Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/14/2010US20100258169 Pulsed plasma deposition for forming microcrystalline silicon layer for solar applications
10/14/2010US20100258166 Glass compositions used in conductors for photovoltaic cells
10/14/2010US20100258165 Glass compositions used in conductors for photovoltaic cells
10/14/2010US20100258161 Semiconductor Device
10/14/2010US20100258159 Thin film type solar cell and method for manufacturing the same
10/14/2010DE202009017956U1 Reinraumlager für grossflächige, zerbrechliche Substrate Cleanroom stock for large-scale, fragile substrates
10/14/2010DE19807649B4 Vorrichtung und Verfahren zur dreidimensionalen Messung und Beobachtung dünner Schichten Apparatus and method for three-dimensional measurement and observation of thin layers
10/14/2010DE19758561B4 Verfahren zur Herstellung eines feinen Musters und einer Halbleitervorrichtung A process for producing a fine pattern and a semiconductor device
10/14/2010DE112008002620T5 Höcker-E/A-Kontakt für eine Halbleitervorrichtung Bump I / O pad for a semiconductor device
10/14/2010DE10297583B4 Verfahren zum Herstellen eines Soi-Bauteils mit unterschiedlichen Siliziumdicken A method for producing an SOI component with different thicknesses of silicon
10/14/2010DE10296608B4 Verfahren zum Herstellen einer Speicherzelle A method for fabricating a memory cell
10/14/2010DE10261404B4 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device
10/14/2010DE10226236B4 Verfahren zur Ausbildung einer einzelnen Verdrahtungsebene für Transistoren mit planaren und vertikalen Gates auf dem gleichen Substrat sowie Speicherzellenanordnung A method of forming a single wiring layer for transistors with planar and vertical gates on the same substrate, and memory cell array
10/14/2010DE102010016229A1 Method for manufacturing semiconductor device, involves providing chips mounted on carriers, and providing film on chip and carrier
10/14/2010DE102010016185A1 Herstellung eines Halbleiter-Bauelements Production of a semiconductor device
10/14/2010DE102010004230A1 Integrated circuit for use in e.g. electronic system, has interface-structures directly connected to doped area in respective partial areas of contact surface, where structures are made from respective conducting materials
10/14/2010DE102010003600A1 Waferbearbeitungsverfahren Wafer processing method
10/14/2010DE102010003129A1 Ein Verfahren zum Herstellen eines Bauelements auf einem Substrat A method of manufacturing a device on a substrate
10/14/2010DE102010000113A1 Halbleiterbauelement und Verfahren zur Herstellung A semiconductor device and method for producing
10/14/2010DE102009056787A1 Power Quad Flat No-Lead-Halbleiter-Chip-Packages mit isolierter Wärmesenke für Hochspannungs-, Hochleistungsanwendungen, Systeme zum Verwenden dieser und Verfahren zum Herstellen dieser Power Quad Flat No-Lead semiconductor chip package with insulated heat sink for high-voltage, high-performance applications, systems, and how to use these methods for making these
10/14/2010DE102009044863A1 Halbleiter-Bauelement Semiconductor component
10/14/2010DE102009042399A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof
10/14/2010DE102009017238A1 Method for the production of opposite soldering joints on a sandwich arrangement from a solar cell and from solder band arranged on opposite surface area of the solar cell, comprises attaching solder head to the surface of the solder bands
10/14/2010DE102009016811A1 Verfahren zur automatischen Vermessung und zum Einlernen von Lagepositionen von Objekten innerhalb eines Substratprozessiersystems mittels Sensorträger und zugehöriger Sensorträger A method for automatic measurement and for teaching positions of location of objects within a Substratprozessiersystems using sensor carrier and associated sensor support
10/14/2010DE102009016594A1 Kontaktanordnung zur Substratkontaktierung Contact arrangement for substrate contacting
10/14/2010DE102009016125A1 Verfahren und Vorrichtung zur Bearbeitung, insbesondere zur Trennung, von Werkstücken Method and apparatus for processing, in particular for separation of workpieces
10/14/2010DE102009015757A1 Druckunterstützung für eine elektronische Schaltung Pressure Support for an electronic circuit
10/14/2010DE102009015747A1 Schwellwerteinstellung von Transistoren mit Metallgateelektrodenstrukturen mit großem ε und einer Zwischenätzstoppschicht Threshold of transistors with metal gate electrode structures with large ε and a Zwischenätzstoppschicht
10/14/2010DE102009015715A1 Bewahren der Integrität eines Gatestapels mit großem ε durch einen Versatzabstandshalter, der zum Bestimmen eines Abstandes einer verformungsinduzierenden Halbleiterlegierung verwendet wird Preserve the integrity of a gate stack with large ε offset by a spacer that is used for determining a distance of a strain-inducing semiconductor alloy
10/14/2010DE102009015712A1 Materialentfernung in Halbleiterbauelementen durch Verdampfen Material removal in semiconductor devices by evaporation
10/14/2010DE102009015259A1 Surface-mountable component, has solderable connection pads arranged on side of carrier for surface-mounting of component, where side of carrier faces chip and connection pads are connected to chip via connecting lines
10/14/2010DE102009002255A1 Method for manufacturing conductive vias in e.g. semiconductor component, involves depositing protective layer on portion of insulation layer, and partially fixing functional layer at bottom of trenches
10/14/2010DE102008053684B4 Hinterleuchtungsvorrichtung für Halbleitererzeugnisse The backlighting of semiconductor products
10/14/2010DE102008053179A1 Verfahren zum Erzeugen eines Transistorgates mit sub-fotolithographischen Abmessungen A method for producing a transistor gate with sub-photolithographic dimensions
