Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/15/2010CN101831248A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831247A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831246A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
09/15/2010CN101831163A Sacrificial compositions, methods of use thereof, and methods of decomposition thereof
09/15/2010CN101830351A Clamping assembly, positioning equipment using same and method for moving object from positioning equipment
09/15/2010CN101829948A Method for the simultaneous grinding of a plurality of semiconductor wafers
09/15/2010CN101582470B Method for preparing single crystal silicon film components
09/15/2010CN101540296B Manufacturing method for realizing monolithic integration of microwave switch and logic control circuit thereof
09/15/2010CN101521179B Dual contact etch stop layer process
09/15/2010CN101510530B Active element array substrate and manufacturing method therefor
09/15/2010CN101504954B High voltage power fast recovery diode and manufacturing method thereof
09/15/2010CN101494228B Array substrate
09/15/2010CN101488451B Method for forming patterned semiconductor buried layer on interface between thick film SOI material top layer silicon and dielectric buried layer
09/15/2010CN101471246B Method for manufacturing compound substrate of semiconductor
09/15/2010CN101459056B System and method for cutting substrate to produce separation unit
09/15/2010CN101447448B Etching method and uses of hole formation in stack of layers
09/15/2010CN101447400B Chip-to-wafer bonder and bonding method
09/15/2010CN101436069B On-line checking method of quality and flow controller
09/15/2010CN101430621B Touch sensor and touch screen panel
09/15/2010CN101425481B Pixel construction and manufacturing method thereof
09/15/2010CN101419952B Wafer stage chip encapsulation method and encapsulation construction
09/15/2010CN101405855B Analyzing method and analyzing apparatus
09/15/2010CN101405848B Transistor device having an increased threshold stability without drive current degradation
09/15/2010CN101403864B Method for self-judgment of measurement data reliability of self-adapting focusing and leveling sensor system
09/15/2010CN101399222B Manufacturing method for semiconductor elements having air gap
09/15/2010CN101383268B Preparation for electronic beam to aligning mark
09/15/2010CN101373728B Method of adjusting moving position of transfer arm and position detecting jig
09/15/2010CN101371351B Systems and methods for forming additional metal routing in semiconductor devices
09/15/2010CN101364599B CMOS structure, method for processing cmos structure and processer containing at least cmos circuit
09/15/2010CN101350392B P type nitride semiconductor Ohm contact electrode with nano pattern and preparation method thereof
09/15/2010CN101349871B Photo-etching illuminating apparatus
09/15/2010CN101335203B Layered structure and its manufacturing method
09/15/2010CN101322250B Method for forming semiconductor device and multi-operational mode transistor
09/15/2010CN101320732B Semiconductor device and substrate for fabricating semiconductor device
09/15/2010CN101320680B Anti-arc protection device and its assembling method
09/15/2010CN101315921B Chip stack packaging structure and method of producing the same
09/15/2010CN101310379B 半导体器件 Semiconductor devices
09/15/2010CN101308819B Manufacturing method of semiconductor integrated circuit device and probe card
09/15/2010CN101308794B Atomic layer deposition of tungsten material
09/15/2010CN101308332B Method for controlling photolithography exposure dosage
09/15/2010CN101299441B Thin-film transistor, thin-film transistor array substrate, display panel and optoelectronic device
09/15/2010CN101288154B Transfer product fabricating method, and transfer product arrangement position identifying method
09/15/2010CN101281863B Method for preparing large scale nonpolar surface GaN self-supporting substrate
09/15/2010CN101276160B Focusing and leveling device for photo-etching machine as well as measuring method
09/15/2010CN101271883B Production method of circuit substrates and inductor wire
09/15/2010CN101271860B Self-aligning contact window and manufacturing method thereof
09/15/2010CN101263243B Flow-formed chamber component having a textured surface
09/15/2010CN101261948B Pressure welding ball detecting device for welding device and pressure welding ball detecting method for welding part
09/15/2010CN101257039B Semiconductor structure and manufacturing method thereof
