Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/16/2010US20100230673 Semiconductor Fuse Structure and a Method of Manufacturing a Semiconductor Fuse Structure
09/16/2010US20100230672 Production of integrated circuits comprising different components
09/16/2010US20100230658 Apparatus and methods for improving parallel conduction in a quantum well device
09/16/2010US20100230655 Variable resistance device, method for manufacturing variable resistance device, and semiconductor storage device using variable resistance device
09/16/2010US20100230653 Phase-change memory element and method for fabricating the same
09/16/2010US20100230592 Sample Transfer Unit and Sample Transferring Method
09/16/2010US20100230386 Processing device, electrode, electrode plate, and processing method
09/16/2010US20100230243 Wafer Carrier Drive Apparatus and Method for Operating the Same
09/16/2010US20100230053 Plasma processing apparatus
09/16/2010US20100230050 Plasma generating apparatus
09/16/2010US20100230030 Apparatus and method for fabricating bonded substrate
09/16/2010US20100229933 Inverted Metamorphic Multijunction Solar Cells with a Supporting Coating
09/16/2010US20100229929 Strained-Enhanced Silicon Photon-To-Electron Conversion Devices
09/16/2010US20100229926 Four Junction Inverted Metamorphic Multijunction Solar Cell with a Single Metamorphic Layer
09/16/2010US20100229918 SOLAR CELL MODULE and MANUFACTURING METHOD OF SOLAR CELL MODULE
09/16/2010US20100229788 Three-dimensional gan epitaxial structure and manufacturing method thereof
09/16/2010US20100229651 Cointegrated mems sensor and method
09/16/2010DE112008003262T5 Prüfvorrichtung und Prüfverfahren für Substratoberflächen Tester and test methods for substrate surfaces
09/16/2010DE112008003005T5 Klebefolie für das Schneiden von Chips Adhesive film for cutting chips
09/16/2010DE112008001548T5 Plasmabearbeitungsvorrichtung und Plasmabearbeitungsverfahren Plasma processing apparatus and plasma processing method
09/16/2010DE112004002373B4 Verfahren zur Herstellung einer CMOS-Vorrichtung sowie CMOS-Vorrichtung mit Strained-Transistor-Integration für CMOS A method of manufacturing a CMOS device as well as CMOS device with strained transistor integration for CMOS
09/16/2010DE112004000176B4 Magnetspeicherzelle und Magnetspeicher The magnetic memory cell, and magnetic memory
09/16/2010DE10351237B4 Verfahren zur Herstellung eines Transistors mit erhöhten und/oder verspannten Drain- und Sourcegebieten und Transistor A method of manufacturing a transistor with raised and / or strained drain and source regions and transistor
09/16/2010DE10345346B4 Verfahren zur Herstellung eines Halbleiterbauelements mit aktiven Bereichen, die durch Isolationsstrukturen voneinander getrennt sind A process for producing a semiconductor device having active regions which are separated from each other by isolation structures
09/16/2010DE10260753B4 Verfahren zum Herstellen eines Halbleiter-Bauteils A method of manufacturing a semiconductor device
09/16/2010DE10208635B4 Diffusionslotstelle, Verbund aus zwei über eine Diffusionslotstelle verbundenen Teilen und Verfahren zur Herstellung der Diffusionslotstelle Diffusion solder point, a composite of two diffusion solder point connected parts and method of manufacturing the diffusion solder point
09/16/2010DE102010002540A1 Platine, IC-Karte mit der Platine und Herstellungsverfahren hierfür Board, IC card with the printed circuit board and manufacturing method thereof
09/16/2010DE102009039516A1 Feldeffekttransistor und Verfahren zu dessen Herstellung Field effect transistor and method of producing the
09/16/2010DE102009022660B3 Befestigung eines Bauelements an einem Substrat und/oder eines Anschlusselementes an dem Bauelement und/oder an dem Substrat durch Drucksinterung Fastening a component to a substrate and / or a connecting element to the component and / or to the substrate by pressure sintering
09/16/2010DE102009018653A1 Verfahren zur Herstellung von Halbleiterbauelementen unter Nutzung von Dotierungstechniken A process for the production of semiconductor devices with the use of doping techniques
09/16/2010DE102009013112A1 Verfahren zur Herstellung einer Vielzahl von mikrooptoelektronischen Bauelementen und mikrooptoelektronisches Bauelement A process for the production of a variety of micro-optoelectronic components and micro-optoelectronic component
