Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/09/2010US20100227445 Method of fabricating metal oxide semiconductor transistor
09/09/2010US20100227444 Mask, method for manufacturing the same, and method for manufacturing semiconductor device
09/09/2010US20100227443 Method of forming polycrystalline silicon layer
09/09/2010US20100227442 Method of manufacturing thin film transistor
09/09/2010US20100227441 Method of manufacturing memory devices
09/09/2010US20100227440 Phase change memory device resistant to stack pattern collapse and a method for manufacturing the same
09/09/2010US20100227439 Phase change memory device resistant to stack pattern collapse and a method for manufacturing the same
09/09/2010US20100227438 Resistance variable memory device and method of fabricating the same
09/09/2010US20100227437 Semiconductor devices grown in spherical cavity arrays and its preparation method
09/09/2010US20100227436 Method of fabricating a semiconductor package with mold lock opening
09/09/2010US20100227435 Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
09/09/2010US20100227433 Electroconductive thick film composition, electrode, and solar cell formed therefrom
09/09/2010US20100227432 Method for selective under-etching of porous silicon
09/09/2010US20100227431 Crystalline silicon solar cells on low purity substrate
09/09/2010US20100227429 Fabrication of image sensor with improved signal to noise ratio
09/09/2010US20100227426 Liquid Crystal Display Array Substrate and Its Manufacturing Method
09/09/2010US20100227425 Manufacturing method of liquid crystal display device
09/09/2010US20100227422 Method for manufacturing organic electroluminescence device
09/09/2010US20100227421 Method of bonding a semiconductor device using a compliant bonding structure
09/09/2010US20100227420 Inductively coupled plasma reactor having rf phase control and methods of use thereof
09/09/2010US20100227416 Nano-Scale Bridge Biosensors
09/09/2010US20100227278 Manufacturing process of semiconductor device
09/09/2010US20100226745 Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods for Picking Up Semiconductor Dies
09/09/2010US20100226737 Substrate transfer apparatus and substrate transfer method
09/09/2010US20100226736 Stacked Load-Lock Apparatus and Method for High Throughput Solar Cell Manufacturing
09/09/2010US20100226407 Laser media with controlled concentration profile of active laser ions and method of making the same
09/09/2010US20100226402 Laser diode and method of manufacturing the same
09/09/2010US20100226401 Nitride compound semiconductor element and method for manufacturing same
09/09/2010US20100226195 Integrated circuit self aligned 3d memory array and manufacturing method
09/09/2010US20100226169 Stram with compensation element and method of making the same
09/09/2010US20100226134 Methods and Apparatus for Improving Collimation of Radiation Beams
09/09/2010US20100226108 Printed circuit board and method of manufacturing printed circuit board
09/09/2010US20100225906 Surface inspection apparatus and surface inspection method
09/09/2010US20100225890 Method for evaluating flare in exposure tool
09/09/2010US20100225860 Tft-lcd array substrate and manufacturing method thereof
09/09/2010US20100225775 Solid-state image capturing device, method of manufacturing solid-state image capturing device, and image capturing apparatus
09/09/2010US20100225774 Solid-state image pickup element, a method of manufacturing the same and electronic apparatus using the same
09/09/2010US20100225609 Touch panel, tft-lcd array substrate and manufacturing method thereof
09/09/2010US20100225351 Resolving Mestastability
09/09/2010US20100225350 Reconfigurable magnetic logic-circuit array and methods for producing and operating such logic devices
09/09/2010US20100225011 System and Method for Integrated Circuit Fabrication
09/09/2010US20100225009 Integrated circuit assemblies with alignment features and devices and methods related thereto
09/09/2010US20100225007 Integrated circuit packaging system with stacked die and method of manufacture thereof
09/09/2010US20100225006 Chips having rear contacts connected by through vias to front contacts
09/09/2010US20100225004 Semiconductor apparatus and method of manufacturing semiconductor apparatus
09/09/2010US20100225003 Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method
09/09/2010US20100225002 Three-Dimensional System-in-Package Architecture
09/09/2010US20100225001 Manufacturing method of semiconductor device, semiconductor device, and electronic device
09/09/2010US20100225000 Semiconductor device and method of manufacturing semiconductor device
