Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/01/2010DE102008059650A1 Mikrostruktur mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten zwischen dichtliegenden Metallleitungen Microstructure with a metallization with self-aligned air gaps between closely spaced metal lines
07/01/2010DE102008059503A1 Leistungsverbesserung in Metallisierungssystemen von Mikrostrukturbauelementen durch Einbau von Metallstrukturen mit größeren Korngrenzen Improving performance in metallization microstructure devices by the incorporation of metal structures with larger grain boundaries
07/01/2010DE102008059499A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit Luftspalten, die zusammen mit Kontaktdurchführungen hergestellt sind Microstructure component having a metallization structure with air gaps, which are produced together with vias
07/01/2010DE102008055155A1 Trennverfahren für ein Schichtsystem umfassend einen Wafer Separation method for a layer system comprising a wafer
07/01/2010DE102008055138A1 Hochtemperaturbeständige lötmittelfreie Bauelementstruktur und Verfahren zum elektrischen Kontaktieren High temperature resistant lötmittelfreie device structure and method for making electrical contact
07/01/2010DE102008055137A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component
07/01/2010DE102008055134A1 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils The electrical or electronic composite component as well as methods of making an electrical or electronic composite component
07/01/2010DE102008054982A1 Wafer-Chuck für die EUV-Lithographie Wafer chuck for EUV lithography
07/01/2010DE102008053610A1 Verfahren zum beidseitigen Polieren einer Halbleiterscheibe A method for double-sided polishing of a semiconductor wafer
07/01/2010DE102008049775A1 Metalldeckschicht mit besserer Ätzwiderstandsfähigkeit für kupferbasierte Metallgebiete in Halbleiterbauelementen Metal coating layer with better etch resistivity of copper-based metal regions in semiconductor devices
07/01/2010DE102008049727A1 Kontaktelemente und Kontaktdurchführungen eines Halbleiterbauelements, die durch eine Hartmaske und Doppelbelichtung hergestellt sind Contact elements and vias of a semiconductor device made by a hard mask and double exposure
07/01/2010DE102006015086B4 Verfahren zur Herstellung äußerst flacher Übergänge mit hoher Qualität durch eine Kombination einer Festphasenepitaxie und einer Laserausheizung A process for producing extremely shallow junctions with high quality by a combination of a solid phase epitaxy and a Laserausheizung
07/01/2010DE102005063113B4 Verfahren zum Herstellen eines Bildsensors A method of manufacturing an image sensor,
07/01/2010DE102004056350B4 Herstellungsverfahren für eine Halbleitervorrichtung mit einem Kondensator, der einen gestuften zylindrischen Aufbau aufweist Manufacturing method of a semiconductor device having a capacitor which has a stepped cylindrical configuration
07/01/2010DE10142317B4 Vorrichtung zur Bestimmung eines Überlagerungsfehlers und kritischer Dimensionen in einer Halbleiterstruktur mittels Streuungsmessung Means for determining a critical dimension and overlay error in a semiconductor structure by means of scattering measurement
07/01/2010DE10126800B4 Verfahren und Vorrichtung zum Testen der ESD-Festigkeit eines Halbleiter-Bauelements Method and device for testing the ESD immunity of a semiconductor device
07/01/2010DE10000365B4 Spannungskontrastverfahren zum Nachweis von Defekten in einem strukturiertem Substrat Voltage contrast method for detecting defects in a textured substrate
07/01/2010CA2748240A1 Method and device for measuring temperature during deposition of semiconductor
07/01/2010CA2748175A1 Liquid resin composition and semiconductor device
07/01/2010CA2747574A1 Manufacturing of low defect density free-standing gallium nitride substrates and devices fabricated thereof
06/2010
06/30/2010EP2202802A1 Driver circuit and semiconductor device
06/30/2010EP2202800A1 VTS insulated gate bipolar transistor
06/30/2010EP2202795A1 Method for fabricating a semiconductor substrate and semiconductor substrate
06/30/2010EP2202794A2 Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETs, structure and method
06/30/2010EP2202791A2 Semiconductor device having deep through vias
06/30/2010EP2202789A1 Stack of molded integrated circuit dies with side surface contact tracks
06/30/2010EP2202788A2 Separating method for a layer structure comprising a wafer
06/30/2010EP2202787A1 Thin film active element, organic light emitting device, display device, electronic device and method for manufacturing thin film active element
06/30/2010EP2202786A1 Plasma film forming apparatus
06/30/2010EP2202785A1 Plasma treatment apparatus, plasma treatment method, and semiconductor element
06/30/2010EP2202784A2 Method for manufacturing a junction
06/30/2010EP2202783A2 Capacitor and method for fabricating the same
06/30/2010EP2202782A2 Micro-Bubble generating device
06/30/2010EP2202704A1 Radio frequency data communications device
06/30/2010EP2202578A1 Etching resist
06/30/2010EP2202577A1 Chemically amplified positive resist composition and resist patterning process
06/30/2010EP2202329A1 Iii nitride structure and method for manufacturing iii nitride semiconductor fine columnar crystal
06/30/2010EP2201608A2 Type ii quantum dot solar cells
06/30/2010EP2201602A1 Alignment features for proximity communication
