Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/09/2010US20100224891 VERTICALLY STRUCTURED LED BY INTEGRATING NITRIDE SEMICONDUCTORS WITH Zn(Mg,Cd,Be)O(S,Se) AND METHOD FOR MAKING SAME
09/09/2010US20100224890 Light emitting diode chip with electrical insulation element
09/09/2010US20100224886 P-channel silicon carbide mosfet
09/09/2010US20100224884 Silicon carbide semiconductor device and method for manufacturing the same
09/09/2010US20100224883 Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
09/09/2010US20100224882 Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the same
09/09/2010US20100224881 Organic light emitting diode display device and method of fabricating the same
09/09/2010US20100224878 Semiconductor device
09/09/2010US20100224876 Two-Sided Semiconductor Structure
09/09/2010US20100224873 Semiconductor device and method for manufacturing the same
09/09/2010US20100224871 Thin film transistor, method of manufacturing the same, and display device
09/09/2010US20100224859 Organic Light-Emitting Diodes with Electrophosphorescent-Coated Emissive Quantum Dots
09/09/2010US20100224857 FABRICATION OF PHOSPHOR FREE RED AND WHITE NITRIDE-BASED LEDs
09/09/2010US20100224851 Synthesizing graphene from metal-carbon solutions using ion implantation
09/09/2010US20100224849 Oxide diode, method of manufacturing the same, and electronic device and resistive memory device including the same
09/09/2010US20100224784 Radiation detector and method for producing the same
09/09/2010US20100224766 Solid-state image device manufacturing method thereof, and image capturing apparatus
09/09/2010US20100224715 Wire supply device for a wire bonder
09/09/2010US20100224501 Plating methods for low aspect ratio cavities
09/09/2010US20100224394 Module Substrate and Production Method
09/09/2010US20100224322 Endpoint detection for a reactor chamber using a remote plasma chamber
09/09/2010US20100224321 Inductively coupled plasma reactor having rf phase control and methods of use thereof
09/09/2010US20100224238 Photovoltaic cell comprising an mis-type tunnel diode
09/09/2010US20100224130 Rotating substrate support and methods of use
09/09/2010US20100224128 Semiconductor manufacturing apparatus
09/09/2010US20100224004 Media-compatible electrically isolated pressure sensor for high temperature applications
09/09/2010US20100223767 Apparatus for aligning an optical device an object, an optical instrument and a semiconductor process system
09/09/2010DE4400097B4 Vorrichtung zum Abschätzen der Lebensdauer von Halbleiter-Material An apparatus for estimating the service life of semiconductor material
09/09/2010DE19945170B4 Verfahren zur Herstellung einer Schablonenmaske A process for producing a stencil mask
09/09/2010DE102010004104A1 Diffusionsmittelzusammensetzung, Verfahren zum Bilden einer Verunreinigungsdiffusionsschicht, und Solarbatterie Diffusing agent composition, method of forming an impurity diffusion layer, and the solar battery
09/09/2010DE102010002344A1 Abscheidungsmaske Deposition mask
09/09/2010DE102010001982A1 Halbleiterbauelement mit einem Hohlraum A semiconductor device with a cavity
09/09/2010DE102010000729A1 Halbleitervorrichtung und Verfahren zu deren Fertigung A semiconductor device and method of manufacturing
09/09/2010DE102010000402A1 Halbleiteranordnung Semiconductor device
09/09/2010DE102009046751A1 Verfahren und System zum Synchronisieren der Prozesskammerabschaltzeiten durch Steuern der Transportreihenfolge in eine Prozessanlage Method and system for synchronizing the Prozesskammerabschaltzeiten by controlling the transport sequence in a process plant
09/09/2010DE102009044641A1 Einrichtung mit einem Halbleiterchip und Metallfolie Device having a semiconductor chip and metal foil
09/09/2010DE102009012255A1 Schaltungsanordnung Circuitry
09/09/2010DE102009012230A1 Apparatus for single-sided removal of a thin layer from a semiconductor substrate, comprises contact element made of etching-resistant material, container for receiving etching agent, gas flow device, and device for cleaning the substrate
09/09/2010DE102009011305A1 Solarzellen mit Rückseitenkontaktierung sowie Verfahren zu deren Herstellung Solar cells with rear-side as well as processes for their preparation
09/09/2010DE102009010847A1 Integration von Halbleiterlegierungen in PMOS- und NMOS-Transistoren unter Anwedung eines gemeinsamen Ätzprozesses für Aussparungen Integration of semiconductor alloys in PMOS and NMOS transistors under Anwedung a common etching process for recesses
09/09/2010DE102009010816A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
09/09/2010DE102009009548A1 Verfahren zum Bilden einer paketartigen Back-To-Back-Wafercharge A method of forming a packet-like back-to-back wafer batch
09/09/2010DE102009009355A1 Semiconductor wafer's defect inspecting apparatus, has data processing unit comparing set of images with other set of images of surface of wafer previously acquired by sensors, and automatically detecting defect based on image comparison
09/09/2010DE102009001379A1 Fabricating compound semiconductor epitaxial wafer comprises depositing silicon thin film on metal substrate, depositing compound semiconductor thin film on silicon buffer layer, and crystallizing compound semiconductor thin film
09/09/2010DE102009001175A1 Verfahren zur nasschemischen Abscheidung einer schwefelhaltigen Pufferschicht für eine Chalkopyrit-Dünnschicht-Solarzelle Process for wet-chemical deposition of a sulfur-containing buffer layer, for a chalcopyrite thin film solar cell
