Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
08/2007
08/29/2007EP1636845A4 Wet chemical processing chambers for processing microfeature workpieces
08/29/2007CN101027431A Plating method and plating apparatus
08/29/2007CN101024890A Wire material electroplating or pretreating heating technology
08/29/2007CN101024889A Electroplating method for aluminium product
08/29/2007CN100334710C Mfg. method for conductor fig.
08/28/2007CA2462295C Elemental silicon nanoparticle plating and method for the same
08/23/2007WO2007094177A1 Stainless steel substrate with conductive metal layer, hard disk suspension material and hard disk suspension manufactured by using the material
08/23/2007DE112005002206T5 Verfahren zur Erzeugung eines Separators und Elektroabscheidungsbeschichtungsvorrichtung A method for producing a separator and electrodeposition coating device
08/23/2007DE102006005684A1 Verbessertes Verfahren zur Direktmetallisierung von nicht-leitenden Substraten An improved method for the direct non-conductive substrates
08/22/2007CN1333110C Electroplating method and electroplating device special for such electroplating method
08/22/2007CN101023204A Plating apparatus
08/22/2007CN101021009A Nickel pre-coating process and nickel pre-coating solution for magnesium alloy surface
08/16/2007WO2007091732A2 Tinned steel sheet excellent in corrosion resistance
08/16/2007US20070190465 Positively radiation-sensitive resin composition
08/16/2007US20070190353 Hot dip galvanized composite high strength steel sheet excellent in shapeability and hole enlargement ability and method of production of same
08/16/2007US20070190352 Wear protection coating for a gas turbine component
08/16/2007US20070190341 organosilicon and organometallic compounds within adhesion promoter layer having nanoscale ceramic grains applied wet-chemically
08/16/2007US20070187253 Method For Preparing BioMedical Surfaces
08/15/2007EP1818427A2 Improved method for the direct metallization of non-conductive substrates
08/15/2007CN1332066C Multilayer plated fuel line parts for automobile
08/15/2007CN101019260A Method for producing separator and electrodeposition coating device
08/15/2007CN101019255A Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof
08/15/2007CN101016650A Method of preparing high square ratio magnetic one-dimensional nano line array
08/15/2007CN101016644A Internal heat spreader plating methods and systems
08/15/2007CN101016640A Method of electrodepositing metal bellows and cathode rotation device
08/15/2007CN101016639A Process of titanium basal body electric plating platinum coating
08/15/2007CN101016634A Method of preparing metal roller with surface relief microstructure
08/14/2007US7256495 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/14/2007US7256115 Asymmetric plating
08/14/2007US7255782 Selective catalytic activation of non-conductive substrates
08/09/2007US20070181438 electrochemically reducing titania and sintering to form a morphology of reduced titanium; agitating the electrolyte slurry using electrolytic cells; supplying pellets, powders of metal oxide and CaCL2-based electrolyte; agglomerating the particles
08/09/2007US20070181434 Method and apparatus for fabricating metal layer
08/09/2007US20070181432 Electrolytic processing apparatus and substrate processing apparatus and method
08/09/2007US20070181431 Methods and Apparatus for Monitoring Deposition Quality During Conformable Contact Mask Plating Operations
08/09/2007US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing
08/09/2007US20070181326 Electromagnetic wave shielding film and method for producing the same
08/08/2007EP1816730A1 Process for producing permanent magnet for use in automotive ipm motor
08/08/2007EP1815045A2 Article of manufacturing and process for anodically coating aluminum and/or titanium with ceramic oxides
08/08/2007EP1636297B1 Modified polyacetals for plating
08/08/2007CN1331376C Conductive sheet, product using the same, and manufacturing method thereof
08/08/2007CN1330795C Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
08/08/2007CN101012571A Anode poling processing technique before electric plating
08/08/2007CN101012570A Method for plating hard chrome on complex bore element and special fixture therefor
08/08/2007CN101012569A Method for direct copper non-cyanide plating of zinc alloy casting die
08/08/2007CN101011918A Method of manufacturing stainless steel imitation appearance for steel products
08/07/2007US7253364 Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same
08/07/2007US7252861 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
08/07/2007US7252750 Patterned surfaces; electrochemical plating; semiconductor wafers; interior, exterior voltage rings
08/02/2007WO2007031712A3 Method of forming conductive tracks
08/02/2007WO2006061081A3 Electrochemical deposition of tantalum and/or copper in ionic liquids
08/02/2007US20070176619 Probe For Semiconductor Devices
08/02/2007US20070175765 Method of fabricating monolayer abrasive tools
