Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/20/2010US7759260 Selective nitridation of gate oxides
07/20/2010US7759259 Method of manufacturing semiconductor device
07/20/2010US7759258 Method for making solar cell
07/20/2010US7759257 Precision synthesis of quantum dot nanostructures for fluorescent and optoelectronic devices
07/20/2010US7759256 Micro-electro-mechanical system device and method for making same
07/20/2010US7759255 Semiconductor device and method for manufacturing the same
07/20/2010US7759254 Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device
07/20/2010US7759253 forming a first material layer on a substrate; forming a first patterned resist layer including an opening on the first material layer, forming a second material layer on the first patterned resist layer and the first material layer, forming a second patterned resist layer including an opening, etching
07/20/2010US7759252 Method of two-step backside etching
07/20/2010US7759251 Dual damascene integration structure and method for forming improved dual damascene integration structure
07/20/2010US7759249 Method of removing residue from a substrate
07/20/2010US7759248 Semiconductor memory device and method of fabricating the same
07/20/2010US7759247 Manufacturing method of semiconductor device with a barrier layer and a metal layer
07/20/2010US7759246 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
07/20/2010US7759245 Semiconductor device fabricating method
07/20/2010US7759244 Method for fabricating an inductor structure or a dual damascene structure
07/20/2010US7759243 Method for forming an on-chip high frequency electro-static discharge device
07/20/2010US7759242 Method of fabricating an integrated circuit
07/20/2010US7759241 Group II element alloys for protecting metal interconnects
07/20/2010US7759240 Use of palladium in IC manufacturing with conductive polymer bump
07/20/2010US7759239 Method of reducing a critical dimension of a semiconductor device
07/20/2010US7759238 Method for fabricating semiconductor device capable of adjusting the thickness of gate oxide layer
07/20/2010US7759237 Method of forming lutetium and lanthanum dielectric structures
07/20/2010US7759236 Flash memory device and method of manufacturing the same
07/20/2010US7759235 Semiconductor device manufacturing methods
07/20/2010US7759234 Method for fabricating semiconductor device with recess gate
07/20/2010US7759233 Methods for stressing semiconductor material structures to improve electron and/or hole mobility of transistor channels fabricated therefrom, and semiconductor devices including such structures
07/20/2010US7759232 Method of forming damascene patterns of semiconductor devices
07/20/2010US7759231 Method for producing metal/semiconductor contacts through a dielectric
07/20/2010US7759230 System for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts in overlap regions, and a mask for facilitating such artifact reduction/elimination
07/20/2010US7759229 Charge-free method of forming nanostructures on a substrate
07/20/2010US7759228 Semiconductor device and method of manufacturing the same
07/20/2010US7759227 Silicon semiconductor substrate heat-treatment method and silicon semiconductor substrate treated by the method
07/20/2010US7759225 Method for fabricating semiconductor layer and light-emitting diode
07/20/2010US7759224 Fabrication method of semiconductor integrated circuit device
07/20/2010US7759223 Semiconductor wafer and manufacturing process for semiconductor device
07/20/2010US7759222 Solid-state imaging device and method for fabricating the same
07/20/2010US7759221 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
07/20/2010US7759220 Method and structure for fabricating solar cells using a layer transfer process
07/20/2010US7759219 Method of manufacturing nitride semiconductor device
07/20/2010US7759218 Indented lid for encapsulated devices and method of manufacture
07/20/2010US7759217 Controlled process and resulting device
07/20/2010US7759216 Method for forming trench isolation
07/20/2010US7759215 Semiconductor device having STI without divot and its manufacture
07/20/2010US7759214 Semiconductor including STI and method for manufacturing the same
07/20/2010US7759213 Pattern independent Si:C selective epitaxy
07/20/2010US7759212 System-in-package having integrated passive devices and method therefor
07/20/2010US7759211 Method of fabricating semiconductor device
