Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/14/2010CN101778919A Adhesive composition for semiconductor and semiconductor device manufactured using the same
07/14/2010CN101778882A 环氧树脂组合物 The epoxy resin composition
07/14/2010CN101778787A Air blowout structure and air blowout unit for air-floating conveyor apparatus, and air-floating conveyor apparatus having the same
07/14/2010CN101777698A On-chip antenna structure in integrated circuit and manufacturing method thereof
07/14/2010CN101777587A Drift step recovery diode and preparation method thereof
07/14/2010CN101777586A Hybrid junction source/drain field effect transistor and preparation method thereof
07/14/2010CN101777585A Junction field effect transistor and manufacturing method thereof
07/14/2010CN101777582A LDMOS device capable of improving grid oxygen reliability and manufacture method thereof
07/14/2010CN101777580A Tunneling field-effect transistor and manufacturing method thereof
07/14/2010CN101777578A Structure and manufacturing method of lateral bipolar transistor
07/14/2010CN101777575A Organic light emitting diode display and method of manufacturing the same
07/14/2010CN101777571A Array structure of phase-change memory and preparation method thereof
07/14/2010CN101777570A Semiconductor memory structure utilizing self-aligning process and manufacturing method thereof
07/14/2010CN101777568A CMOS (Complementary Metal-Oxide-Semiconductor Transistor)-process compatible grid-control p-n junction forward-direction injection type silicon light-emitting device and production method thereof
07/14/2010CN101777565A Self-powered low power consumption integrated circuit chip and preparation method thereof
07/14/2010CN101777564A SOI CMO device with vertical grid structure
07/14/2010CN101777563A Nonvolatile storage unit
07/14/2010CN101777562A Non-volatile semiconductor memory with floating gate and manufacturing method thereof
07/14/2010CN101777561A Split-gate type nonvolatile storage and production method thereof
07/14/2010CN101777560A Memory array and method for manufacturing the same
07/14/2010CN101777558A Semiconductor memory and manufacturing method thereof
07/14/2010CN101777557A Semiconductor circuit structure and manufacturing method thereof
07/14/2010CN101777556A Trench large-power MOS part and manufacturing method thereof
07/14/2010CN101777551A Polycrystalline light emitting diode
07/14/2010CN101777549A Packaging module structure of compound semiconductor elements and production method thereof
07/14/2010CN101777548A Substrate with built-in chip and manufacturing method thereof
07/14/2010CN101777547A Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent
07/14/2010CN101777544A P-type silicon carbide device and method for improving ohmic contact performance thereof
07/14/2010CN101777543A 半导体器件 Semiconductor devices
07/14/2010CN101777542A Chip packaging structure and packaging method
07/14/2010CN101777522A Semiconductor device and method for manufacturing semiconductor device
07/14/2010CN101777521A Manufacturing method of split-gate type flash memory of shared word line
07/14/2010CN101777520A Production method of split-gate type nonvolatile storage of embedded floating gate
07/14/2010CN101777519A Split-gate type nonvolatile storage and production method thereof
07/14/2010CN101777518A Method for improving integral parameter of gate oxide layer
07/14/2010CN101777517A Method for manufacturing memory
07/14/2010CN101777516A Fabrication process for semiconductor integrated circuit
07/14/2010CN101777515A Manufacturing method of semiconductor memory
07/14/2010CN101777514A Trench semiconductor power device and preparation method thereof
07/14/2010CN101777513A Method for improving growth of gate oxide layer and manufacture method of shallow groove isolating process
07/14/2010CN101777512A Local interconnect structure for a CMOS image sensor and its manufacturing method
07/14/2010CN101777511A Etching method for forming through hole
07/14/2010CN101777510A Method for repairing damaged corners of shallow-channel isolation groove
07/14/2010CN101777509A Alignment apparatus for semiconductor wafer
07/14/2010CN101777508A System and method for picking out defective circuit small pieces
07/14/2010CN101777507A Random test method for complexly controlled chips
07/14/2010CN101777506A Complex frequency sandwich structure ultrasonic transducer
