Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/16/2010WO2010103847A1 Exhaust gas processing apparatus and method for processing exhaust gas
09/16/2010WO2010103846A1 Apparatus for processing exhaust gas and method for processing exhaust gas
09/16/2010WO2010103829A1 Substrate transfer process system, substrate transfer process method, and apparatus and method for mounting component
09/16/2010WO2010103822A1 Exposure apparatus, exposure method and device manufacturing method
09/16/2010WO2010103820A1 Method for manufacturing silicon carbide semiconductor device
09/16/2010WO2010103818A1 Optimal route selection apparatus, optimal route selection method, and program
09/16/2010WO2010103802A1 Semiconductor device and method for manufacturing same
09/16/2010WO2010103792A1 Semiconductor substrate, method for manufacturing semiconductor substrate, electronic device and method for manufacturing electronic device
09/16/2010WO2010103751A1 Atomic layer deposition apparatus and thin film forming method
09/16/2010WO2010103737A1 Epitaxial wafer for light emitting diode
09/16/2010WO2010103732A1 Atomic layer deposition apparatus
09/16/2010WO2010103687A1 Semiconductor device and method for manufacturing same
09/16/2010WO2010103674A1 Group iii nitride semiconductor device, epitaxial substrate, and method for manufacturing group iii nitride semiconductor device
09/16/2010WO2010103649A1 Composite resistance variable element and method for manufacturing the same
09/16/2010WO2010103597A1 Semiconductor device
09/16/2010WO2010103592A1 Semiconductor device and method for manufacturing same
09/16/2010WO2010103587A1 THIN FILM TRANSISTOR HAVING A BARRIER LAYER AS A CONSTITUTING LAYER AND Cu-ALLOY SPUTTERING TARGET USED FOR SPUTTER FILM FORMATION OF THE BARRIER LAYER
09/16/2010WO2010103568A1 Method for manufacturing reclaim semiconductor wafer
09/16/2010WO2010103416A2 Method of particle contaminant removal
09/16/2010WO2010103356A1 Adaptation of the lattice parameter of a layer of strained material
09/16/2010WO2010102996A1 Method for positioning chips during the production of a reconstituted board
09/16/2010WO2010102943A1 A method of fabricating a multilayer structure with circuit layer transfer
09/16/2010WO2010102686A1 A method of producing a heterostructure with local adaptation of the thermal expansion coefficient
09/16/2010WO2010102345A1 Improved photo-voltaic device and system
09/16/2010WO2010085304A3 Methods of enhancing performance of field-effect transistors and field-effect transistors made thereby
09/16/2010WO2010080390A3 Condensible gas cooling system
09/16/2010WO2010080276A3 Metal-insulator-semiconductor tunneling contacts
09/16/2010WO2010078189A3 Flash cell with integrated high-k dielectric and metal-based control gate
09/16/2010WO2010077865A3 Defect detection and response
09/16/2010WO2010077597A3 Wafer taping
09/16/2010WO2010075283A3 Method and apparatus for plasma dose measurement
09/16/2010WO2010075281A3 Plasma ion process uniformity monitor
09/16/2010WO2010074948A3 Integrated circuit, 1t-1c embedded memory cell containing same, and method of manufacturing 1t-1c memory cell for embedded memory application
09/16/2010WO2010074481A3 Half tone mask and fabricating method
09/16/2010WO2010071875A3 Cutting fluid composition for wiresawing
09/16/2010WO2010065676A3 Methods and systems for detecting defects on a reticle
09/16/2010WO2010065608A3 Method and apparatus for circuit simulation
09/16/2010WO2010059827A3 Laser scribing platform with moving gantry
09/16/2010WO2010057835A3 Radiation detector use of a radiation detector and method for producing a radiation detector
09/16/2010WO2010057613A3 Tandem solar cell made from crystalline silicon and crystalline silicon carbide and method for the production thereof
09/16/2010WO2010056369A3 Method and apparatus for circuit simulation
09/16/2010WO2010044558A9 Method for manufacturing a silicon thin film using energy beam irradiation
09/16/2010US20100234973 Pattern verifying method, method of manufacturing a semiconductor device and pattern verifying program
09/16/2010US20100233937 Method for predicting worked shape, method for determining working conditions, working method, working system, semiconductor device manufacturing method, computer program and computer program storage medium
09/16/2010US20100233888 Method And System For Providing A Continuous Motion Sequential Lateral Solidification For Reducing Or Eliminating Artifacts In Edge Regions, And A Mask For Facilitating Such Artifact Reduction/Elimination
09/16/2010US20100233887 Production method for semiconductor device and substrate processing apparatus
