Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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01/08/2008 | US7316772 Immersing substrate into an electroplating bath including ionic copper and defect reducing agent; electroplating copper deposit from bath onto substrate to fill submicron-sized reliefs whereby occurrence of protrusion defects are reduced |
01/08/2008 | CA2428119C Brazing product having a low melting point |
01/03/2008 | WO2008001487A1 Microstructural body and process for producing the same |
01/03/2008 | US20080000777 Electroplating using an apparatus having a preferential barrier between electrodes, comprising adjustable apertures used for controlling the amount of electric flux and the distribution of coatings on substrates such as electronics and semiconductor chips |
01/03/2008 | US20080000776 Method and apparatus for processing substrate |
01/03/2008 | CA2691344A1 Improved direct current chrome plating process and variant layered chrome product |
01/02/2008 | EP1366207A4 Plating method of metal film on the surface of polymer |
01/02/2008 | CN200999265Y Baffle plate for electric plating |
01/02/2008 | CN101099285A Process for producing permanent magnet for use in automotive ipm motor |
01/02/2008 | CN101098771A Method of electroplating and pre-treating aluminium workpieces |
01/02/2008 | CN101096770A Electroplating method |
01/02/2008 | CN101096769A Electroplating method |
01/02/2008 | CN101096768A Case and surface treating method thereof |
01/02/2008 | CN100359994C Chip-on-film use copper foil |
01/02/2008 | CN100359680C Lead frame and method for manufacturing the same |
01/02/2008 | CN100359048C Conductor roll restoring method |
01/01/2008 | US7314543 Tin deposition |
12/27/2007 | WO2007147872A2 Method of producing an aluminium wire covered with a copper layer, and wire obtained |
12/27/2007 | WO2007147818A2 An apparatus and method for electroplating a substrate in a continuous way |
12/27/2007 | WO2007111676A3 Method of direct plating of copper on a substrate structure |
12/27/2007 | US20070298238 Method for forming a hermetically sealed cavity |
12/27/2007 | US20070298186 Method and apparatus for plating threaded portion of high pressure gas cylinder |
12/27/2007 | US20070297216 Self-assembly of molecular devices |
12/27/2007 | US20070295607 Resin composition for interlayer insulating layer of multi-layer printed wiring board |
12/27/2007 | US20070295606 Manufacturing process of embedded type flexible or rigid printed circuit board |
12/26/2007 | EP1870496A1 An apparatus and method for electroplating a substrate in a continuous way. |
12/26/2007 | EP1869061A2 Electrochemical deblocking solution for electrochemical oligomer synthesis on an electrode array |
12/26/2007 | CN200995509Y Composite structure of triple-pieces set material for board in toilet |
12/26/2007 | CN101094748A Methods and apparatuses for electrochemical-mechanical polishing |
12/26/2007 | CN101092733A Method and equipment for preparing abrasion self-repairing plating coat on surface of metal |
12/26/2007 | CN101092731A Anodic oxidation method for raising rigidity and corrosion resistance of plated aluminum on surface of metal base |
12/26/2007 | CN101092729A Electrolytic spent meal in use for processing surfaces of ferrous metal, and preparation method |
12/26/2007 | CN101092728A Low foaming spent meal in use for cleaning surface of ferrous material, and preparation method |
12/26/2007 | CN101092727A Chemic spent meal in use for processing surfaces of ferrous metal, and preparation method |
12/26/2007 | CN101092726A Technique for preparing illusive color pattern on surface of parts possessing surface layer of conductive metal |
12/26/2007 | CN101092695A A coat layer of gammaí»Ni3Al /gamma-Ni, preparation and application |
12/25/2007 | US7312151 System for ultraviolet atmospheric seed layer remediation |
12/25/2007 | US7312149 Copper plating of semiconductor devices using single intermediate low power immersion step |
12/25/2007 | US7311811 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
12/25/2007 | US7311808 Device and method for increasing mass transport at liquid-solid diffusion boundary layer |
12/21/2007 | WO2007144336A2 Cr(vi)-free black chroming |
12/20/2007 | US20070292671 Insert |
12/20/2007 | US20070289871 Electrolytic capacitor for electric field modulation |
12/19/2007 | EP1694885A4 Multi-chemistry plating system |
12/19/2007 | EP1483430A4 Non-cyanide copper plating process for zinc and zinc alloys |
12/19/2007 | EP1419523A4 Dummy structures to reduce metal recess in electropolishing process |
12/19/2007 | CN200992586Y Electroplating equipment suitable for pattern electroplating |
12/19/2007 | CN200992585Y Metal electroplated member |
