Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/09/2010US7830021 Tamper resistant packaging with transient liquid phase bonding
11/09/2010US7830020 Integrated circuit package system employing device stacking
11/09/2010US7830016 Seed layer for reduced resistance tungsten film
11/09/2010US7830013 Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof
11/09/2010US7830012 Polycarbosilane substituted with a benzyl or diazo group and/or a polysilazane having a substituent capable of absorbing light; blocks ultraviolet light applied to a porous insulating film
11/09/2010US7830001 Cu-Mo substrate and method for producing same
11/09/2010US7829988 Stacking quad pre-molded component packages, systems using the same, and methods of making the same
11/09/2010US7829987 Carrier structure embedded with semiconductor chips and method for manufacturing the same
11/09/2010US7829976 Microelectronic devices and methods for forming interconnects in microelectronic devices
11/09/2010US7829975 Multichip semiconductor device, chip therefor and method of formation thereof
11/09/2010US7829952 Semiconductor memory device and a method of manufacturing the same
11/09/2010US7829950 Nonvolatile semiconductor memory and method of manufacturing the same
11/09/2010US7829946 Semiconductor device
11/09/2010US7829945 Lateral diffusion field effect transistor with asymmetric gate dielectric profile
11/09/2010US7829944 High-voltage vertical transistor with a multi-layered extended drain structure
11/09/2010US7829936 Split charge storage node inner spacer process
11/09/2010US7829935 Semiconductor memory, semiconductor memory system using the memory, and method for manufacturing quantum dot used in semiconductor memory
11/09/2010US7829928 Semiconductor structure of a high side driver and method for manufacturing the same
11/09/2010US7829927 Polyoxometallates in memory devices
11/09/2010US7829925 Semiconductor device and method for manufacturing same
11/09/2010US7829921 Optimized transistor for imager device
11/09/2010US7829916 Transistor with a germanium-based channel encased by a gate electrode and method for producing one such transistor
11/09/2010US7829915 Avalanche photodiode
11/09/2010US7829913 Porous substrate and its manufacturing method, and gan semiconductor multilayer substrate and its manufacturing method
11/09/2010US7829906 Three dimensional features on light emitting diodes for improved light extraction
11/09/2010US7829901 LED chip package structure with high-efficiency light-emitting effect and method for making the same
11/09/2010US7829900 Nitride-based semiconductor element and method of forming nitride-based semiconductor
11/09/2010US7829898 Power semiconductor device having raised channel and manufacturing method thereof
11/09/2010US7829892 Integrated circuit including a gate electrode
11/09/2010US7829888 Organic light emitting diode display device and method of manufacturing the same
11/09/2010US7829887 Organic light emitting diode display device and method of manufacturing the same
11/09/2010US7829883 Vertical carbon nanotube field effect transistors and arrays
11/09/2010US7829876 Vacuum cell thermal isolation for a phase change memory device
11/09/2010US7829864 Microfabricated miniature grids
11/09/2010US7829852 Device having etched feature with shrinkage carryover
11/09/2010US7829476 Method of manufacturing semiconductor device and semiconductor device
11/09/2010US7829475 Baking method of quartz products, computer program and storage medium
11/09/2010US7829474 Method for arraying nano material and method for fabricating liquid crystal display device using the same
11/09/2010US7829473 forming first conductive layer, forming composition layer over first conductive layer by discharging a composition in which nanoparticles comprising conductive material covered with organic material are dispersed in solvent, drying the composition layer; and decomposing organic material
11/09/2010US7829472 Method of forming at least an opening using a tri-layer structure
11/09/2010US7829471 Cluster tool and method for process integration in manufacturing of a photomask
11/09/2010US7829470 Method for manufacturing semiconductor device
11/09/2010US7829469 Method and system for uniformity control in ballistic electron beam enhanced plasma processing system
11/09/2010US7829468 Method and apparatus to detect fault conditions of plasma processing reactor
11/09/2010US7829467 Method for producing a polished semiconductor
11/09/2010US7829466 Methods for fabricating FinFET structures having different channel lengths
