Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/16/2010US20100233518 High energy-density radioisotope micro power sources
09/16/2010US20100233426 Noble metal single crystalline nanowire and the fabrication method thereof
09/16/2010US20100232921 Substrate transfer apparatus
09/16/2010US20100232915 Apparatus For Handling A Semiconductor Component
09/16/2010US20100232914 Method and apparatus for routing wafer pods to allow parallel processing
09/16/2010US20100232679 Pattern verification method, pattern verification apparatus, and pattern verification program
09/16/2010US20100232470 System and process for calibrating pyrometers in thermal processing chambers
09/16/2010US20100232465 Semiconductor light emitting element and manufacturing method thereof
09/16/2010US20100232225 Semiconductor storage device
09/16/2010US20100232220 Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices
09/16/2010US20100232219 Micromagnetic Elements, Logic Devices And Related Methods
09/16/2010US20100232210 Semiconductor memory device and manufacturing method thereof
09/16/2010US20100232200 Vertical switch three-dimensional memory array
09/16/2010US20100232077 Gated diode having at least one lightly-doped drain (ldd) implant blocked and circuits and methods employing same
09/16/2010US20100232061 Electric field information reading head, electric field information writing/reading head and fabrication methods thereof and information storage device using the same
09/16/2010US20100231924 Integrated monolithic interference detection device
09/16/2010US20100231638 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231637 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231636 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
09/16/2010US20100231495 Liquid crystal display device and fabricating method thereof
09/16/2010US20100231329 Baw structure with reduced topographic steps and related method
09/16/2010US20100231320 Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
09/16/2010US20100231317 Semiconductor Device and Method of Integrating Balun and RF Coupler on a Common Substrate
09/16/2010US20100231256 Spare cell library design for integrated circuit
09/16/2010US20100230841 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
09/16/2010US20100230827 Semiconductor device and method for manufacturing semiconductor device
09/16/2010US20100230826 Integrated circuit package assembly and packaging method thereof
09/16/2010US20100230825 Flexible Packaging for Chip-on-Chip and Package-on-Package Technologies
09/16/2010US20100230823 Semiconductor device, electronic device and method of manufacturing semiconductor device
09/16/2010US20100230822 Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVS in Peripheral Region of the Die
09/16/2010US20100230821 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
09/16/2010US20100230816 Semiconductor device and method for forming the same
09/16/2010US20100230814 Nanoscale, spatially-controlled ga doping of undoped transparent conducting oxide films
09/16/2010US20100230810 Flip chip semiconductor package and fabrication method thereof
09/16/2010US20100230808 Reducing stress between a substrate and a projecting electrode on the substrate
09/16/2010US20100230807 Method and Apparatus to Repair Defects in Nonvolatile Semiconductor Memory Devices
09/16/2010US20100230806 Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
09/16/2010US20100230805 Multi-die semiconductor package with heat spreader
09/16/2010US20100230803 Electronic device package and method for forming the same
09/16/2010US20100230799 Semiconductor device
09/16/2010US20100230798 Semiconductor device including spacer element
09/16/2010US20100230797 Warp-suppressed semiconductor device
09/16/2010US20100230796 Integrated circuit package-in-package system and method for making thereof
09/16/2010US20100230795 Stacked microelectronic assemblies having vias extending through bond pads
09/16/2010US20100230794 Method For Fabricating Semiconductor Components Using Maskless Back Side Alignment To Conductive Vias
09/16/2010US20100230792 Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same
09/16/2010US20100230789 Semiconductor device and manufacturing method thereof
09/16/2010US20100230788 Chip structure, wafer structure and process of faabricating chip
09/16/2010US20100230786 Production of integrated circuits comprising semiconductor incompatible materials