06/30/2010EP2201601A1 Non-volatile semiconductor storage device and method of manufacturing the same
06/30/2010EP2201600A1 Method for producing electrical interconnects and devices made thereof
06/30/2010EP2201599A2 Reconfigurable connections for stacked semiconductor devices
06/30/2010EP2201598A1 Semiconductor component comprising a polycrystalline semiconductor layer
06/30/2010EP2201597A1 Apparatus for wet treatment of plate-like articles
06/30/2010EP2201345A1 Intravascular pressure devices incorporating sensors manufactured using deep reactive ion etching
06/30/2010EP2201340A1 Semiconductor wafer metrology apparatus and method
06/30/2010EP2201148A2 Application of hipims to through silicon via metallization in three-dimensional wafer packaging
06/30/2010EP2200936A2 Silicon dioxide dispersion and process for coating substrates
06/30/2010EP2200934A1 Nanowire growth on dissimilar material
06/30/2010EP2200790A1 Production line module for forming multiple sized photovoltaic devices
06/30/2010EP1817445B1 Method for making a dismountable substrate
06/30/2010EP1500140B1 Integrated circuit with integrated capacitor
06/30/2010EP1483782B1 Production method of sic monitor wafer
06/30/2010EP1236275B1 Variable load switchable impedance matching system
06/30/2010EP1017873B1 Single body injector and deposition chamber
06/30/2010CN201518315U Plastic-sealed diode tinning positioning fixture
06/30/2010CN201518314U Diode sliver thimble frame
06/30/2010CN201518313U Device for preventing lead frame magazine for semiconductor device from being reversed
06/30/2010CN201516648U Wafer splitting and leveling device
06/30/2010CN201516579U 精密研磨工具 Precision grinding tools
06/30/2010CN201516428U Diode ultrasonic cleaning bracket
06/30/2010CN1965265B Chemically amplified resist composition and method for forming resist pattern
06/30/2010CN1909200B Semiconductor structure with improved on resistance and breakdown voltage performance
06/30/2010CN101765973A Semiconductor integrated circuit device, communication device, information reproducing device, image display device, electronic device, electronic control device, and mobile body
06/30/2010CN101765917A Display device and electronic device having the display device, and method for manufacturing thereof
06/30/2010CN101765912A Method for producing an electronic component and electronic component
06/30/2010CN101765910A Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device
06/30/2010CN101765909A Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet
06/30/2010CN101765908A Method for manufacturing semiconductor device, semiconductor device, and exposure apparatus
06/30/2010CN101765907A Organic transistor, organic transistor array and display apparatus
06/30/2010CN101765906A Organic transistor, organic transistor array, and display device
06/30/2010CN101765905A Process for producing semiconductor device
06/30/2010CN101765904A Film forming method for a semiconductor
06/30/2010CN101765903A Method of processing a high-k dielectric for CET scaling
06/30/2010CN101765902A Apparatus for generating dielectric barrier discharge gas
06/30/2010CN101765901A Bonded wafer manufacturing method
06/30/2010CN101765900A Method and apparatus for cleaning a substrate surface
06/30/2010CN101765810A Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film and semiconductor device
06/30/2010CN101765680A Treating-gas supply system and treating apparatus
06/30/2010CN101765679A Conformal doping using high neutral plasma implant
06/30/2010CN101765647A Compositions and methods for chemical-mechanical polishing of phase change materials
06/30/2010CN101765646A Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device
06/30/2010CN101765561A Porous silica precursor composition and method for preparing the same, porous silica film and method for forming the same, semiconductor device, image display device, and liquid crystal display device
06/30/2010CN101765490A Anti-dropping mechanism for molded product
06/30/2010CN101765350A High-power radiating module
06/30/2010CN101765341A Molding structure and method for laser-assisting base plate line
06/30/2010CN101764198A Shadow mask and fabrication method thereof
06/30/2010CN101764197A Method for manufacturing nano-sized phase change memory
06/30/2010CN101764196A Method for manufacturing nano-scale phase change memory
06/30/2010CN101764195A Method for making nano-sized phase change memory
06/30/2010CN101764185A Semiconductor device and method for manufacturing semiconductor device
06/30/2010CN101764184A Device and method for welding cooling of light-emitting diode
06/30/2010CN101764178A Preparation method for silicon-based solar energy thin film
06/30/2010CN101764161A Device for protecting semiconductor device from electrostatic discharge and method for fabricating the same
06/30/2010CN101764160A Semiconductor device
06/30/2010CN101764159A Metallic oxide semiconductor field effect tube with reduced breakdown voltage
06/30/2010CN101764158A Body contacted hybrid surface semiconductor-on-insulator devices and methods
06/30/2010CN101764157A Silicon-on-insulator lateral double-diffused metallic oxide semiconductor tube and preparation method
06/30/2010CN101764156A Tunneling transistor using source electrode made of narrow forbidden-band gap material and manufacturing method thereof
06/30/2010CN101764155A Grooved field-effect tube and preparation method thereof