11/09/2010US7829465 Method for plasma etching of positively sloped structures
11/09/2010US7829464 Planarization method using hybrid oxide and polysilicon CMP
11/09/2010US7829463 Plasma processing method and plasma processing apparatus
11/09/2010US7829462 Through-wafer vias
11/09/2010US7829461 Method for fabricating semiconductor device
11/09/2010US7829460 Method of manufracturing increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
11/09/2010US7829458 Method of forming a wiring structure in a semiconductor device
11/09/2010US7829457 Protection of conductors from oxidation in deposition chambers
11/09/2010US7829456 Method to modulate coverage of barrier and seed layer using titanium nitride
11/09/2010US7829455 Method for creating barriers for copper diffusion
11/09/2010US7829454 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device
11/09/2010US7829453 Method for forming solder balls with a stable oxide layer by controlling the reflow ambient
11/09/2010US7829452 Terminal pad structures and methods of fabricating same
11/09/2010US7829451 Conductive ball mounting method and apparatus having a movable solder ball container
11/09/2010US7829450 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
11/09/2010US7829449 Process for fabricating an electronic integrated circuit and electronic integrated circuit thus obtained
11/09/2010US7829448 Structure of high electron mobility transistor, a device comprising the structure and a method of producing the same
11/09/2010US7829447 Semiconductor structure pattern formation
11/09/2010US7829446 Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads
11/09/2010US7829445 Method of manufacturing a flash memory device
11/09/2010US7829444 Field effect transistor manufacturing method
11/09/2010US7829443 Nitride nanowires and method of producing such
11/09/2010US7829442 Semiconductor heterostructures having reduced dislocation pile-ups and related methods
11/09/2010US7829441 Thermosetting die-bonding film
11/09/2010US7829440 Method of separating semiconductor dies
11/09/2010US7829439 Laser beam processing method for making a semiconductor device
11/09/2010US7829438 Edge connect wafer level stacking
11/09/2010US7829437 Method of manufacturing a semiconductor device
11/09/2010US7829436 Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer
11/09/2010US7829435 Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based element
11/09/2010US7829434 Method for manufacturing semiconductor wafer
11/09/2010US7829433 SOI substrate and manufacturing method of the same, and semiconductor device
11/09/2010US7829432 Method for manufacturing SOI substrate
11/09/2010US7829431 Method for manufacturing a SOI with plurality of single crystal substrates
11/09/2010US7829430 Methods for preparing and devices with treated dummy moats
11/09/2010US7829429 Semiconductor device having localized insulated block in bulk substrate and related method
11/09/2010US7829428 Method for eliminating a mask layer during thin film resistor manufacturing
11/09/2010US7829427 Method of fabricating a high Q factor integrated circuit inductor
11/09/2010US7829426 Semiconductor component and method of manufacture
11/09/2010US7829425 Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits
11/09/2010US7829424 Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
11/09/2010US7829422 Integrated circuit having ultralow-K dielectric layer
11/09/2010US7829421 SOI transistor having an embedded strain layer and a reduced floating body effect and a method for forming the same
11/09/2010US7829420 Method of forming a channel termination region using a trench and a channel stopper ring
11/09/2010US7829419 Semiconductor device and method for manufacturing the same
11/09/2010US7829418 Semiconductor apparatus and method for fabricating the same
11/09/2010US7829417 Semiconductor apparatus and method of manufacturing semiconductor apparatus
11/09/2010US7829416 Silicon carbide semiconductor device and method for producing the same
11/09/2010US7829415 Method of fabricating semiconductor device for preventing a pillar pattern from bending and from exposing externally
11/09/2010US7829414 Method for manufacturing non-volatile semiconductor memory device, and non-volatile semiconductor memory device
11/09/2010US7829413 Methods for forming quantum dots and forming gate using the quantum dots
11/09/2010US7829412 Method of manufacturing flash memory device
11/09/2010US7829411 Method and device to form high quality oxide layers of different thickness in one processing step
11/09/2010US7829410 Methods of forming capacitors, and methods of forming DRAM arrays