09/16/2010US20100230785 Inductively coupled integrated circuit and methods for use therewith
09/16/2010US20100230781 Trench anti-fuse structures for a programmable integrated circuit
09/16/2010US20100230779 Trench generated device structures and design structures for radiofrequency and bicmos integrated circuits
09/16/2010US20100230778 Method of fabricating a flash memory and an isolating structure applied to a flash memory
09/16/2010US20100230776 Semiconductor structure and method of manufacture
09/16/2010US20100230775 Termination for a superjunction device
09/16/2010US20100230771 Methods and arrangement for diffusing dopants into silicon
09/16/2010US20100230769 Magnetoresistive element, magnetic random access memory and method of manufacturing the same
09/16/2010US20100230767 Mems sensor, mems sensor manufacturing method, and electronic device
09/16/2010US20100230766 Sensor device and method
09/16/2010US20100230764 Integrated circuit having field effect transistors and manufacturing method
09/16/2010US20100230763 Active device array substrate and method for fabricating the same
09/16/2010US20100230762 integrated circuit using finfets and having a static random access memory (sram)
09/16/2010US20100230761 Semiconductor device and method of manufacturing same
09/16/2010US20100230759 Silicon Chip Having Through Via and Method for Making the Same
09/16/2010US20100230758 Semiconductor device with improved stressor shape
09/16/2010US20100230757 Hybrid STI Gap-Filling Approach
09/16/2010US20100230754 Semiconductor Device and Manufacturing Method Thereof
09/16/2010US20100230753 Lateral hyperabrupt junction varactor diode in an soi substrate
09/16/2010US20100230752 Soi (silicon on insulator) substrate improvements
09/16/2010US20100230751 Self-aligned schottky diode
09/16/2010US20100230749 Semiconductor devices and formation methods thereof
09/16/2010US20100230748 Semiconductor device and method of manufacturing the same
09/16/2010US20100230747 Process for manufacturing a power device with a trench-gate structure and corresponding device
09/16/2010US20100230746 Semiconductor device and manufacturing method thereof
09/16/2010US20100230744 Reliable memory cell
09/16/2010US20100230740 Nonvolatile semiconductor memory device and manufacturing method thereof
09/16/2010US20100230739 Non-volatile semiconductor memory device and process of manufacturing the same
09/16/2010US20100230738 Nor flash memory structure with highly-doped drain region and method of manufacturing the same
09/16/2010US20100230737 Semiconductor device and method for manufacturing the same
09/16/2010US20100230735 Deep Trench Capacitor on Backside of a Semiconductor Substrate
09/16/2010US20100230733 Vertical gated access transistor
09/16/2010US20100230732 Field effect transistor with air gap dielectric
09/16/2010US20100230731 Circuitry and method
09/16/2010US20100230729 Pixel sensor cell including light shield
09/16/2010US20100230727 Electric Circuit with Vertical Contacts
09/16/2010US20100230724 Methods for forming three-dimensional memory devices, and related structures
09/16/2010US20100230721 Semiconductor device and manufacturing method of semiconductor device
09/16/2010US20100230720 Semiconductor device and method
09/16/2010US20100230718 Semiconductor device and method for producing a semiconductor device
09/16/2010US20100230715 Semiconductor device and method for producing a semiconductor device
09/16/2010US20100230712 Light emitting device and method of fabricating the same
09/16/2010US20100230697 Opto-electronic semiconductor module and method for the production thereof
09/16/2010US20100230696 Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing them
09/16/2010US20100230690 Group iii nitride semiconductor device, epitaxial substrate, and method of fabricating group iii nitride semiconductor device
09/16/2010US20100230682 Array substrate and method of manufacturing the same
09/16/2010US20100230679 Contact portion of wire and manufacturing method thereof
09/16/2010US20100230678 Semiconductor device and manufacturing method thereof
09/16/2010US20100230677 Thin film transistor and manufacturing method thereof
09/16/2010US20100230676 Tft array substrate and method for manufacturing the same
09/16/2010US20100230674 Method for forming non-aligned microcavities of different depths