09/15/2010CN101256996B Semiconductor device and manufacturing method of the semiconductor device
09/15/2010CN101244533B Method of ultra-flation chemical-mechanical polishing technique and semiconductor component manufactured by using the method
09/15/2010CN101241874B Package device and its base plate carrier
09/15/2010CN101226888B Heat sinking type chip packaging technology and constitution
09/15/2010CN101226881B Method for manufacturing dent source leakage field effect transistor
09/15/2010CN101217104B A phase demodulation device and method for transducer of radio frequency matcher
09/15/2010CN101165925B Solar cell structure with localized doping of cap layer
09/15/2010CN101164144B Exposure method, exposure device, and device manufacturing method
09/15/2010CN101115865B Method for depositing palladium layers and palladium bath therefor
09/15/2010CN101101871B Method for manufacturing diode metal layer
09/15/2010CN101089731B Fabrication apparatus and method of fabricating a soft mold using same
09/15/2010CN101086612B Protection film components containing vessel and manufacturing method thereof
09/15/2010CN101076880B Method and apparatus for forming single layer nanometer structure and apparatus comprising the said single layer
09/15/2010CN101075578B Manufacturing method for integrated circuit
09/15/2010CN101071274B Method for manufacturing semiconductor device using immersion lithography process with filtered air
09/15/2010CN101060066B Substrate processing apparatus
09/15/2010CN101031198B Parts supply device
09/15/2010CN101022118B A pixel sensor unit and method for manufacturing same
09/14/2010USRE41697 Method of forming planarized coatings on contact hole patterns of various duty ratios
09/14/2010USRE41696 Semiconductor device and manufacturing method thereof
09/14/2010USRE41690 Laser processing method
09/14/2010USRE41684 Set of integrated capacitor arrangements, especially integrated grid capacitors
09/14/2010USRE41670 Sram cell fabrication with interlevel Dielectric planarization
09/14/2010USRE41668 Seal ring structure for radio frequency integrated circuits
09/14/2010USRE41667 Illumination system particularly for microlithography
09/14/2010US7797068 Defect probability calculating method and semiconductor device manufacturing method
09/14/2010US7796845 Circuit board and method for manufacturing the same
09/14/2010US7796228 Display substrate, method of manufacturing the same and display device having the same
09/14/2010US7796204 Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
09/14/2010US7795982 Surface-mount type crystal oscillator
09/14/2010US7795866 Method and device for forecasting polishing end point
09/14/2010US7795865 Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof
09/14/2010US7795833 Driving apparatus, exposure apparatus, and device manufacturing method
09/14/2010US7795740 Adhesion enhancement for metal/dielectric interface
09/14/2010US7795739 Semiconductor device, method of manufacturing the same
09/14/2010US7795738 Nitride semiconductor device
09/14/2010US7795737 Methods of redistributing bondpad locations on an integrated circuit
09/14/2010US7795735 Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
09/14/2010US7795734 Semiconductor device and method of manufacturing the same
09/14/2010US7795730 A first conductive layer of a high-melting point metal is in contact with an insulating layer by droplet discharge; a second conductive layer of silver, gold, copper, or indium tin oxide in contact with the first conductive layer,has improved adhesiveness with the insulating layer; antipeeling agents
09/14/2010US7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
09/14/2010US7795713 Semiconductor device and method for producing the same
09/14/2010US7795707 High voltage switching devices and process for forming same
09/14/2010US7795701 Semiconductor device and manufacturing method thereof
09/14/2010US7795699 Semiconductor device
09/14/2010US7795694 Quantum device, manufacturing method of the same and controlling method of the same
09/14/2010US7795689 Semiconductor device including a germanium silicide film on a selective epitaxial layer
09/14/2010US7795679 Device structures with a self-aligned damage layer and methods for forming such device structures
09/14/2010US7795675 Termination for trench MIS device
09/14/2010US7795667 Semiconductor memory preventing an electric short circuit between a word line and a semiconductor substrate, and manufacturing method for the semiconductor memory
09/14/2010US7795664 Finned memory cells
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