07/20/2010US7759210 Method for forming a MOS device with reduced transient enhanced diffusion
07/20/2010US7759208 Low temperature ion implantation for improved silicide contacts
07/20/2010US7759207 Integrated circuit system employing stress memorization transfer
07/20/2010US7759206 Methods of forming semiconductor devices using embedded L-shape spacers
07/20/2010US7759205 Methods for fabricating semiconductor devices minimizing under-oxide regrowth
07/20/2010US7759204 Process for high voltage superjunction termination
07/20/2010US7759203 MOS transistor having protruded-shape channel and method of fabricating the same
07/20/2010US7759202 Method for forming semiconductor device with gates of different materials
07/20/2010US7759201 Method for fabricating pitch-doubling pillar structures
07/20/2010US7759200 Method of forming lateral trench MOSFET with direct trench polysilicon contact
07/20/2010US7759199 Stressor for engineered strain on channel
07/20/2010US7759198 Method of forming semiconductor devices having a vertical channel transistor
07/20/2010US7759197 Method of forming isolated features using pitch multiplication
07/20/2010US7759196 Multi-bit non-volatile memory device, method of operating the same, and method of fabricating the same
07/20/2010US7759195 Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
07/20/2010US7759193 Methods of forming a plurality of capacitors
07/20/2010US7759192 Semiconductor device including capacitor and method of fabricating same
07/20/2010US7759191 Vertical SOI transistor memory cell and method of forming the same
07/20/2010US7759189 Method of manufacturing a dual contact trench capacitor
07/20/2010US7759188 Method of fabricating vertical body-contacted SOI transistor
07/20/2010US7759187 Metal plating using seed film
07/20/2010US7759186 Method for fabricating junction termination extension with formation of photosensitive dopant mask to control doping profile and lateral width for high-voltage electronic devices
07/20/2010US7759185 Semiconductor device and method of fabricating the same
07/20/2010US7759184 Laterally diffused metal oxide semiconductor device and method of forming the same
07/20/2010US7759183 Dual work function metal gates and methods of forming
07/20/2010US7759182 Dummy active area implementation
07/20/2010US7759181 Method of manufacturing a semiconductor device
07/20/2010US7759180 Display substrate and method of manufacturing the same
07/20/2010US7759179 Multi-gated, high-mobility, density improved devices
07/20/2010US7759178 Thin film transistor substrate and fabrication thereof
07/20/2010US7759177 Manufacturing method of semiconductor device
07/20/2010US7759176 Thin film transistor array panel and methods for manufacturing the same
07/20/2010US7759175 Fabrication method of a mixed substrate and use of the substrate for producing circuits
07/20/2010US7759174 Method of manufacturing a semiconductor device
07/20/2010US7759173 Methods for charge dissipation in integrated circuits
07/20/2010US7759172 Method of forming a planar combined structure of a bipolar junction transistor and n-type and p-type metal semiconductor field-effect transistors and method for forming the same
07/20/2010US7759171 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package
07/20/2010US7759170 Fabrication method of semiconductor package having heat dissipation device
07/20/2010US7759169 Integrated circuit heat spreader stacking method
07/20/2010US7759168 Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid
07/20/2010US7759167 Method for embedding dies
07/20/2010US7759166 Microelectronic packages fabricated at the wafer level and methods therefor
07/20/2010US7759165 Nanospring
07/20/2010US7759164 Semiconductor manufacturing method of die pick-up from wafer
07/20/2010US7759163 Semiconductor module
07/20/2010US7759162 Flip chip mounting process and flip chip assembly
07/20/2010US7759161 Semiconductor device and method of manufacturing thereof
07/20/2010US7759160 Method for producing conductor structures and applications thereof
07/20/2010US7759159 Variable resistance non-volatile memory cells and methods of fabricating same
07/20/2010US7759158 Scalable photovoltaic cell and solar panel manufacturing with improved wiring
07/20/2010US7759157 Gate oxide film structure for a solid state image pick-up device
07/20/2010US7759156 Image sensor and method for manufacturing the same
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