09/09/2010US20100224998 Integrated Circuit with Ribtan Interconnects
09/09/2010US20100224996 Methods of manufacturing copper interconnect systems
09/09/2010US20100224995 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
09/09/2010US20100224994 Low Temperature Metal to Silicon Diffusion and Silicide Wafer Bonding
09/09/2010US20100224993 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
09/09/2010US20100224992 System and method for stacked die embedded chip build-up
09/09/2010US20100224987 Stress buffering package for a semiconductor component
09/09/2010US20100224985 Chip-Scale Packaging with Protective Heat Spreader
09/09/2010US20100224983 Semiconductor package structure and manufacturing method thereof
09/09/2010US20100224981 Routable array metal integrated circuit package
09/09/2010US20100224980 Hermetic packaging of integrated circuit components
09/09/2010US20100224979 Stacked integrated circuit package system and method for manufacturing thereof
09/09/2010US20100224978 Integrated circuit packaging system with flex tape and method of manufacture thereof
09/09/2010US20100224976 Method for embedding silicon die into a stacked package
09/09/2010US20100224975 Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof
09/09/2010US20100224974 Integrated circuit packaging system with patterned substrate and method of manufacture thereof
09/09/2010US20100224971 Leadless integrated circuit package having high density contacts
09/09/2010US20100224970 Leadless integrated circuit package having standoff contacts and die attach pad
09/09/2010US20100224969 Electronic device and method of packaging an electronic device
09/09/2010US20100224968 High resistivity silicon wafer and method for manufacturing the same
09/09/2010US20100224965 Through-silicon via structure and method for making the same
09/09/2010US20100224964 Epitaxially coated silicon wafer and method for producing an epitaxially coated silicon wafer
09/09/2010US20100224961 Passivation of integrated circuits containing ferroelectric capacitors and hydrogen barriers
09/09/2010US20100224960 Embedded capacitor device and methods of fabrication
09/09/2010US20100224959 Semiconductor Chip, Transponder and Method of Manufacturing a Transponder
09/09/2010US20100224958 Rf-ic packaging method and circuits obtained thereby
09/09/2010US20100224955 Fuses of semiconductor device and method of forming the same
09/09/2010US20100224954 Substrate compositions and methods for forming semiconductor on insulator devices
09/09/2010US20100224952 Schottky barrier diode and method of producing the same
09/09/2010US20100224951 Solid-state imaging device, method for producing the same, and electronic apparatus
09/09/2010US20100224950 Apparatus and method using patterned array with separated islands
09/09/2010US20100224946 Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same
09/09/2010US20100224945 Sensor device and manufacturing method thereof
09/09/2010US20100224944 Ruthenium for a dielectric containing a lanthanide
09/09/2010US20100224943 Semiconductor device and manufacturing methods with using non-planar type of transistors
09/09/2010US20100224938 CMOS Transistors With Silicon Germanium Channel and Dual Embedded Stressors
09/09/2010US20100224937 Method for integrating silicon germanium and carbon doped silicon within a strained cmos flow
09/09/2010US20100224936 Semiconductor device and method of fabricating the same
09/09/2010US20100224932 Insulated Gate-Type Semiconductor Device and Manufacturing Method Thereof
09/09/2010US20100224928 Method for manufacturing nonvolatile semiconductor memory device and nonvolatile semiconductor memory device
09/09/2010US20100224925 Metal-insulator-metal structure for system-on-chip technology
09/09/2010US20100224922 Semiconductor device and method of manufacturing the same
09/09/2010US20100224921 Semiconductor device including ferroelectric capacitor
09/09/2010US20100224920 Magnetoresistive memory cell and method of manufacturing memory device including the same
09/09/2010US20100224915 Method for producing semiconductor chip, and field effect transistor and method for manufacturing same
09/09/2010US20100224913 One-dimensional FET-based corrosion sensor and method of making same
09/09/2010US20100224912 Chromium doped diamond-like carbon
09/09/2010US20100224909 Semiconductor device and method for fabricating the same
09/09/2010US20100224903 Light emitting device package and method of manufacturing the same
09/09/2010US20100224897 Semiconductor optoelectronic device and method for forming the same
09/09/2010US20100224894 Iii-nitride semiconductor light emitting device and method for fabricating the same
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