Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/07/2010US7790519 Semiconductor device and manufacturing method thereof
09/07/2010US7790518 Method of trimming semiconductor elements with electrical resistance feedback
09/07/2010US7790517 Method of manufacturing semiconductor device
09/07/2010US7790516 Method of manufacturing at least one semiconductor component and memory cells
09/07/2010US7790515 Semiconductor device with no base member and method of manufacturing the same
09/07/2010US7790514 Manufacturing process for a chip package structure
09/07/2010US7790513 Substrate based unmolded package
09/07/2010US7790512 Molded leadframe substrate semiconductor package
09/07/2010US7790511 Method for direct heat sink attachment
09/07/2010US7790510 Metal lid with improved adhesion to package substrate
09/07/2010US7790509 Method for fine-pitch, low stress flip-chip interconnect
09/07/2010US7790508 constructing strip-like electrically conducting contacts on a semiconductor component such as a solar cell, by applying an electrically conducting paste-like substance containing a solvent adhering to a support and subsequent hardening of the substance
09/07/2010US7790507 Semiconductor die collet and method
09/07/2010US7790506 Method of manufacturing semiconductor devices encapsulated in chip size packages
09/07/2010US7790505 Semiconductor chip package manufacturing method and structure thereof
09/07/2010US7790504 Integrated circuit package system
09/07/2010US7790503 Semiconductor device and method of forming integrated passive device module
09/07/2010US7790502 Method of manufacturing flexible semiconductor assemblies
09/07/2010US7790501 Semiconductor chip passivation structures and methods of making the same
09/07/2010US7790500 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
09/07/2010US7790499 Observation apparatus and method for observing void in underfill resin
09/07/2010US7790497 Method to prevent alloy formation when forming layered metal oxides by metal oxidation
09/07/2010US7790496 Method of improving solid-state image sensor sensitivity
09/07/2010US7790495 Optoelectronic device with germanium photodetector
09/07/2010US7790494 Method of fabricating a multi-bit electro-mechanical memory device
09/07/2010US7790493 Wafer-level, polymer-based encapsulation for microstructure devices
09/07/2010US7790492 Method for fabricating a transducer package with the transducer die unsupported by a substrate
09/07/2010US7790491 Method for forming non-volatile memory cells and related apparatus and system
09/07/2010US7790490 Surface micromechanical process for manufacturing micromachined capacitive ultra-acoustic transducers and relevant micromachined capacitive ultra-acoustic transducer
09/07/2010US7790489 III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer
09/07/2010US7790488 Method for fabricating an in-plane switching mode liquid crystal display device
09/07/2010US7790487 Method for fabricating photo sensor
09/07/2010US7790486 Light emitting device and method of manufacturing the same
09/07/2010US7790485 Semiconductor light emitting device and method of manufacturing the same
09/07/2010US7790484 Method for manufacturing laser devices
09/07/2010US7790483 Thin film transistor and manufacturing method thereof, and display device and manufacturing method thereof
09/07/2010US7790482 Light emitting diode package with diffuser and method of manufacturing the same
09/07/2010US7790481 Compound semiconductor light-emitting device and production method thereof
09/07/2010US7790480 predetermined wavelength reflectance is measured and peak heights and valleys in vicinity of predetermined wavelength are tabulated; relative swing ratio is computed as average peak height of spectra at exposure wavelength; ratio is compared to other processes to determine best critical dimension control
09/07/2010US7790478 Manufacturing method of semiconductor integrated circuit device
09/07/2010US7790477 contaminants from surfaces of temperature sensitive substrates, such as glass substrates, are removed by exposing the surfaces to a hydrogen surface-mixed diffusion flame for a predetermined duration of time; for flat panel displays
09/07/2010US7790476 Ferroelectric memory device and fabrication process thereof, fabrication process of a semiconductor device
09/07/2010US7790469 A conductive layer, a noble metal, and an anodized porous aluminum oxide layer on a substrate, and the pores having been etched to form a nanoarray; portable optical sensor for Surface Enhanced (Resonance) Raman Spectroscopy to provide ultrasensitive trace chemical detection
09/07/2010US7790360 Methods of forming multiple lines
09/07/2010US7790359 when the sealing rubber is pressed the thin negative resist layer bends because it is made from a flexible resin and capillary phenomenon occurs ao sealing rubber is elastically deformed when entering the plating pattern; thus plating solution does not leak; electrode on semiconductor wafer
09/07/2010US7790358 decreases the number of the steps by performing the process under a dry condition, reducing the cost and the environmental burden
09/07/2010US7790356 ArF excimer laser beam (193 nm); lithography; photoresist; organic copolymer of pyrimidinetrione, imidazolidinedione, imidazolidinetrione or triazinetrione units and a diepoxide, and also a diacid to form a copolyester; solvent