09/16/2010DE102009013085A1 Method for arranging and connecting electronic component on substrate, involves producing electrical contact of electronic component following from front end of substrate on front-side metallization or openings
09/16/2010DE102009012679A1 Drahtsäge-Vorrichtung Wire saw device
09/16/2010DE102009012200A1 Thermal conversion of metallic precursor layer into semiconductor layer in thin layer solar cell, involves introducing chalcogen vapor/carrier gas mixture on substrate having precursor layer, heating, converting and cooling
09/16/2010DE102009012139A1 Modulsubstrat und Verfahren zur Herstellung Module substrate and methods for preparing
09/16/2010DE102009011695A1 Thermal conversion of metallic precursor layer into semiconductor layer in thin layer solar cell, involves introducing chalcogen vapor/carrier gas mixture on substrate having precursor layer, heating, converting and cooling
09/16/2010DE102009011622A1 Epitaxierte Siliciumscheibe und Verfahren zur Herstellung einer epitaxierten Siliciumscheibe Epitaxially coated silicon wafer and a method for producing epitaxially coated silicon wafer
09/16/2010DE102009011496A1 Verfahren und Vorrichtung zur thermischen Umsetzung metallischer Precursorschichten in halbleitende Schichten mit Chalkogenrückgewinnung Method and apparatus for thermal conversion of metallic precursor layers in semiconductor layers with Chalkogenrückgewinnung
09/16/2010DE102009011306A1 Beidseitig kontaktierte Solarzellen sowie Verfahren zu deren Herstellung Left and right contact solar cells and to processes for their preparation
09/16/2010DE102009010882A1 Transistor mit einer eingebetteten Halbleiterlegierung in Drain- und Sourcegebieten, die sich unter die Gateelektrode erstreckt Transistor having an embedded semiconductor alloy in drain and source regions extending under the gate electrode
09/16/2010DE102009006822A1 Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem Microstructure, to processes for their preparation, to apparatus for bonding a micro-structure and micro-system
09/16/2010DE102009001461A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
09/16/2010DE102008002652B4 Verfahren zum Herstellen einer Halbleiterstruktur und eines Halbleiterkörpers A method of fabricating a semiconductor structure and a semiconductor body
09/16/2010DE102007048306B4 Integrierter Schaltkreis mit Schalteinheit zur Speicherzellen-Kopplung und Verfahren zur Herstellung eines integrierten Schaltkreises zur Speicherzellen-Kopplung An integrated circuit comprising switching unit for coupling memory cells and methods of making an integrated circuit for the memory cell coupling
09/16/2010DE102007043832B4 Elektronische Packages mit benetzbaren und nichtbenetzbaren Feinpartikelbereichen und Verfahren zur Herstellung desselben The same electronic packages with wettable and nonwettable regions fine particles and methods for preparing
09/16/2010DE102007032557B4 Vorrichtung zum Testen von elektronischen Bauelementen, insbesondere IC's, mit innerhalb einer Drucktestkammer angeordnetem Abdichtboard Apparatus for testing electronic components, in particular IC's, with arranged within a test chamber pressure Abdichtboard
09/16/2010DE102006058347B4 Aufbau eines Leistungsmoduls und dieses verwendendes Halbleiterrelais Construction of a power module and this-use solid-state relays
09/16/2010DE102006053435B4 Speicherzellenanordnungen und Verfahren zum Herstellen von Speicherzellenanordnungen Memory cell arrays and methods of manufacturing of memory cell arrays
09/16/2010DE102006035377B4 Verfahren zur Herstellung eines Halbleiterkristalls A process for producing a semiconductor crystal
09/16/2010DE102006033505B4 Halbleitervorrichtung mit reduziertem "Tail"-Widerstand und Herstellungsverfahren für eine solche A semiconductor device with reduced "tail" resistance and manufacturing method for such a
09/16/2010DE102005063129B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Isolationsgraben mit reduzierter Seitenwandverspannung A process for producing a semiconductor device with isolation trench with a reduced side wall bracing
09/16/2010DE102005052509B4 Verfahren zum Herstellen einer Druckplatte A method for making a printing plate
09/16/2010DE102005035699B4 Halbleiterleistungsbauelement mit Ladungskompensationsstruktur und Verfahren zur Herstellung desselben Of the same semiconductor power device having charge compensation structure and method for producing
09/16/2010DE102005004411B4 Verfahren für die Herstellung eines in-situ-gebildeten Halo-Gebietes in einem Transistorelement A process for the preparation of in-situ-formed halo region in a transistor element