10/14/2010DE102008049717B4 Verfahren zur Herstellung eines Halbleiterbauelements als Transistor mit einem Metallgatestapel mit großem ε und einem kompressiv verspannten Kanal A process for producing a semiconductor device as a transistor with a metal gate stack with large ε and a compressively strained channel
10/14/2010DE102008012678B4 Verfahren zum Bilden einer metallischen Elektrode und die metallische Elektrode aufweisende Halbleitervorrichtung A method of forming a metallic electrode and the metal electrode semiconductor device having
10/14/2010CA2758074A1 Improved silicon thin film deposition for photovoltaic device applications
10/14/2010CA2757921A1 Mixed metal oxides
10/14/2010CA2757760A1 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same
10/14/2010CA2739570A1 Insulated gate bipolar transistor
10/13/2010EP2240006A1 Ambient-curable anisotropic conductive adhesive
10/13/2010EP2239833A1 Charge pump circuit and semiconductor integrated circuit
10/13/2010EP2239789A1 Laminating assembly
10/13/2010EP2239780A1 Methods of manufacturing active matrix substrate and organic light-emitting display device
10/13/2010EP2239772A1 Semiconductor storage device
10/13/2010EP2239771A1 Semiconductor storage device
10/13/2010EP2239769A1 Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use
10/13/2010EP2239768A1 High-performance semiconductor with a connection device and internal auxiliary connection elements designed as contact springs
10/13/2010EP2239767A1 Package for a semiconductor die and method of making the same
10/13/2010EP2239766A1 Bonding wire for semiconductor device
10/13/2010EP2239765A1 Substrate and method for manufacturing the same
10/13/2010EP2239764A2 Method for cutting semiconductor substrate
10/13/2010EP2239763A1 Dicing/die bonding film
10/13/2010EP2239131A1 Compression bonding device
10/13/2010EP2239127A1 Imprinting device and imprinting method
10/13/2010EP2239084A1 Method of and apparatus for irradiating a semiconductor material surface by laser energy
10/13/2010EP2238618A2 Method for reversibly mounting a device wafer to a carrier substrate
10/13/2010EP2238616A1 Differential nitride pullback to create differential nfet to pfet divots for improved performance versus leakage
10/13/2010EP2238615A1 A method for fabricating a dual-orientation group-iv semiconductor substrate
10/13/2010EP2238614A2 Vertical outgassing channels
10/13/2010EP2238613A2 Integrated circuits on a wafer and method of producing integrated circuits
10/13/2010EP2238612A1 Method and apparatus for manufacture of via disk
10/13/2010EP2238611A2 Edge-contacted vertical carbon nanotube transistor
10/13/2010EP2238609A1 System and method for depositing a material on a substrate
10/13/2010EP2238608A1 Large area nanopatterning method and apparatus
10/13/2010EP2238466A1 Method and device for transporting electronic modules
10/13/2010EP2238277A2 Low wet etch rate silicon nitride film
10/13/2010EP2238198A1 Silsesquioxane resins
10/13/2010EP2237698A2 Object provided with a graphics element transferred onto a support wafer and method of producing such an object
10/13/2010EP2002471B1 Interconnection of electronic devices with raised leads
10/13/2010EP1547143B1 A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine
10/13/2010EP1412978B1 Electronic component with a plastic housing and method for production thereof
10/13/2010EP1390295B1 Nanotube array and method for producing a nanotube array
10/13/2010EP1008668B1 Apparatus for manufacturing thin film
10/13/2010CN201608183U 沟槽型大功率mos器件 Trench type power mos devices
10/13/2010CN201608172U 封装载板结构 Package substrate structure
10/13/2010CN201608171U 引线框架排列对齐装置 Lead frame alignment device arranged
10/13/2010CN201608170U 对位系统 Alignment System
10/13/2010CN201608169U 一种功率器件键合时用的上压板 An upper platen power devices bonded to use
10/13/2010CN201608168U 引线框架去毛刺装置 Leadframe deburring device
10/13/2010CN201608167U 一种视觉成像处理定位贴装机器 A visual imaging processing positioning placement machine
10/13/2010CN201608166U 可控双向交叉循环通风装置 Controlled ventilation means a two-way cross-circulation
10/13/2010CN201608165U 真空腔定位装置 Vacuum chamber positioning device
10/13/2010CN201608164U 倒装芯片封装的绕线装置 Flip-chip package winding device
10/13/2010CN201608163U 集成电路dc矫正器 IC dc braces
10/13/2010CN201608162U Ic封装的扩晶装置 Ic package extended crystal device
10/13/2010CN201604973U 引线框架输送机构的驱动装置 Drive means of the lead frame transport mechanism
10/13/2010CN1998081B Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device
10/13/2010CN1996589B Structure of the Damascus using the gas filling to reduce the dielectric constant and its making method
10/13/2010CN1977366B High-electron-mobility transistor, field-effect transistor, epitaxial substrate, method for manufacturing epitaxial substrate, and method for manufacturing group iii nitride transistor
10/13/2010CN1960621B Circuit board supplying device, circuit board rolling device, circuit board processing system, circuit board supplying method and circuit board rolling method
10/13/2010CN1954409B Implanted counted dopant ions
10/13/2010CN1953209B High voltage semiconductor device, semiconductor device and forming method thereof
10/13/2010CN1953157B Electron interconnection and its making method
10/13/2010CN1912187B Etchant composition, methods of patterning conductive layer and manufacturing flat panel display device using the same
10/13/2010CN1897272B Photodetection system
10/13/2010CN1834608B Sample support prepared by semiconductor silicon process technique
10/13/2010CN1828412B Corrosion resistant composition and method for forming pattern on substrate
10/13/2010CN1825556B Wafer holder
10/13/2010CN1821872B Etchant composition and manufacturing method for thin film transistor array panel
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