Transistoren A method for creating tensile strain in the transistors |
| 07/08/2010 | DE102007047698B4 Vorrichtung und Verfahren zum Verbinden von Komponenten Device and method for connecting components |
| 07/08/2010 | DE102006051490B4 Technik zur Herstellung einer Passivierungsschicht ohne ein Abschlussmetall Technology for the production of a passivation layer without a final metal |
| 07/08/2010 | DE102005043303B4 Verfahren zur Rekristallisierung von Schichtstrukturen mittels Zonenschmelzen und dessen Verwendung Method for recrystallization of layer structures by zone melting and its use |
| 07/08/2010 | DE102005022372B4 Verfahren zur Bildung eines Source-Kontakts eines Flash-Speicherbauelements A method for forming a source contact of a flash memory device |
| 07/08/2010 | DE102005018941B4 Halbleiterbauteil in einem Standardgehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device in a standard housing and methods for preparing |
| 07/08/2010 | DE102004063454B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
| 07/08/2010 | DE102004060831B4 Verfahren zum Herstellen eines Vertiefungskanal-Arraytransistors unter Verwendung einer Maskenschicht mit einer hohen Ätzselektivität hinsichtlich eines Siliziumsubstrats A method for producing a depression channel array transistor by using a mask layer having a high etch selectivity with respect to a silicon substrate |
| 07/08/2010 | DE102004041378B4 Halbleiterscheibe mit Schichtstruktur mit geringem Warp und Bow sowie Verfahren zu ihrer Herstellung Semiconductor wafer having a layer structure with a small warp and bow, as well as processes for their preparation |
| 07/08/2010 | DE10162983B4 Kontaktfederanordnung zur elektrischen Kontaktierung eines Halbleiterwafers zu Testzwecken sowie Verfahren zu deren Herstellung For testing contact spring arrangement for making electrical contact of a semiconductor wafer as well as processes for their preparation |
| 07/08/2010 | CA2746693A1 Modular carrier |
| 07/07/2010 | EP2204861A1 Organic field effect transistor with an organic dielectric |
| 07/07/2010 | EP2204847A1 Semiconductor substrate and method for inspecting semiconductor substrate |
| 07/07/2010 | EP2204845A1 Method of fabricating polysilicon, thin film transistor, method of fabricating the thin film transistor, and organic light emitting diode display device including the thin film transistor |
| 07/07/2010 | EP2204844A1 Method of fabricating polysilicon, thin film transistor, method of fabricating the thin film transistor, and organic light emitting diode display device including the thin film transistor |
| 07/07/2010 | EP2204843A2 Semiconductor device and its manufacturing method |
| 07/07/2010 | EP2204824A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 07/07/2010 | EP2204697A2 Marker structure, lithographic projection apparatus, method for substrate alignment using such a structure, and substrate comprising such marker structure |
| 07/07/2010 | EP2204477A1 Method For Growth Of GaN Single Crystal, Method For Preparation Of GaN Substrate, Process For producing GaN-Based Element, and GaN-Based Element |
| 07/07/2010 | EP2204472A2 Methods for forming wiring and electrode |
| 07/07/2010 | EP2204399A2 Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same |
| 07/07/2010 | EP2204245A1 Method for assembling heat sink |
| 07/07/2010 | EP2203935A1 Filler cells for design optimization in a place-and-route system |
| 07/07/2010 | EP2203934A1 Method of manufacturing localized semiconductor-on-insulator (soi) structures in a bulk semiconductor wafer |
| 07/07/2010 | EP2203932A1 Method of manufacturing a structure comprising a substrate and a layer deposited on one of its faces |
| 07/07/2010 | EP2203931A1 Multilayer structure and method of producing the same |
| 07/07/2010 | EP1987536B1 Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns |
| 07/07/2010 | EP1844492B1 Non-volatile nanocrystal memory and method therefor |
| 07/07/2010 | EP1724819B1 Polishing agent and polishing method |
| 07/07/2010 | EP1512176B1 Die connected with integrated circuit component |
| 07/07/2010 | EP1157417B1 A method of manufacturing a semiconductor device |
| 07/07/2010 | CN201523003U Improved work bench dip angle adjusting structure |
| 07/07/2010 | CN201523002U Silicon wafer self-rotating system |
| 07/07/2010 | CN201523001U Focused ion beam machine added with optical inspection functions |
| 07/07/2010 | CN201523000U Fast-heat annealing machine platform |
| 07/07/2010 | CN201522999U Improved thin semiconductor chip cleaning and drying device |
| 07/07/2010 | CN201522998U Chip pickup and overturn device |
| 07/07/2010 | CN201522997U Cover opening device for encapsulated chip |
| 07/07/2010 | CN201522996U Sealing machine |