Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/04/2011US20110186844 Display substrate and method of manufacturing the same
08/04/2011US20110186843 Manufacturing method of thin film and metal line for display using the same, thin film transistor array panel, and method for manufacturing the same
08/04/2011US20110186842 Thin film transistor and method of manufacturing the same
08/04/2011US20110186841 Semiconductor device and method of manufacture thereof
08/04/2011US20110186840 Diamond soi with thin silicon nitride layer
08/04/2011US20110186839 Method and System for Hermetically Sealing Packages for Optics
08/04/2011US20110186838 Circuit architecture for the parallel supplying during an electric or electromagnetic testing of a plurality of electronic devices integrated on a semiconductor wafer
08/04/2011US20110186830 Method of Making Organic Thin Film Transistors Using a Laser Induced Thermal Transfer Printing Process
08/04/2011US20110186818 Doped graphene electronic materials
08/04/2011US20110186817 Doped graphene electronic materials
08/04/2011US20110186816 Semiconductor device wafer, semiconductor device, design system, manufacturing method and design method
08/04/2011US20110186810 Optoelectronic component with three-dimension quantum well structure and method for producing the same
08/04/2011US20110186808 Methods of forming catalytic nanopads
08/04/2011US20110186807 Doped graphene electronic materials
08/04/2011US20110186806 Doped graphene electronic materials
08/04/2011US20110186805 Doped graphene electronic materials
08/04/2011US20110186804 Nanoscale chemical templating with oxygen reactive materials
08/04/2011US20110186799 Non-volatile memory cell containing nanodots and method of making thereof
08/04/2011US20110186797 Memory cell that includes a sidewall collar for pillar isolation and methods of forming the same
08/04/2011US20110186748 Systems And Methods For Scanning A Beam Of Charged Particles
08/04/2011US20110186555 System for semiconductor structure processing using multiple laser beam spots
08/04/2011US20110186446 Method for Producing a Subminiature "Micro-Chip" Oxygen Sensor for Control of Internal Combustion Engines or Other Combustion Processes, Oxygen Sensor and an Exhaust Safety Switch
08/04/2011US20110186228 Showerhead
08/04/2011US20110186225 Magnetic recording medium manufacturing device
08/04/2011US20110186125 Process for producing electrically conductive zinc oxide layered films and process for producing photoelectric conversion devices
08/04/2011US20110185971 Laser doping
08/04/2011US20110185970 Semiconductor processing
08/04/2011DE102011008924A1 Defekt-Reperaturvorrichtung und Verfahren für EUV Maske Defect repair apparatus and method for EUV mask
08/04/2011DE102011000374A1 Waterproof structure for semiconductor package installed in car generator, has radiation element that is arranged opposite to surface area of heat sink with power element and provided with projection fitted into recess of heat sink
08/04/2011DE102010017600A1 Diamant-SOI mit dünner Siliziumnitridschicht Diamond SOI thin silicon nitride
08/04/2011DE102010006880A1 Contacting a photovoltaic module, comprises providing layer arrangement from light-sensitive layer for generating charge during falling light on the light-sensitive layer and conductive contact layer arranged on the light-sensitive layer
08/04/2011DE102010006879A1 Contacting a photovoltaic module, comprises providing a layer arrangement from a light-sensitive layer for generating a charge during falling light on the light-sensitive layer and a conductive layer arranged on the light-sensitive layer
08/04/2011DE102010006329A1 Use of applicator roll for structured applying of e.g. hydrofluoric acid on silicon wafer during manufacturing solar cells, using projections that exhibits outer surface, where medium is applied on silicon wafer under effect of dielectric
08/04/2011DE102010006315A1 Verfahren zur lokalen Hochdotierung und Kontaktierung einer Halbleiterstruktur, welche eine Solarzelle oder eine Vorstufe einer Solarzelle ist A method for local high doping and bonding a semiconductor structure is a solar cell or a precursor of a solar cell
08/04/2011DE102010001572A1 Method for manufacturing through-contact in plated through structured component that is utilized as e.g. micro-electro mechanical system sensor element, involves separating conductive sheet in trench via physical vapor deposition of film
08/04/2011DE102010001567A1 Electrically conductive material useful as electrode material, conductor material, chemosensitive, gas sensitive material for a sensor, comprises a core made from platinum, rhodium and/or ruthenium, which is surrounded by oxide of cerium
08/04/2011DE102010001406A1 Halbleiterbauelement, das durch ein Austausch-Gate-Verfahren auf der Grundlage eines früh aufgebrachten Austrittsarbeitsmetalls hergestellt ist A semiconductor device which is made by a replacement gate process on the basis of early work function metal deposited
08/04/2011DE102010001405A1 Halbleiterelement mit einer Substratsdiode mit geringen Fluktuationen Semiconductor element having a substrate diode with small fluctuations
08/04/2011DE102010001404A1 Einstellung von Transistoreigenschaften auf der Grundlage einer späten Wannenimplantation Setting of transistor characteristics on the basis of a late well implantation
08/04/2011DE102010001403A1 Austauschgateverfahren auf der Grundlage eines Umkehrabstandhalters, der vor der Abscheidung des Austrittsarbeitsmetalls aufgebracht wird Replacement gate process on the basis of a reversible spacer that is applied prior to the deposition of the work function metal
