Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2011
07/06/2011EP2341114A1 Pressure-sensitive adhesive sheet with spontaneously rolling property
07/06/2011EP2340694A1 Printed circuit board for harsh environments
07/06/2011EP2340561A1 Multi-transistor memory cell
07/06/2011EP2340559A1 Pb-free solder bumps with improved mechanical properties
07/06/2011EP2340556A2 Production method and production device for strings
07/06/2011EP2340554A1 Methods and systems for material bonding
07/06/2011EP2340553A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device
07/06/2011EP2340552A1 3d integration of a mim capacitor and a resistor
07/06/2011EP2340551A1 Allotropic or morphologic change in silicon induced by electromagnetic radiation for resistance tuning of integrated circuits
07/06/2011EP2340284A2 Poly(arylene ether) composition and a covered conductor with flexible covering wall and large size conductor
07/06/2011EP2238616B1 Differential nitride pullback to create differential nfet to pfet divots for improved performance versus leakage
07/06/2011EP2013378B1 Exhaust system
07/06/2011EP1958243B1 Method of manufacturing semiconductor device
07/06/2011EP1791166B1 Method for measuring heating plate temperature, substrate processing equipment, and computer program for measuring heating plate temperature
07/06/2011EP1564794B1 Method and device for generating uniform high- frequency plasma over large surface area
07/06/2011EP1542267B1 Method and apparatus for polishing wafer
07/06/2011EP1433206B1 Single electron transistor with vertical channel, and production methods thereof
07/06/2011EP1376658B1 Method and apparatus for manufacturing semiconductor device
07/06/2011EP1320901B1 IMPROVED BUFFER FOR GROWTH OF GaN ON SAPPHIRE
07/06/2011EP1282918B1 Charge carrier extracting transistor
07/06/2011CN201893326U Clamping device
07/06/2011CN201893325U Silicon slice floating compaction device
07/06/2011CN201893324U Transmission system and plasma processing equipment comprising same
07/06/2011CN201893323U Automatic delivery device for diode manufacture
07/06/2011CN201893322U Driver connecting piece and compression ring elevating mechanism provided with same
07/06/2011CN201893321U BGA (ball grid array) chip repair device
07/06/2011CN201893320U Column grafting device with ceramic column grid array package
07/06/2011CN201893319U Truncated type deep groove structure of high-voltage FRD (Fast Recovery Diode)
07/06/2011CN201893318U Coiling and furling device for flexible semiconductor packaging
07/06/2011CN201892818U Device preventing sample from damage in coating membrane equipment
07/06/2011CN1991587B Laser processing device, exposure device and exposure method
07/06/2011CN1974168B Cutting device
07/06/2011CN1971912B 半导体集成电路及其设计方法 Semiconductor integrated circuit and design method
07/06/2011CN1954406B Projection optical system, exposure apparatus, and exposure method
07/06/2011CN1925136B Semiconductor device fabrication method and semiconductor device
07/06/2011CN1885557B Semiconductor element and method for forming semiconductor element
07/06/2011CN1855399B Semiconductor and method for manufacturing same
07/06/2011CN1812096B Cross-point nonvolatile memory devices and methods of fabricating the same
07/06/2011CN1692449B DMOS device with a programmable threshold voltage
07/06/2011CN1673410B Showerhead mounting to accommodate thermal expansion
07/06/2011CN1661387B Inspection system, inspection method, and method for manufacturing semiconductor device
07/06/2011CN1657401B Micromachine semiconductor element and manufacturing method thereof
07/06/2011CN1607875B Display device and method for manufacturing same
07/06/2011CN1606713B Spincoating antireflection paint for photolithography
07/06/2011CN102119443A Schottky barrier diode and method for manufacturing schottky barrier diode
07/06/2011CN102119441A Methods of making capacitors, DRAM arrays and electronic systems
07/06/2011CN102119440A Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure
07/06/2011CN102119439A A platen for reducing particle contamination on a substrate and a method thereof
07/06/2011CN102119438A Magnetic pad for end-effectors
07/06/2011CN102119437A Plasma processing apparatus, plasma processing method, and electronic device manufacturing method
07/06/2011CN102119436A Use of pattern recognition to align patterns in a downstream process
07/06/2011CN102119435A Method for manufacturing SOI wafer, and SOI wafer
07/06/2011CN102119427A Conductive adhesive and LED substrate using the same
