Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/23/2010DE112008003029T5 Werkstückträger mit Fluidzonen zur Temperatursteuerung A carrier with fluid zones for temperature control
09/23/2010DE112007000662B4 Verfahren zum Herstellen von Transistoren mit epitaktischem Silizium-Germanium für reduzierten Übergangswiderstand bei Feldeffekt-Transistoren A process for the manufacture of transistors having epitaxial silicon-germanium for reduced contact resistance with field-effect transistors
09/23/2010DE112006000647B4 Verfahren zum Bilden selbst-passivierender Interconnects A method of forming self-passivating interconnects
09/23/2010DE10222083B4 Isolationsverfahren für eine Halbleitervorrichtung Isolation method for a semiconductor device
09/23/2010DE102010015957A1 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
09/23/2010DE102010015930A1 Integrierte Schaltung mit Feldeffekttransistoren und Herstellungsverfahren hierfür An integrated circuit comprising field effect transistors and methods of manufacture therefor
09/23/2010DE102010008251A1 Ausfallanalyseverfahren, -vorrichtung und -programm für integriete Halbleiterschaltung Failure analysis method, apparatus, and program for integrated IT semiconductor circuit
09/23/2010DE102010000537A1 Halbleiteranordnung mit einem Abstandshalterelement A semiconductor device with a spacer element
09/23/2010DE102009053158A1 Verfahren zum Herstellen einer Leistungshalbleitervorrichtung A method of manufacturing a power semiconductor device
09/23/2010DE102009037113A1 Suppressing interference effects on surface illuminated by laser beam, comprises guiding laser beam through optical elements before impinging on surface, and oscillatingly changing one of the optical elements in their optical properties
09/23/2010DE102009012546A1 Mono anti-reflection silicon nitride layer for use on switching circuits with e.g. photodiodes, by single-step plasma enhanced chemical vapor deposition method, is designed as protective layer against data degradation of elements
09/23/2010DE102009011308A1 Vorrichtung und Verfahren zur simultanen Mikrostrukturierung und Dotierung von Halbleitersubstraten Apparatus and method for simultaneous microstructuring and doping of semiconductor substrates
09/23/2010DE102009001722A1 Method of applying heat transfer medium, involves providing thermal contact surface having object, and applying phase change material having thermal compound to thermal contact surface
09/23/2010DE102009001534A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component
09/23/2010DE102008054075B4 Halbleiterbauelement mit Abgesenktem Drain- und Sourcebereich in Verbindung mit einem Verfahren zur komplexen Silizidherstellung in Transistoren A semiconductor device with a lowered drain and source area in connection with a process for the complex Silizidherstellung in transistors
09/23/2010DE102008029866B4 Laterales DMOS-Bauelement und Verfahren zu seiner Herstellung Lateral DMOS device and process for its preparation
09/22/2010EP2230691A2 Semiconductor device and method of manufacturing the same, and electronic apparatus
09/22/2010EP2230690A2 Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus
09/22/2010EP2230686A2 Method of manufacturing semiconductor device
09/22/2010EP2230685A2 Semiconductor element, and method of forming silicon-based film
09/22/2010EP2230684A2 Integrated circuit arrangement with low-resistance contacts and method for production thereof
09/22/2010EP2230683A1 Device and method for releasing a wafer from a holder
09/22/2010EP2230681A1 Drive system for scanning a workpiece with an ion beam
09/22/2010EP2230527A2 Mechanism for fixing probe card
09/22/2010EP2230497A1 Diode bolometer and a method for producing a diode bolometer
09/22/2010EP2230334A1 MULTILAYER SUBSTRATE INCLUDING GaN LAYER, METHOD FOR MANUFACTURING THE MULTILAYER SUBSTRATE INCLUDING GAN LAYER, AND DEVICE
09/22/2010EP2230333A1 Method for growing aluminum nitride crystal, process for producing aluminum nitride crystal, and aluminum nitride crystal
09/22/2010EP2230314A1 Method of sensing an analyte
09/22/2010EP2230073A1 Compression bonding device
09/22/2010EP2229723A1 Resonant body transistor and oscillator
09/22/2010EP2229710A1 An artificial dielectric material and a method of manufacturing the same
09/22/2010EP2229693A1 Semiconductor device and manufacturing method thereof
09/22/2010EP2229692A2 Electrode tuning method and apparatus for a layered heater structure
09/22/2010EP2229691A1 A method for attaching a semiconductor die to a leadframe, and a semiconductor device
09/22/2010EP2229690A1 Process for forming a wire portion in an integrated electronic circuit
09/22/2010EP2229689A1 Method for localised hetero-epitaxy on a dielectric, in particular germanium on silicon oxide, and method and system for making a production base of a homogeneous or heterogeneous integrated circuit
09/22/2010EP2229688A2 Device and method for the wet processing of different substrates
09/22/2010EP2229346A1 Optical member for euvl and surface treatment method thereof