08/02/2007US20070175764 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
08/02/2007US20070175763 Electroplating in presence of co2
08/02/2007CA2676438A1 Electrocomposite coatings for hard chrome replacement
08/01/2007EP1813699A1 Process of coating a workpiece and workpiece thereof
08/01/2007EP1813697A2 Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance
08/01/2007EP1813375A1 Electric arc welding wire with an electrically conductive layer of copper or copper alloy
08/01/2007EP1759039A4 Process for preparing a non-conductive substrate for electroplating
08/01/2007CN1329968C Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/01/2007CN1329557C Direct electrolytic metallization of non-conducting substrate
08/01/2007CN101008614A Method of monitoring depositing temperature of cu seed layer and method for forming cu layer by using the same
08/01/2007CN101008097A Process for removing harmful matter hexavalent chromium of electroplating layer
08/01/2007CN101008095A Pulse silver-coating method
08/01/2007CN101008084A Plasma composite plating and seeping method for abrasive-proof nickel base surface alloy layer
07/2007
07/31/2007US7250101 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
07/31/2007CA2288678C Production of electrolyte units by electrolytic deposition of a catalyst
07/26/2007WO2007082786A1 Galvanized rolling-hardened cold-rolled flat product and process for producing it
07/26/2007US20070170067 Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such composition
07/26/2007US20070170066 Method for planarization during plating
07/26/2007US20070170065 Method for filling through hole
07/26/2007US20070170064 Method of electrolytically depositing materials in a pattern directed by surfactant distribution
07/26/2007CA2634527A1 Galvanized rolling-hardened cold-rolled flat product and process for producing it
07/25/2007EP1811063A1 Tin-zinc alloy electroplating method
07/25/2007EP1809792A1 Common rack for electroplating and pvd coating operations
07/25/2007EP1809435A1 Method for electrolytic machining a workpiece having a through hole.
07/25/2007EP1546435B1 Method for pretreating a surface of a non-conducting material to be plated
07/25/2007CN1328733C Conductor for flat cabal and its producing method and flat cabal
07/25/2007CN1328412C Method for activating substrate for plating on plastic
07/25/2007CN101006204A Electrochemical reduction of metal oxides
07/25/2007CN101006202A Phosphated galvanized steel sheet
07/25/2007CN101003907A Method for preparing metal and dielectric composite grains of silicon dioxide coated by Nano silver
07/24/2007US7247226 Coating support and method for the selective coating of conductive tracks on one such support
07/24/2007US7247223 Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
07/19/2007US20070163888 Conformable Contact Masking Methods and Apparatus Utilizing In Situ Cathodic Activation of a Substrate
07/19/2007US20070163887 Method of manufacturing a circuit carrier and the use of the method
07/19/2007US20070163112 impregnating polyurethane layer in the fiber layer; preparing a light weight and durable construction for easy and convenient transport; simple methode, cost effective; waterproofing, durability; performed without a mold; used in tables, flooring, risers, stages, bleachers
07/19/2007DE102005062134A1 Galvanically coating components comprises using an arrangement with a pretreatment section, a galvanic section , and a post treatment section
07/18/2007EP1265725B1 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product
07/18/2007CN1327479C Method of manufacturing electronic device
07/18/2007CN1326692C Nickel plated metal printing masterplate and its producing method
07/18/2007CN101002366A Design and method for plating PCI express (PCIE) edge connector
07/18/2007CN101001982A Tin-zinc alloy electroplating method
07/18/2007CN100999825A Environment protection type metal defect repairing regenerating liquit and production process thereof
07/17/2007US7245006 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
07/17/2007US7244677 Method for filling recessed micro-structures with metallization in the production of a microelectronic device
07/17/2007US7244452 Member excellent in antibacterial antimold and/or antialgae effects and process for producing the same
07/12/2007WO2007077775A1 Gold plating film
07/12/2007US20070160866 Tungsten as main component and contains tungsten carbide (content of carbon >0.1mass %); total content of cobalt, nickel, and iron is <3 mass %; pools of >5 mu m of cobalt, nickel, or iron; the number of pools is <1/100 mm2 of the surface hardness; smoothness;protective coatings; machining; strength
07/12/2007US20070160865 blackened surface with a uniform hue, no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, high in transmittance, for a plasma display panel; 1st and 2nd layer of of Cu, a Cu-Co alloy, a Co- Ni alloy and a Cu-Co-Ni alloy, 3rd layer of Co, Ni, In or alloy
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