Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/01/2010US20100167480 Method for Manufacturing Flash Memory Device
07/01/2010US20100167479 Embedded trap direct tunnel non-volatile memory
07/01/2010US20100167478 Field effect transistor having reduced cotnact resistance and method for fabricating the same
07/01/2010US20100167477 Localized temperature control during rapid thermal anneal
07/01/2010US20100167476 Photoresist composition and method of fabricating thin film transistor substrate
07/01/2010US20100167475 Semiconductor device and producing method thereof
07/01/2010US20100167474 Methods of Forming Semiconductor-On-Insulating (SOI) Field Effect Transistors with Body Contacts
07/01/2010US20100167473 Semiconductor device and fabrication method for the semiconductor device
07/01/2010US20100167472 Implantation shadowing effect reduction using thermal bake process
07/01/2010US20100167471 Reducing warpage for fan-out wafer level packaging
07/01/2010US20100167470 Power module for low thermal resistance and method of fabricating the same
07/01/2010US20100167469 Resin sealing method of semiconductor device
07/01/2010US20100167468 Method of manufacturing semiconductor device
07/01/2010US20100167467 Method for fabricating semiconductor device
07/01/2010US20100167466 Semiconductor package substrate with metal bumps
07/01/2010US20100167465 Multiphase synchronous buck converter
07/01/2010US20100167464 Semiconductor device and manufacturing method thereof
07/01/2010US20100167462 Method for manufacturing resistance ram device
07/01/2010US20100167454 Double-sided donor for preparing a pair of thin laminae
07/01/2010US20100167446 Method for Manufacturing a Junction
07/01/2010US20100167443 Active matrix substrate, method of making the substrate, and display device
07/01/2010US20100167442 Array substrate for display device and method of manufacturing the same
07/01/2010US20100167439 Method of manufacturing printing plate and method of manufacturing liquid crystal display device using the same
07/01/2010US20100167438 Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
07/01/2010US20100167437 Peeling method and method for manufacturing display device using the peeling method
07/01/2010US20100167436 Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
07/01/2010US20100167433 Piezoelectric inkjet printhead and method of manufacturing the same
07/01/2010US20100167432 Method of manufacturing semiconductor device
07/01/2010US20100167431 Laser processing apparatus
07/01/2010US20100167430 Apparatus and method for testing a transducer and/or electronic circuitry associated with a transducer
07/01/2010US20100167429 Method of manufacturing semiconductor device
07/01/2010US20100167428 Method and system for determining semiconductor characteristics
07/01/2010US20100167427 Passive device trimming
07/01/2010US20100167426 Plasma etching apparatus and plasma etching method
07/01/2010US20100167425 Method of producing bonded silicon wafer
07/01/2010US20100167424 Variable thickness single mask etch process
07/01/2010US20100167423 Semiconductor package and methods of manufacturing the same
07/01/2010US20100167224 Drying furnace for cated film
07/01/2010US20100167207 Chemically amplified positive resist composition and resist patterning process
07/01/2010US20100167186 Extreme ultraviolet photomask and methods and apparatuses for manufacturing the extreme ultraviolet photomask
07/01/2010US20100167183 Method and apparatus for performing model-based layout conversion for use with dipole illumination
07/01/2010US20100166957 Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
07/01/2010US20100166536 Apparatus for the separating of stacked plate-shaped elements
07/01/2010US20100166535 System and method for separating defective dies from wafer
07/01/2010US20100166529 Pick and place handler with a floating lock device
07/01/2010US20100166361 Buried dual taper waveguide for passive alignment and photonic integration
07/01/2010US20100165757 Semiconductor memory device
07/01/2010US20100165746 Semiconductor memory cell, method for manufacturing the same and method for operating the same
07/01/2010US20100165737 Electromechanical memory devices and methods of manufacturing the same
07/01/2010US20100165736 Flash memory device and manufacturing method of the same