09/22/2010EP2100326B1 Etching amorphous semiconductor oxides with alkaline etchant solution
09/22/2010EP1833080B1 Reflective photomask blank, reflective photomask, and method for manufacturing semiconductor device using same
09/22/2010EP1780770B1 Exposure apparatus and exposure method
09/22/2010EP1508261B1 Electronic assembly and method of making an electronic assembly
09/22/2010EP1470592B1 Boron phosphide based semiconductor device
09/22/2010EP1273045B1 Diode and method for producing the same
09/22/2010CN201590412U Clamping-type upending device
09/22/2010CN201590411U Pickling sheet
09/22/2010CN201590410U 晶片盒 Wafer cassette
09/22/2010CN201590409U COG chip back bonding device
09/22/2010CN201590408U Automatic pressure balancing structure of diffusion furnace
09/22/2010CN201590407U 固定装置 Fixtures
09/22/2010CN201590406U Ejector mechanism of chip sorting device
09/22/2010CN201589921U TFT-LCD medicine liquid manufacturing tank and equipment thereof
09/22/2010CN201587045U Adjustable main shaft of square cutting machine
09/22/2010CN1992181B Method for forming a semiconductor device having recess channel
09/22/2010CN1979205B Methods for variability measurement of integrated circuit components and integrated circuit components
09/22/2010CN1941406B Method of forming a self-aligned transistor and structure therefor
09/22/2010CN1934671B Method for forming carbonaceous material protrusion and carbonaceous material protrusion
09/22/2010CN1934288B Plasma CVD equipment
09/22/2010CN1929948B Repair soldering head having a supply channel for a heat transfer medium and a return channel for said heat transfer medium, and the use thereof
09/22/2010CN1906764B Gradient deposition of low-k cvd materials
09/22/2010CN1905178B Circuit assembly structure and method for making the same
09/22/2010CN1856841B Nonvolatile semiconductor memory device having protection function for each memory block
09/22/2010CN1855370B Method of producing nitride-based semiconductor device, and light-emitting device produced thereby
09/22/2010CN1849264B Cerium salt, process for producing the same, cerium oxide, and cerium-based abrasive material
09/22/2010CN1831651B Method for providing layout design and photomask
09/22/2010CN1812070B Probe card, method of manufacturing the probe card and alignment method
09/22/2010CN1808625B Flat roof device
09/22/2010CN1804114B Thin film forming device and cleaning method thereof
09/22/2010CN1797773B Tft array substrate and the fabrication method thereof
09/22/2010CN1776531B Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system
09/22/2010CN1757114B Charge-trapping memory arrays resistant to damage from contact hole formation
09/22/2010CN1733577B Substrate transport apparatus
09/22/2010CN1726606B Organic light emitting materials and devices
09/22/2010CN1702770B Semiconductor integrated circuit device
09/22/2010CN1670116B Polishing composition and polishing method
09/22/2010CN1535796B Ion bombardment electric grinding indicator for reducing noise in course of grinding process
09/22/2010CN101842978A Power amplifier and power amplifier control method
09/22/2010CN101842904A Thin film active element group, thin film active element array, organic light emitting device, display device and method for manufacturing thin film active element group
09/22/2010CN101842903A Semiconductor device and method for manufacturing the same
09/22/2010CN101842902A Semiconductor structure and method of manufacture
09/22/2010CN101842899A Method for integrating NVM circuitry with logic circuitry
09/22/2010CN101842898A Method for enabling multiple vt devices using high-k metal gate stacks
09/22/2010CN101842890A Inline-type wafer conveyance device
09/22/2010CN101842889A Device for supporting workpiece
09/22/2010CN101842888A Semiconductor mounting apparatus and semiconductor mounting method
09/22/2010CN101842887A Method for the production and contacting of electronic components by means of a substrate plate, particularly a DCB ceramic substrate plate
09/22/2010CN101842886A Methods for fabricating sub-resolution alignment marks on semiconductor structures and semiconductor structures including same
09/22/2010CN101842885A Gold alloy wire for ball bonding
09/22/2010CN101842884A III nitride electronic device and III nitride semiconductor epitaxial substrate
09/22/2010CN101842883A Semiconductor structure and method of manufacture
09/22/2010CN101842882A Liquid raw material vaporizer and film forming apparatus using the same
09/22/2010CN101842881A Plasma treatment apparatus
09/22/2010CN101842880A Gas feeding device, treating device, treating method, and storage medium
09/22/2010CN101842879A Plasma treatment apparatus and plasma treatment method
09/22/2010CN101842878A Semiconductor device and method for manufacturing the same
09/22/2010CN101842877A Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
09/22/2010CN101842876A Method for forming silicon dots
09/22/2010CN101842875A Plasma treatment between deposition processes
09/22/2010CN101842874A Multi-region processing system and heads
09/22/2010CN101842873A Vapor based combinatorial processing