09/16/2010DE102005004410B4 Verfahren zum Ausbilden einer Halbleiterstruktur mit Bemustern einer Schicht aus einem Material A method of forming a semiconductor structure comprising patterning a layer of a material
09/16/2010DE102004063643B4 Ionenimplantationsvorrichtung und Verfahren zum Implantieren von Ionen durch Verwendung derselben An ion implantation apparatus and method for implanting ions by using the same
09/16/2010DE102004011203B4 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
09/16/2010DE10125577B4 Kontaktier-Heizvorrichtung Kontaktier heater
09/16/2010DE10020501B4 Verfahren zum Herstellen eines Epitaxiewafers für eine infrarotes Licht emittierende Diode und Verfahren zur Herstellung einer Infrarot-LED aus dem Epitaxiewafer A method for manufacturing an epitaxial wafer for an infrared light emitting diode and method for producing an infrared LED from the epitaxial wafer
09/15/2010EP2229040A1 Method for applying an electrically conductive product, which is liquid at the time of application, on a support in order to connect two electrically conductive elements
09/15/2010EP2228824A1 Embedded chip package with chips stacked in an interconnecting laminate
09/15/2010EP2228822A2 Flexible Packaging for Chip-on-Chip and Package-on-Package Technologies
09/15/2010EP2228819A1 Wireless chip
09/15/2010EP2228803A2 Non-metallic, integrated sensor-interconnect device
09/15/2010EP2228684A2 Coating and developing apparatus, coating and developing method, and storage medium
09/15/2010EP2228401A1 Sacrificial compositions, methods of use thereof, and methods of decomposition thereof
09/15/2010EP2228168A1 Bonding material, electronic component, and bonded structure
09/15/2010EP2228167A1 Working object cutting method
09/15/2010EP2227827A1 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same
09/15/2010EP2227823A2 Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
09/15/2010EP2227822A2 A heat sink and method of forming a heatsink using a wedge-lock system
09/15/2010EP2227821A1 Reduction of watermarks in hf treatments of semiconducting substrates
09/15/2010EP1907992B1 Semiconductor device
09/15/2010EP1872386B1 Device and method for application of an even thin fluid layer to substrates
09/15/2010EP1697175B1 Control unit and method for producing the same
09/15/2010EP1604390B9 Method for the production of stress-relaxed layer structure on a non-lattice adapted substrate and utilization of said layer system in electronic and/or optoelectronic components
09/15/2010EP1586108B1 Finfet sram cell using inverted finfet thin film transistors
09/15/2010EP1547142B1 Selective connection in ic packaging
09/15/2010EP1277238B1 Device and method for simultaneous tempering of several process goods
09/15/2010EP1277237B1 Device and method for tempering at least one process good
09/15/2010EP1034563B1 High selectivity etching process for oxides
09/15/2010CN201584402U Alignment apparatus for optical element, and sealing cover system provided with alignment apparatus
09/15/2010CN201583107U Improved substrate drying system
09/15/2010CN201581133U Low-temperature damage-free deep slant silicon etching system
09/15/2010CN201579701U Lower pressure control system of CMP polishing pad finisher
09/15/2010CN201579561U Graphite boat for crystal particle welding
09/15/2010CN1998072B Method of semiconductor fabrication incorporating disposable spacer into elevated source/drain processing
09/15/2010CN1979786B Method for making strain silicon transistor
09/15/2010CN1971950B Anti-reflecting layer base plate and its manufacturing method
09/15/2010CN1738059B Semiconductor device and method of manufacturing the same
09/15/2010CN1732557B Method for treating semiconductor material
09/15/2010CN1729719B Display unit and method of fabricating display unit
09/15/2010CN1638540B 有机电致发光显示器件 Organic electroluminescent display device
09/15/2010CN101836525A Component mounting apparatus, component mounting head, and component mounting method
09/15/2010CN101836515A Anisotropically conductive adhesive
09/15/2010CN101836303A Hover cushion transport for webs in a web coating process
09/15/2010CN101836298A Ultra thin single crystalline semiconductor TFT and process for making same
09/15/2010CN101836295A A semiconductor arrangement and a method for manufacturing the same
09/15/2010CN101836293A Mounting structure
09/15/2010CN101836287A Method of splitting a substrate
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