07/01/2010US20100165706 Static memory cell having independent data holding voltage
07/01/2010US20100165705 Semiconductor integrated circuit
07/01/2010US20100165700 One time programmable memory device and manufacturing method of one time programmable memory device
07/01/2010US20100165581 Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
07/01/2010US20100165340 Spectroscopic scatterometer system
07/01/2010US20100165056 Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack
07/01/2010US20100165048 Forming nozzles
07/01/2010US20100164854 Gate Drive Circuit, Display Device Having the Same and Method of Manufacturing the Gate Drive Circuit
07/01/2010US20100164610 Multiple circuit blocks with interblock control and power conservation
07/01/2010US20100164604 Fuse circuit and layout designing method thereof
07/01/2010US20100164543 Low-complexity electronic adder circuits and methods of forming the same
07/01/2010US20100164369 Apparatus of organic light emitting diode and packaging method of the same
07/01/2010US20100164155 Fixing jig and method of processing work
07/01/2010US20100164125 Method of evaluating the flame retardancy of sealing resin and test sample for evaluation of flame retardancy
07/01/2010US20100164123 Local silicidation of via bottoms in metallization systems of semiconductor devices
07/01/2010US20100164122 Method of forming conductive layer and semiconductor device
07/01/2010US20100164121 Metallization system of a semiconductor device comprising extra-tapered transition vias
07/01/2010US20100164120 Through-hole electrode substrate and method of manufacturing the same
07/01/2010US20100164119 Semiconductor device and method of manufacturing the same
07/01/2010US20100164118 Method for fabricating semiconductor device including metal contact
07/01/2010US20100164117 Through-Silicon Via With Air Gap
07/01/2010US20100164116 Electromigration resistant via-to-line interconnect
07/01/2010US20100164115 Semiconductor chip package
07/01/2010US20100164114 Wire Structure of Semiconductor Device and Method for Manufacturing the Same
07/01/2010US20100164113 Method for forming copper wiring in semiconductor device
07/01/2010US20100164111 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
07/01/2010US20100164110 Metal silicide nanowires and methods for their production
07/01/2010US20100164107 SEMICONDUCTOR DEVICE HAVING MULTILAYERED INTERCONNECTION STRUCTURE FORMED BY USING Cu DAMASCENE METHOD, AND METHOD OF FABRICATING THE SAME
07/01/2010US20100164106 CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method
07/01/2010US20100164105 Semiconductor device and method of manufacturing the same
07/01/2010US20100164104 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
07/01/2010US20100164102 Isolated germanium nanowire on silicon fin
07/01/2010US20100164100 Bump-on-Lead Flip Chip Interconnection
07/01/2010US20100164098 Semiconductor device including a cost-efficient chip-package connection based on metal pillars
07/01/2010US20100164097 Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch
07/01/2010US20100164096 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
07/01/2010US20100164095 Semiconductor device and method for manufacturing of same
07/01/2010US20100164093 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside
07/01/2010US20100164092 Semiconductor process, and silicon substrate and chip package structure applying the same
07/01/2010US20100164091 System-in-package packaging for minimizing bond wire contamination and yield loss
07/01/2010US20100164089 Non-Conductive Planarization of Substrate Surface for Mold Cap
07/01/2010US20100164086 Semiconductor device and manufacturing method thereof
07/01/2010US20100164085 Multi-die building block for stacked-die package
07/01/2010US20100164083 Protective thin film coating in chip packaging
07/01/2010US20100164082 Manufacturing method for semiconductor devices and semiconductor device
07/01/2010US20100164081 Micro-Optical Device Packaging System
07/01/2010US20100164079 Method of manufacturing an assembly and assembly
07/01/2010US20100164078 Package assembly for semiconductor devices
07/01/2010US20100164077 Semiconductor device and method of manufacturing same
07/01/2010US20100164075 Trench forming method and structure
1 ... 1747 1748 1749 1750 1751 1752 1753 1754 1755 1756 1757 1758 1759 1760 1761 1762 1763 1764 1765 1766 1767 ... 6590