| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/18/2012 | CN102326257A Light absorbing material and photoelectric conversion element using same |
| 01/18/2012 | CN102326256A Structures and methods for improving trench-shielded semiconductor devices and schottky barrier rectifier devices |
| 01/18/2012 | CN102326248A Capacitor fabrication method, capacitor fabricating device, capacitor fabricating program, and recording medium |
| 01/18/2012 | CN102326247A Face-to-face (F2F) hybrid structure for an integrated circuit |
| 01/18/2012 | CN102326246A Method for manufacturing components |
| 01/18/2012 | CN102326245A Method for separating a layer system comprising a wafer |
| 01/18/2012 | CN102326244A Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing |
| 01/18/2012 | CN102326243A Testing apparatus and testing method |
| 01/18/2012 | CN102326242A Aluminum ribbon for ultrasonic bonding |
| 01/18/2012 | CN102326241A Method for manufacturing semiconductor device, and bonding apparatus |
| 01/18/2012 | CN102326240A Resin coating apparatus and resin coating data creation apparatus |
| 01/18/2012 | CN102326239A Method of producing semiconductor chip stack, and semiconductor device |
| 01/18/2012 | CN102326238A Transistor and transistor control system |
| 01/18/2012 | CN102326237A Modulation-doped halo in quantum well field-effect transistors, apparatus made therewith, and methods of using same |
| 01/18/2012 | CN102326236A Method for forming silicon oxide film and method for manufacturing semiconductor device |
| 01/18/2012 | CN102326235A Etching solution compositions for metal laminate films |
| 01/18/2012 | CN102326234A Substrate treatment device and treatment method |
| 01/18/2012 | CN102326233A Method of producing a component of a device, and the resulting components and devices |
| 01/18/2012 | CN102326232A Semiconductor element manufacturing method |
| 01/18/2012 | CN102326231A Method for forming epitaxial wafer and method for manufacturing semiconductor element |
| 01/18/2012 | CN102326230A Methods of forming integrated circuits and resulting structures |
| 01/18/2012 | CN102326229A Methods for depositing layers having reduced interfacial contamination |
| 01/18/2012 | CN102326228A III-nitride semiconductor growth substrate, III-nitride semiconductor epitaxial substrate, III-nitride semiconductor element, III-nitride semiconductor freestanding substrate, and method for fabricating these |
| 01/18/2012 | CN102326227A Method for manufacturing soi wafer |
| 01/18/2012 | CN102326226A Auto-tuned screen printing process |
| 01/18/2012 | CN102326088A Method of forming device with piezoresistor and accelerometer |
| 01/18/2012 | CN102325929A Production method of n-type sic single crystal, n-type sic single crystal obtained thereby and application of same |
| 01/18/2012 | CN102325739A Ceramic-metal junction and method of fabricating same |
| 01/18/2012 | CN102325709A Substrate inverting system |
| 01/18/2012 | CN102325654A Method and apparatus for screen printing a multiple layer pattern |
| 01/18/2012 | CN102324451A Method for manufacturing ESD protection circuit on LED chip by sacrificing luminescence area |
| 01/18/2012 | CN102324437A Composite wafer for prolonging service life of energy-saving lamp as well as preparation method and application thereof |
| 01/18/2012 | CN102324436A Large-mismatch silicon-based substrate antimonide transistor with high electron mobility and manufacturing method thereof |
| 01/18/2012 | CN102324434A Schottky barrier metal oxide semiconductor (MOS) transistor and preparation method thereof |
| 01/18/2012 | CN102324428A One time programmable storage unit and manufacturing method thereof as well as one time programmable storage array |
| 01/18/2012 | CN102324427A Metal film resistor structure and manufacturing method thereof |
| 01/18/2012 | CN102324418A Semiconductor element packaging structure and manufacturing method thereof |
| 01/18/2012 | CN102324416A Integrated shielding film and semiconductor packaging member of antenna |
| 01/18/2012 | CN102324415A Sequentially etched and plated lead frame structure without island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324414A Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324413A Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324412A Island-free lead frame structure prefilled with plastic encapsulating material, plated firstly and etched later and production method thereof |
| 01/18/2012 | CN102324407A Semiconductor packaging piece and manufacturing method thereof |
| 01/18/2012 | CN102324405A Manufacturing method of semiconductor device |
| 01/18/2012 | CN102324403A Method for manufacturing ultra-low dielectric constant film copper interconnection |
| 01/18/2012 | CN102324402A Contact hole forming method |
| 01/18/2012 | CN102324401A Method for manufacturing copper interconnection structure |
| 01/18/2012 | CN102324400A Method for manufacturing copper interconnection structure |
| 01/18/2012 | CN102324399A Semiconductor device and manufacturing method thereof |