07/14/2010CN101777505A Rotating lead bonding joint device
07/14/2010CN101777504A System level packaging method of flip chip and attached passive element on support plate chip
07/14/2010CN101777503A Solder ball printer
07/14/2010CN101777502A Packaging method of inverted chip
07/14/2010CN101777501A Assembling method of image capturing device
07/14/2010CN101777500A Power MOS tube and manufacturing method thereof
07/14/2010CN101777499A Method for self-aligned preparation of tunneling field-effect transistors (TFETs) on basis of planar technology
07/14/2010CN101777498A Method for forming epitaxial wafer with superficial epitaxial layer and epitaxial wafer thereof
07/14/2010CN101777497A Production method of power MOS field-effect tube
07/14/2010CN101777496A Method for manufacturing nMOS (n-channel Metal Oxide Semiconductor) transistor
07/14/2010CN101777495A Method for improving rounding of active area corner
07/14/2010CN101777494A Method for manufacturing semiconductor devices
07/14/2010CN101777493A Hard mask layer etching method
07/14/2010CN101777492A Plasma processing method
07/14/2010CN101777491A Method for opening contact hole
07/14/2010CN101777490A Method forming doped layer on wafer
07/14/2010CN101777489A Method for automatically controlling stability of ion injection process
07/14/2010CN101777488A Growth method for obtaining high aluminium component Al-Ga-N alloys by improving aluminium doping efficiency
07/14/2010CN101777487A Gas-tight module and exhaust method therefor
07/14/2010CN101777486A A hot wind type oven container and an oven having the same
07/14/2010CN101777485A Etching method
07/14/2010CN101777424A Photoetching preparation method of PVDF (Polyvinylidene Fluoride) organic polymer film capacitor
07/14/2010CN101777295A Detection line wiring method and manufacturing method of OLED (Organic Light Emitting Diode) display
07/14/2010CN101776850A Exposure system and device production method
07/14/2010CN101776808A Liquid crystal display array base plate and patching method thereof
07/14/2010CN101775658A Compound semiconductor material doped with rare-earth elements and growth method thereof
07/14/2010CN101775257A Rough polishing solution and rough polishing method used for GaAs wafer
07/14/2010CN101775256A Chemical mechanical polishing solution
07/14/2010CN101774307A Dual-rail dual-head laser marking mechanism
07/14/2010CN101774155A Grinding wheel spindle inclination angle adjusting structure
07/14/2010CN101774149A Wire saw, and system for wire saw
07/14/2010CN101773921A Test cell conditioner (tcc) surrogate cleaning device and method thereof
07/14/2010CN101773917A Silicon slice cleaning device and method
07/14/2010CN101533789B Technology of preventing falling taint of mobile phone module
07/14/2010CN101515576B COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling theCOF packaging structure thereof
07/14/2010CN101494193B Thin-film solar cell module and method of manufacturing the same
07/14/2010CN101488467B High voltage stress test circuit
07/14/2010CN101464603B Liquid crystal display device
07/14/2010CN101414564B Method for manufacturing low-temperature polycrystalline silicon film transistor
07/14/2010CN101409243B Method for implementing thick copper wire down-lead bonding
07/14/2010CN101399200B Method for manufacturing silicon diode PN junction by same diffusion process of P and N paper sources
07/14/2010CN101393875B Force compensation method for keying head of full-automatic wire keying machine
07/14/2010CN101383328B Passivation film of composite semiconductor silicon device and passivation generating process
07/14/2010CN101369551B Process controls for improved wafer uniformity using integrated or standalone metrology
07/14/2010CN101359609B Device and method for putting solder fill head on template
07/14/2010CN101345248B Multi-optical spectrum light-sensitive device and preparation thereof
07/14/2010CN101345225B Electronic component and method of forming the same
07/14/2010CN101318309B CMP systems and methods utilizing amine-contained polymer
07/14/2010CN101315900B Packaging method for LED with high cooling efficiency and packaging structure thereof
07/14/2010CN101295717B Thin-film transistor panel and its production method
07/14/2010CN101295630B Substrate treatment apparatus
07/14/2010CN101271944B LED wafer encapsulation body and encapsulation thereof
07/14/2010CN101262001B Image sensor and method for manufacturing thereof