09/07/2010US7790341 Provides two-block laser mask capable of preventing or minimizing a shot mark by sequential irradiation of each block with two different lasers; liquid crystal displays, light emitting diodes; Flat panel displays having a polycrystalline silicon thin film transistor as a switching device
09/07/2010US7790337 Auxiliary pattern for increasing the contrast of light intensity distribution on imaging face of the exposing light having passed through the principal pattern disposed away from principal pattern by a distance of 0.8xMx lambda/NA (wavelength, reduction optical system of a projection aligner
09/07/2010US7790335 Photomask and manufacturing method of semiconductor device
09/07/2010US7790227 photoresists; semiconductors
09/07/2010US7790219 forming ink jet printed pillars, arranging pillars such that positions of pillars control flow of liquid, forming fluidic template; dispensing liquid into template such that liquid assumes shape, and drying; semiconductors
09/07/2010US7790052 Substrate receiving method
09/07/2010US7790047 making integrated circuits; exposing the masking material to a first ammonia plasma for a first period of time; and then exposing to a second oxygen plasma; prevent damage on vertical sidewall
09/07/2010US7789993 Internal balanced coil for inductively coupled high density plasma processing chamber
09/07/2010US7789992 Neutral beam etching device for separating and accelerating plasma
09/07/2010US7789991 Lag control
09/07/2010US7789963 Chuck pedestal shield
09/07/2010US7789961 Delivery device comprising gas diffuser for thin film deposition
09/07/2010US7789647 Processing apparatus and method
09/07/2010US7789614 Aligner
09/07/2010US7789577 Coating and developing system, coating and developing method and storage medium
09/07/2010US7789575 Optical device, optical device apparatus, camera module, and optical device manufacturing method
09/07/2010US7789558 Thermal sensing circuit using bandgap voltage reference generators without trimming circuitry
09/07/2010US7788976 Semiconductor acceleration sensor device and method for manufacturing the same
09/07/2010US7788942 controlling distribution of a resource, such as refrigerant, among a plurality of consumers, such as refrigerators, is provided by computing an available quantity of refrigerant and computing a demand of refrigerant by each of refrigerators and redistributing refrigerant accordingly
09/05/2010CA2694777A1 Feature forming process using acid-containing composition
09/05/2010CA2694775A1 Feature forming process using plasma treatment
09/02/2010WO2010099455A2 Glass substrate orientation inspection methods and systems for photo voltaics production
09/02/2010WO2010099350A2 Low cost bonding technique for integrated circuit chips and pdms structures
09/02/2010WO2010099340A2 Time dependent - temperature independent color changing label
09/02/2010WO2010099220A2 Methods for fabricating high aspect ratio probes and deforming high aspect ratio nanopillars and micropillars
09/02/2010WO2010099216A2 Methods for fabrication of high aspect ratio micropillars and nanopillars
09/02/2010WO2010099072A2 Methods of forming integrated circuits and resulting structures
09/02/2010WO2010099045A1 Defect healing in semiconductor on insulator by amorphization and regrowth
09/02/2010WO2010098952A1 Material infusion in a trap layer structure using gas cluster ion beam processing
09/02/2010WO2010098907A1 Back contact sliver cells
09/02/2010WO2010098876A2 Digital metamorphic alloys for graded buffers
09/02/2010WO2010098742A1 Trench device structure and fabrication
09/02/2010WO2010098604A2 Annealing apparatus using plasma
09/02/2010WO2010098558A2 Probe block
09/02/2010WO2010098515A1 Carrier head for a bare silicon wafer polishing apparatus
09/02/2010WO2010098501A1 Semiconductor device and method of producing same
09/02/2010WO2010098500A1 Semiconductor device and method for producing the same
09/02/2010WO2010098493A1 Resist composition for negative-tone development and pattern forming method using the same
09/02/2010WO2010098483A1 Plasma light source and plasma light generating method
09/02/2010WO2010098474A1 Optical element holding device, optical system, exposure apapratus, device manufacturing method, and interchange method for optical element
09/02/2010WO2010098427A1 Vacuum heating device, vacuum heat treatment method
09/02/2010WO2010098372A1 Field effect transistor
09/02/2010WO2010098371A1 Exposure apparatus
09/02/2010WO2010098352A1 Process for producing porous quartz glass object, and optical member for euv lithography
09/02/2010WO2010098324A1 Method of producing semiconductor device
09/02/2010WO2010098315A1 Probe card substrate, probe card laminated body, and probe card equipped with said probe card laminated body and probe
09/02/2010WO2010098312A1 Photosensitive resin composition
09/02/2010WO2010098299A1 Optical element retaining device, optical system, and exposure device
09/02/2010WO2010098294A1 Silicon carbide semiconductor device
09/02/2010WO2010098278A1 Composition for metal film polishing
09/02/2010WO2010098263A1 Substrate treatment device and treatment method
09/02/2010WO2010098258A1 Inductor element and integrated circuit device
09/02/2010WO2010098234A1 Wafer bonding apparatus and method of bonding wafers