Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/10/2010CN101884099A Method for treating semiconductor processing components and components formed thereby
11/10/2010CN101884098A Apparatus and method for mounting electronic component
11/10/2010CN101884097A Structure and method of forming a topside contact to a backside terminal of a semiconductor device
11/10/2010CN101884096A Semiconductor device and method for manufacturing the same
11/10/2010CN101884095A Silicon etching liquid and etching method
11/10/2010CN101884094A Method for machining nitride semiconductor wafer, nitride semiconductor wafer, process for producing nitride semiconductor device, and nitride semiconductor device
11/10/2010CN101884093A Spatial phase feature location
11/10/2010CN101884092A Method and solution for cleaning semiconductor device substrate
11/10/2010CN101884091A Apparatus and method for depositing electrically conductive pasting material
11/10/2010CN101884090A Semiconductor device and method for producing same
11/10/2010CN101884089A Chip mounting system
11/10/2010CN101884088A Light-emitting diode chip with high extraction and method for manufacturing the same
11/10/2010CN101884016A Lithography system, method of clamping and wafer table
11/10/2010CN101884015A Resist underlayer film forming composition and method for forming resist pattern
11/10/2010CN101883986A Probe device
11/10/2010CN101883979A Substrate surface inspecting apparatus and substrate surface inspecting method
11/10/2010CN101883881A Method for producing group iii nitride-based compound semiconductor, wafer including group iii nitride-based compound semiconductor, and group iii nitride-based compound semiconductor device
11/10/2010CN101883880A Method and device for supplying electrical power
11/10/2010CN101883830A Tape for processing wafer
11/10/2010CN101883797A Curable composition for transfer materials and method for forming micropattern using the curable composition
11/10/2010CN101883659A Method and structure for dividing a substrate into individual devices
11/10/2010CN101883656A Ultrasonic vibration welder
11/10/2010CN101882724A Sealed power transmission device
11/10/2010CN101882668A Display device
11/10/2010CN101882631A Fast recovery diode and manufacturing method thereof
11/10/2010CN101882630A Semiconductor device and method for manufacturing the same
11/10/2010CN101882627A Phase change memory device and manufacturing method thereof
11/10/2010CN101882625A Light sensor using wafer-level packaging
11/10/2010CN101882624A Structure with high-Ge strained layer formed on insulating substrate and forming method
11/10/2010CN101882622A Flash memory device and manufacturing method the same
11/10/2010CN101882621A Carbon nanotube network storage and preparation method thereof
11/10/2010CN101882619A Semiconductor device and method of manufacturing the same
11/10/2010CN101882617A Schottky diode, semiconductor memory and manufacturing technology thereof
11/10/2010CN101882610A Semiconductor structure and manufacturing method thereof
11/10/2010CN101882608A Bump pad structure and method for manufacturing the same
11/10/2010CN101882606A Heat-dissipation semiconductor encapsulation structure and manufacturing method thereof
11/10/2010CN101882604A Method for separately manufacturing active matrix-driven organic light-emitting diode
11/10/2010CN101882603A Method of doping impurity ions in dual gate and method of fabricating the dual gate using the same
11/10/2010CN101882602A Manufacturing method of phase-changing random access memory
11/10/2010CN101882601A Organic light emitting display device and manufacturing method of the same
11/10/2010CN101882600A Manufacturing method of metallic film stacks and integrated circuit containing the metallic film stacks
11/10/2010CN101882599A Method for forming metal line of semiconductor device
11/10/2010CN101882598A Electric through connection and forming method thereof
11/10/2010CN101882597A Method for reducing contact resistance of connecting hole
11/10/2010CN101882596A Method for etching metal layer
11/10/2010CN101882595A Method and device for removing barrier layer
11/10/2010CN101882594A Forming method of conductive plug
11/10/2010CN101882593A Method for improving breakdown voltage from N-well to another N-well
11/10/2010CN101882592A Elastic adjusting mechanism for special semiconductor device
11/10/2010CN101882591A Detection method of wafer