08/04/2011DE102010001400A1 SOI-Halbleiterbauelement mit reduzierter Topographie über einem Substratfensterbereich SOI semiconductor device with reduced topography over a substrate pane
08/04/2011DE102010001397A1 Halbleiterwiderstände, die in einem Halbleiterbauelement mit Metallgatestrukturen durch Verringern der Leitfähigleit eines metallenthaltenden Deckmaterials hergestellt sind Semiconductor resistors which are produced in a semiconductor device with metal gate structures by reducing the Leitfähigleit of a metal-containing cover material
08/04/2011DE102009001522A1 Halbleiteranordnung mit Kondensator A semiconductor device with capacitor
08/04/2011CA2753709A1 Method of manufacturing silicon carbide substrate
08/03/2011EP2352184A1 Nitrogen-based semiconductor element and production method therefor
08/03/2011EP2352182A1 Method for manufacturing nitride semiconductor light emitting element and method for manufacturing epitaxial wafer
08/03/2011EP2352172A2 Method of producing photoelectric conversion device by liquid phase deposition
08/03/2011EP2352169A1 Semiconductor device, method for manufacturing same, and display device
08/03/2011EP2352168A1 Electronic component package and electronic component package manufacturing method
08/03/2011EP2352167A1 Abrasive composition and method for manufacturing semiconductor integrated circuit device
08/03/2011EP2352166A1 Surface protection tape for dicing and method for peeling and removing surface protection tape for dicing
08/03/2011EP2352165A1 Nitride-based semiconductor element and production method therefor
08/03/2011EP2352164A1 Soi substrate manufacturing method
08/03/2011EP2352163A2 Scribing apparatus for thin film solar cells
08/03/2011EP2351872A1 Treatment method using plasma
08/03/2011EP2351871A1 Mask and method for forming film using mask
08/03/2011EP2351805A1 Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
08/03/2011EP2351804A1 Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
08/03/2011EP2351718A1 Glass substrate laminated device and method for producing laminate glass substrate
08/03/2011EP2351101A2 Technique for manufacturing a solar cell
08/03/2011EP2351085A2 Method for producing infrared-photosensitive matrix cells adhering to an optically transparent substrate by molecular adhesion, and related sensor
08/03/2011EP2351083A2 A silicon based nanoscale crossbar memory
08/03/2011EP2351081A2 Oc dram cell with increased sense margin
08/03/2011EP2351078A1 Shielding for integrated capacitors
08/03/2011EP2351077A1 Through-substrate via and redistribution layer with metal paste
08/03/2011EP2351076A2 Method and apparatus for wafer bonding with enhanced wafer mating
08/03/2011EP2351075A1 Non-volatile semiconductor storage device
08/03/2011EP2351074A1 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
08/03/2011EP2351073A1 Apparatus for detecting micro-cracks in wafers and method therefor
08/03/2011EP2351072A1 Additive for alkaline etching solutions, in particular for texture etching solutions, and process for producing it
08/03/2011EP2351071A2 Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures
08/03/2011EP2351070A2 Method and apparatus for controlling ion energy distribution
08/03/2011EP2351069A2 Continuous feed chemical vapor deposition
08/03/2011EP2351068A1 Printing semiconductor elements by shear-assisted elastomeric stamp transfer
08/03/2011EP2351067A1 Systems and methods for the crystallization of thin films
08/03/2011EP2350339A1 Coated substrates and semiconductor devices including the substrates
08/03/2011EP2350197A1 Sealant or filler for electrical and electronic components, and electrical and electronic components
08/03/2011EP2225773B1 Memory cell comprising a capacitor arranged laterally from a transistor
08/03/2011EP2102896B1 Device and method for cleaning articles, especially thin wafers
08/03/2011EP1992020B1 Method for preparing a semiconductor
08/03/2011EP1964177B1 Semiconductor devices and manufacturing method thereof
08/03/2011EP1949433B1 Method of manufacturing a plurality of semiconductor devices and carrier substrate
08/03/2011EP1810332B1 Nanotube-based circuit connection approach
08/03/2011EP1608596B1 Silica glass containing tio2 and process for its production
08/03/2011EP1532677B1 Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom
08/03/2011EP1347508B1 Method of heat treatment of silicon wafer doped with boron
08/03/2011EP1077486B1 Semiconductor device
08/03/2011CN201919233U Clamped monomeric spray head electrode and spray head electrode component
08/03/2011CN201919171U 加热器 Heater
08/03/2011CN201918391U 一种射频横向扩散n型mos管 A radio frequency lateral diffusion of n-type mos tube
08/03/2011CN201918390U 一种提高电流密度的p型绝缘体上硅横向器件 Method for improving the current density of the p-type silicon on insulator lateral devices
08/03/2011CN201918387U 一种绝缘体上硅可集成大电流p型组合半导体器件 An insulator that can be integrated on a silicon p-type combination of high current semiconductor devices
08/03/2011CN201918379U 硅片固定用定位柱 Wafer fixing positioning column
08/03/2011CN201918378U 辅助定位装置 Auxiliary positioning means
08/03/2011CN201918377U 晶片校准器 Wafer alignment device
08/03/2011CN201918376U 一种基于直线电机的双载具运动平台 Based on dual linear motor vehicle motion platform
08/03/2011CN201918375U 半导体输送带结构 Semiconductor conveyor structure
08/03/2011CN201918374U 直线往复输送设备 Reciprocating conveyor equipment
08/03/2011CN201918373U 双向间歇传输装置 Bidirectional intermittent transmission device
08/03/2011CN201918372U Wafer box