09/09/2010DE102008064671A1 Erhöhung der Integrität eines Gatestapels mit großem [Epsilon] durch Schützen einer Beschichtung an der Gateunterseite während des Freilegens der Gateoberseite Increasing the integrity of a gate stack with large [epsilon] by protecting a coating on the gate during the underside exposing the gate top
09/09/2010DE102007050405B4 Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Leistungskomponente Electric power component, in particular a power semiconductor module with a cooling device and method for two-dimensional and heat conductive bonding of a cooling device of an electric power component
09/09/2010DE102007032559B4 Verschlussmechanismus für Drucktestkammern zum Testen von elektronischen Bauelementen, insbesonder IC's Closure mechanism for pressure test chambers for testing electronic components, IC's insbesonder
09/09/2010DE102007026365B4 Halbleitervorrichtungen und Modul und Verfahren zur Herstellung derselben Semiconductor devices and the module and method of producing same
09/09/2010DE102006055068B4 Halbleitervorrichtung mit verbessertem Bipolartransistor mit isoliertem Gate und Verfahren zu ihrer Herstellung A semiconductor device with an improved insulated gate bipolar transistor, and methods for their preparation
09/09/2010DE102006000687B4 Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers Combination of a support and a wafer, means for separating the combination and method for handling a wafer carrier and a
09/09/2010DE102004036509B4 Verfahren zum Herstellen eines Trenchtransistors A method of manufacturing a trench transistor
09/08/2010EP2226858A2 Gallium nitride-based semiconductor optical device, method of fabricating gallium nitride-based semiconductor optical device, and epitaxial wafer
09/08/2010EP2226848A1 Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the same
09/08/2010EP2226847A2 Amorphous oxide and thin film transistor
09/08/2010EP2226846A1 Thin film semiconductor device and field effect transistor
09/08/2010EP2226843A1 Solid-state image pickup element, method of manufacturing the same, and electronic apparatus using the same
09/08/2010EP2226840A1 Solid-state image device, manufacturing method thereof, and image capturing apparatus
09/08/2010EP2226839A2 Method for manufacturing metal interconnection lines
09/08/2010EP2226838A1 Fixture apparatus for low-temperature and low-pressure sintering
09/08/2010EP2226837A1 Device for eliminating slackness of shock-absorbing tape
09/08/2010EP2226835A1 Semiconductor device and method for manufacturing the same
09/08/2010EP2226834A2 Method for physical force assisted cleaning with reduced damage
09/08/2010EP2226833A1 Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
09/08/2010EP2226625A1 Monitoring apparatus and monitoring method
09/08/2010EP2226412A1 Method for growing silicon single crystal and method for producing silicon wafer
09/08/2010EP2225774A1 Semiconductor memory device and method for manufacturing same
09/08/2010EP2225773A2 Memory cell suitable for dram memory
09/08/2010EP2225571A1 Embedded structure for passivation integrity testing
09/08/2010EP1661173B1 Method of fabricating an ultra-narrow channel semiconductor device
09/08/2010EP1266409B1 Mos transistor with metal source and drain, and method for manufacturing the same
09/08/2010CN201576669U Chip ball mounting operation device
09/08/2010CN201576668U Liquid medicine injection system
09/08/2010CN201576667U Transferring device of chip sorting device
09/08/2010CN201576666U Board pressing fixture
09/08/2010CN201576665U Chemical processing device at back surface of silicon chip
09/08/2010CN201576664U Semiconductor production equipment of PVD process
09/08/2010CN201573111U Silicon wafer fixing device for chemical-mechanical polishing device
09/08/2010CN201573110U Polishing table device
09/08/2010CN201573109U Safety device for transfer device for chemical mechanical polishing
09/08/2010CN201573095U Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment
09/08/2010CN201573094U Manipulator terminal clamping actuator used in silicon chip CMP
09/08/2010CN1992291B Thin film transistor substrate and fabricating method thereof
09/08/2010CN1992175B Manufacturing method of semiconductor device
09/08/2010CN1951634B Method of adhering polishing pads and jig for adhering the same
09/08/2010CN1949086B Substrate processing method and substrate processing apparatus
09/08/2010CN1941288B Semiconductor device, manufacturing method thereof, device comprising the semiconductor device
09/08/2010CN1932645B Method for fabricating semiconductor device including resist flow process and film coating process
09/08/2010CN1927520B Laser beam processing machine
09/08/2010CN1921140B Organic light emitting display and method for fabricating the same
09/08/2010CN1912697B Substrate rotary processor
09/08/2010CN1910756B Transistor manufacture
09/08/2010CN1893142B Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof
09/08/2010CN1886442B Pellicle and novel fluoropolymer
09/08/2010CN1855902B Signal transmission system
09/08/2010CN1841736B Integrated semiconductor inductor and method therefor
09/08/2010CN1832131B Method for fabricating semiconductor device
09/08/2010CN1828970B Method of manufacturing semiconductor device
09/08/2010CN1759466B Substrate support lift mechanism
09/08/2010CN1748291B Method of fabrication of a support structure for a semiconductor device