11/10/2010CN101882590A Heating block device
11/10/2010CN101882589A Method of forming integrated circuit structure
11/10/2010CN101882588A Method for reducing whisker defects on surface of aluminum lining pad
11/10/2010CN101882587A Structure for achieving wire bonding and packaging and production method thereof
11/10/2010CN101882586A Attaching method for integrated circuit chips
11/10/2010CN101882585A Method for arranging radiator of integrated circuit and integrated circuit component
11/10/2010CN101882584A Heat-conducting insulating composite substrate and preparation method thereof
11/10/2010CN101882583A Trenched-gate field effect transistors and methods of forming the same
11/10/2010CN101882582A Production method of semiconductor device
11/10/2010CN101882581A Method for improving surface uniformity of charge storage layer
11/10/2010CN101882580A Strip with reduced low-K dielectric damage
11/10/2010CN101882579A Cutting method of ONO (Oxide-Nitride-Oxide) dielectric layer
11/10/2010CN101882578A Integral solid laser lift-off and cutting equipment
11/10/2010CN101882577A Roughing method of wafer backside
11/10/2010CN101882576A Method for improving efficiency of erasing floating gate
11/10/2010CN101882575A Method for manufacturing ohmic contact on SiC matrix for preventing transverse spreading of metal
11/10/2010CN101882574A Method for doping grid electrode, drain electrode and source electrode in semiconductor manufacturing process
11/10/2010CN101882573A Method for introducing dislocation on silicon chip
11/10/2010CN101882572A Method for realizing selectivity through low temperature
11/10/2010CN101882571A III nitride semiconductor crystal and manufacturing method thereof, III nitride semiconductor device and manufacturing method thereof, and light emitting device
11/10/2010CN101882570A Method for improving alignment precision after epitaxial growth
11/10/2010CN101882569A Method for removing flash on lead wire and frame of diode or triode
11/10/2010CN101882568A Division mechanism
11/10/2010CN101882567A Plasma processing apparatus and high frequency short-circuit apparatus
11/10/2010CN101882566A Method for removing metal attachments
11/10/2010CN101882565A Online processing equipment
11/10/2010CN101882564A Guide pin trimming device and module
11/10/2010CN101882563A Pick-and-place mechanism of crystal particles
11/10/2010CN101882562A Wire jointing device for semiconductor packaging and method thereof
11/10/2010CN101882181A Method for reducing parasitic parameter influence in TPF-LCD (Thin Film Transistor Liquid Crystal Display) driving chip layout design
11/10/2010CN101881930A Lithographic appartus and device manufacturing method
11/10/2010CN101881914A Thin-film transistor display panel and manufacturing method thereof
11/10/2010CN101881901A Production line of liquid crystal display
11/10/2010CN101881687A Leak detection device of semiconductor manufacturing platform as well as use method and platform thereof
11/10/2010CN101880907A Electrochemical levelling and polishing processing method with nanometer precision and device thereof
11/10/2010CN101880902A Apparatus and method for depositing and planarizing thin films of semiconductor wafers
11/10/2010CN101880878A Device for gas linear cutting of silicon slice
11/10/2010CN101880869A Film forming method and plasma film forming apparatus
11/10/2010CN101880609A Silicon wafer cleaning agent and use method thereof
11/10/2010CN101879706A Diamond grinding disc and manufacturing method thereof
11/10/2010CN101879702A Combined trimmer and manufacturing method thereof
11/10/2010CN101879700A Chemical mechanical polishing device, polishing method and system for wafer
11/10/2010CN101879699A Circulating progressive planarization method and semiconductor grinding cleaning device used for method
11/10/2010CN101879658A Laser irradiating device, laser irradiating method, and semiconductor manufacture method
11/10/2010CN101879642A Solder ball printing apparatus and solder ball printing method
11/10/2010CN101879511A Method and device for cleaning semiconductor silicon wafer
11/10/2010CN101615644B Thin LED and manufacture method thereof
11/10/2010CN101599434B Fabricating method of semiconductor device
11/10/2010CN101599430B Forming method and etching control system of semiconductor device grid
11/10/2010CN101599429B Method for forming side wall
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