07/06/2011CN102119230A Display device, Cu alloy film for use in the display device, and Cu alloy sputtering target
07/06/2011CN102119202A High porosity superabrasive resin products and method of manufacture
07/06/2011CN102119117A Micro-posts having improved uniformity and a method of manufacture thereof
07/06/2011CN102119069A Polishing pad and method for manufacturing the polishing pad
07/06/2011CN102119060A Ultrasonic cleaning apparatus
07/06/2011CN102117840A Multi-dispersed-metal fast recovery diode and preparation method thereof
07/06/2011CN102117838A Charge trapping type nonvolatile memory and manufacturing method thereof
07/06/2011CN102117835A Resistance-variable field effect transistor with ultra-steep sub-threshold slope and production method thereof
07/06/2011CN102117834A Multiple source MOS transistor with impurity segregation and production method thereof
07/06/2011CN102117833A Comb-shaped gate composite source MOS (Metal Oxide Semiconductor) transistor and manufacturing method thereof
07/06/2011CN102117832A Transistor and method thereof
07/06/2011CN102117831A Transistor and manufacturing method thereof
07/06/2011CN102117829A Fin type transistor structure and manufacturing method thereof
07/06/2011CN102117828A Semiconductor device and manufacturing method thereof
07/06/2011CN102117827A Parasitic vertical PNP device in bipolar complementary metal oxide semiconductor (BiCMOS) process
07/06/2011CN102117824A Organic light emitting display apparatus and method of manufacturing the same
07/06/2011CN102117822A RRAM memory cell and preparation method thereof
07/06/2011CN102117819A Method for forming backside illuminated (BSI) image sensor
07/06/2011CN102117818A Method for producing a non-planar microelectronic component
07/06/2011CN102117817A Ultrathin packaging structure and packaging method of image sensing chip
07/06/2011CN102117815A Solar battery assembly and preparation method thereof
07/06/2011CN102117814A Grid-sharing flash memory unit and manufacturing method thereof
07/06/2011CN102117812A Nanocrystal nonvolatile memory based on strained silicon and manufacturing method of memory
07/06/2011CN102117810A Charge trapping type nonvolatile memory and manufacturing method thereof
07/06/2011CN102117809A Semiconductor device and method for manufacturing the same
07/06/2011CN102117808A Field effect transistor device with improved carrier mobility and manufacturing method thereof
07/06/2011CN102117807A High voltage devices and methods of forming the same
07/06/2011CN102117806A Duodiode integrating Zener diode with rectifying diode and production method thereof
07/06/2011CN102117805A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
07/06/2011CN102117801A High-power light-emitting diode module structure and manufacturing method thereof
07/06/2011CN102117800A Semiconductor chip stack and production method thereof
07/06/2011CN102117799A Buried multi-chip semiconductor package structure and manufacturing method thereof
07/06/2011CN102117796A Copper interconnection structure of integrated circuit and preparation method thereof
07/06/2011CN102117795A Electrode lead-out structure in insulation process
07/06/2011CN102117794A Electrode lead-out structure in STI process
07/06/2011CN102117791A Package structure and manufacturing method thereof, and method of manufacturing leadframe structure
07/06/2011CN102117789A Semiconductor chip packaging structure and packaging method
07/06/2011CN102117782A Composite buried element structure and manufacturing method thereof
07/06/2011CN102117781A Bonding structure and method for manufacturing same
07/06/2011CN102117780A PIP (Polysilicon-Insulator-Polysilicon) capacitor forming method based on BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) process
07/06/2011CN102117779A Method for enhancing reliability of SONOS (Silicon Oxide Nitride Oxide Semiconductor) flash memory device by means of selective epitaxy
07/06/2011CN102117778A Method for improving reliability of SONOS memory by utilizing ozone oxidation
07/06/2011CN102117777A Method for etching oxide-nitride-oxide interpoly dielectric with wet method
07/06/2011CN102117776A Stacked capacitor structure of embedded type grid word line device and manufacturing method of capacitor
07/06/2011CN102117775A Filling method and device for contact hole of complementary metal oxide semiconductor
07/06/2011CN102117774A Method for fabricating an integrated circuit device
07/06/2011CN102117773A Semiconductor device and method for manufacturing same with stress memorization technology process