09/16/2010US20100233886 Dielectric Films Comprising Silicon And Methods For Making Same
09/16/2010US20100233885 Substrate processing method
09/16/2010US20100233884 Processing apparatus and method for making semiconductor devices
09/16/2010US20100233883 Substrate processing method
09/16/2010US20100233882 Single silicon-on-insulator (soi) wafer accelerometer fabrication
09/16/2010US20100233881 Method of manufacturing supporting structures for stack capacitor in semiconductor device
09/16/2010US20100233880 Chemical mechanical planarization using nanodiamond
09/16/2010US20100233879 Method for uniform nanoscale film deposition
09/16/2010US20100233878 Method for manufacturing semiconductor device for preventing occurrence of short circuit between bit line contact plug and storage node contact plug
09/16/2010US20100233877 Method of disposing dummy pattern
09/16/2010US20100233876 Film forming apparatus, film forming method, computer program and storage medium
09/16/2010US20100233875 Contact formation
09/16/2010US20100233874 Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
09/16/2010US20100233873 Method of forming a semiconductor device using a sacrificial uniform vertical thickness spacer structure
09/16/2010US20100233872 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
09/16/2010US20100233871 Method for generating two dimensions for different implant energies
09/16/2010US20100233870 Method of fabricating group III nitride semiconductor single crystal, and method of fabricating group III nitride semiconductor single crystal substrate
09/16/2010US20100233869 Method of fabricating epi-wafer, epi-wafer fabricated by the method, and image sensor fabricated using the epi-wafer
09/16/2010US20100233868 Adhesive Sheet and a Processing Method of Semiconductor Wafer, and a Manufacturing Method of Semiconductive Chip
09/16/2010US20100233867 Method of producing segmented chips
09/16/2010US20100233866 Method for manufacturing semiconductor substrate
09/16/2010US20100233865 Semiconductor device manufacturing method
09/16/2010US20100233864 Methods of fabricating a semiconductor device
09/16/2010US20100233863 Method of manufacturing semiconductor device
09/16/2010US20100233862 Integrated low leakage schottky diode
09/16/2010US20100233861 Method for manufacturing solid-state imaging device
09/16/2010US20100233860 Semiconductor device and method for fabricating the same
09/16/2010US20100233859 Fabrication method of pixel structure
09/16/2010US20100233858 Method of preventing generation of arc during rapid annealing by joule heating
09/16/2010US20100233857 Fabrication method of semiconductor integrated circuit device
09/16/2010US20100233856 Method for manufacturing semiconductor apparatus
09/16/2010US20100233855 Method for fabricating chip scale package structure with metal pads exposed from an encapsulant
09/16/2010US20100233854 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
09/16/2010US20100233853 Method for manufacturing semiconductor device
09/16/2010US20100233852 Semiconductor Device and Method of Stacking Same Size Semiconductor Die Electrically Connected Through Conductive Via Formed Around Periphery of the Die
09/16/2010US20100233851 System for improving flip chip performance
09/16/2010US20100233850 Method for Bonding Wafers to Produce Stacked Integrated Circuits
09/16/2010US20100233849 Methods of Forming Resistive Memory Devices
09/16/2010US20100233848 Semiconductor device and method for manufacturing the semiconductor device
09/16/2010US20100233847 Method for manufacturing semiconductor device
09/16/2010US20100233841 Thin-film solar cell
09/16/2010US20100233838 Mounting of Solar Cells on a Flexible Substrate
09/16/2010US20100233837 Thermo-optic devices providing thermal recirculation
09/16/2010US20100233836 Method for manufacturing zinc oxide based semiconductor device
09/16/2010US20100233835 Production method of compound semiconductor light-emitting device
09/16/2010US20100233834 Liquid crystal display device and method of manufacturing the same
09/16/2010US20100233833 Method for Producing Ink-Jet Head
09/16/2010US20100233832 Method of manufacturing silicon carbide seminconductor device
09/16/2010US20100233831 Reconfigured wafer alignment
09/16/2010US20100233830 Method for monitoring fabrication parameter
09/16/2010US20100233829 Cyclic amino compounds for low-k silylation
09/16/2010US20100233598 Pattern correcting apparatus, mask-pattern forming method, and method of manufacturing semiconductor device
09/16/2010US20100233592 Photomask and method of forming photomask
09/16/2010US20100233539 Method of etching a silicon-based material