| 01/18/2012 | CN102324398A Semiconductor substrate manufacturing method, semiconductor apparatus and manufacturing method thereof |
| 01/18/2012 | CN102324397A Substrate processing system and substrate transfer method |
| 01/18/2012 | CN102324396A Substrate cleaning device |
| 01/18/2012 | CN102324395A Operation system and operation method for LED (light-emitting diode) crystal grain scanning and point-detection |
| 01/18/2012 | CN102324394A Continuous filling/packaging module box for DIP (double in-line package) integrated circuits |
| 01/18/2012 | CN102324393A Large size mounting RFID upside-down mounting pasting method and apparatus thereof |
| 01/18/2012 | CN102324392A Preparation process for anti-oxidation copper-based bonding wires |
| 01/18/2012 | CN102324391A Non-lead semiconductor lead frame aluminum foil welding method |
| 01/18/2012 | CN102324390A Rectifier diode core manufacturing method |
| 01/18/2012 | CN102324389A Device integrated with Schottky diode in power transistor and forming method thereof |
| 01/18/2012 | CN102324388A Method for forming photoresistance layer |
| 01/18/2012 | CN102324387A Deep trench formation method |
| 01/18/2012 | CN102324386A Preparation method of silicon chip used for planar solid discharge tube chip manufacturing process |
| 01/18/2012 | CN102324385A Light beam scanning and controlling method with high line overlapping rate in semiconductor laser machining |
| 01/18/2012 | CN102324384A Method for carrying out ion implantation on ultra-thin wafer |
| 01/18/2012 | CN102324383A Ion implantation method |
| 01/18/2012 | CN102324382A Method for growing high-resistance N type epitaxial layer on heavily-doped P type substrate |
| 01/18/2012 | CN102324366A Multi-wafer positioning system for ion implanter and positioning method thereof |
| 01/18/2012 | CN102324218A 液晶显示装置和电子装置 A liquid crystal display device and electronic apparatus |
| 01/18/2012 | CN102322968A Trench polysilicon diode |
| 01/18/2012 | CN102321212A Polymer, chemically amplified positive resist composition and pattern forming process |
| 01/18/2012 | CN102320463A COB feeding device |
| 01/18/2012 | CN102319686A Wafer cleaning device and wafer cleaning method |
| 01/18/2012 | CN102319680A Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine |
| 01/18/2012 | CN101969054B Semiconductor chip and preparation method thereof |
| 01/18/2012 | CN101930927B Self-aligned U-shaped groove manufacturing method |
| 01/18/2012 | CN101916770B Si-Ge-Si semiconductor structure with double graded junctions and forming method thereof |
| 01/18/2012 | CN101908478B Manufacturing method of copper electrode structure and application thereof |
| 01/18/2012 | CN101882610B Semiconductor structure and manufacturing method thereof |
| 01/18/2012 | CN101866865B Packaging die and packaging method thereof |
| 01/18/2012 | CN101859718B Chip burn-in machine capable of realizing grouping test |
| 01/18/2012 | CN101855045B Method for cutting work by wire saw and wire saw |
| 01/18/2012 | CN101834127B Method for preparing high-quality ZnO monocrystal film on sapphire substrate |
| 01/18/2012 | CN101796614B Position measuring system and position measuring method, mobile body device, mobile body driving method, exposure device and exposure method, pattern forming device, and device manufacturing method |
| 01/18/2012 | CN101783362B Upper cover structure, packaging structure of luminous element and packaging method for luminous element |
| 01/18/2012 | CN101767766B Method for manufacturing nanometer space in micro-nano mechanical device |
| 01/18/2012 | CN101743625B Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| 01/18/2012 | CN101740461B Method for manufacturing semiconductor device |
| 01/18/2012 | CN101740450B Substrate supporting unit, and apparatus and method for polishing substrate using the same |
| 01/18/2012 | CN101728285B Formation method for bonding pad |
| 01/18/2012 | CN101719497B New type integrated circuit for resisting full-scale irradiation of NMOS component |
| 01/18/2012 | CN101689564B Hetero-structure field effect transistor, integrated circuit including a hetero-structure field effect transistor and method for manufacturing a hetero-structure field effect transistor |
| 01/18/2012 | CN101667588B High density resistance based semiconductor device and manufacturing method thereof |
| 01/18/2012 | CN101652841B Dry etching method |
| 01/18/2012 | CN101643940B Manufacturing method of hexagonal silicon slice |
| 01/18/2012 | CN101630655B Method for forming shallow plough groove isolation |
| 01/18/2012 | CN101609268B Lithographic apparatus and method |
| 01/18/2012 | CN101593697B Doped region and well region forming method and substrate imaging method |
| 01/18/2012 | CN101590624B Chemical mechanical polishing method and polishing device |
| 01/18/2012 | CN101584033B Microelectronic assemblies having compliancy and methods therefor |
| 01/18/2012 | CN101572263B Complementary metal oxide semiconductor device and manufacturing method thereof |