12/19/2007 | CN101089232A Film coating tool and method |
12/18/2007 | US7309413 Providing electrical contact to the surface of a semiconductor workpiece during processing |
12/18/2007 | US7309412 Compositions and coatings including quasicrystals |
12/18/2007 | US7309411 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
12/18/2007 | US7309406 Method and apparatus for plating and polishing semiconductor substrate |
12/18/2007 | CA2378993C Acousto-immersion coating and process for magnesium and its alloys |
12/13/2007 | WO2007142352A1 Method and material for plating film formation |
12/13/2007 | US20070285874 Method Of Manufacturing A Dielectric Component, And Dielectric Components Manufactured By Such A Method |
12/13/2007 | US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component |
12/13/2007 | US20070284255 Wear resistant vapor deposited coating, method of coating deposition and applications therefor |
12/12/2007 | EP1865093A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
12/12/2007 | CN100355021C 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method |
12/11/2007 | US7307022 Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof |
12/11/2007 | US7306962 Electroformed metallization |
12/11/2007 | US7306710 Rotating support; partial immersion of combustion chamber within plating solution |
12/06/2007 | WO2007139133A1 Plated steel plate for battery can, battery, and alkaline dry battery |
12/06/2007 | WO2007139072A1 Cu-Zn ALLOY STRIP EXCELLENT IN THERMAL SEPARATION RESISTANCE FOR Sn PLATING AND Sn-PLATED STRIP THEREOF |
12/06/2007 | WO2007037955A3 Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof |
12/06/2007 | WO2007034117A3 Electroplating method for coating a substrate surface with a metal |
12/06/2007 | WO2007034116A3 Electroplating composition for coating a substrate surface with a metal |
12/06/2007 | US20070278104 Curing electrodeposition coating layer; dehydrating aqueous curable base coating layer; pigment-free; automobile clear coats; wear and corrosion resistance |
12/06/2007 | US20070278103 Nanoparticle coating of surfaces |
12/05/2007 | CN101081554A Heat resistant film, its manufacturing method, and electrical and electronic parts |
12/05/2007 | CN100353519C Method for forming copper teading wires in semiconductor device |
12/04/2007 | US7303663 Multistep release method for electrochemically fabricated structures |
12/04/2007 | CA2283850C Method for manufacturing a stent |
11/29/2007 | WO2007136024A1 Method of pretreatment for plating and water service instrument made of lead-containing copper alloy |
11/29/2007 | WO2007134843A2 Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell |
11/29/2007 | WO2007112971A3 Electrolytic method for filling holes and cavities with metals |
11/29/2007 | WO2007001334A3 Activation of aluminum for electrodeposition or electroless deposition |
11/29/2007 | US20070272863 Infrared sensor manufacturing method suitable for mass production |
11/29/2007 | US20070271978 applying coating to sheet made of hardenable steel alloy, where coating comprises zinc and one or several elements with affinity to oxygen in a total amount of 0.1-15 weight-% in relation to total coating; after applying coating the sheet steel is roller-profiled; cathodic corrosion protection |
11/29/2007 | DE10344720B4 Verfahren zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes A method of manufacturing a bearing eye having at least one workpiece |
11/29/2007 | DE10340615B4 Verfahren zum Herstellen einer biaxial strukturierten metallischen Schicht und nach dem Verfahren hergestellte Schicht A method for preparing a biaxially textured metallic layer and prepared by the process layer |
11/28/2007 | EP1860210A1 Method for electrolytic treatment of a workpiece |
11/28/2007 | EP1859074A1 Metal film and formation method of metal film |
11/28/2007 | CN100351433C Process of gold plating for industrial pure titanium |
11/27/2007 | US7300706 High-carbon steel wire with nickel sub coating |
11/27/2007 | US7300527 Method for activating surface of base material and apparatus thereof |
11/22/2007 | WO2007132529A1 Metal composite film and process for producing the same |
11/22/2007 | WO2007111671A8 Polyimide substrate and method of manufacturing printed wiring board using the same |
11/22/2007 | WO2005038989A3 Fretting and whisker resistant coating system and method |
11/22/2007 | WO2002063069A3 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
11/22/2007 | US20070270526 Solid resin-crosslinker mixture for use in aqueous coatings |
11/22/2007 | US20070269678 High-tensile steel sheet, steel sheet joining process and high-strength automotive part |
11/22/2007 | US20070267299 Method for Forming Anodic Oxide Layer on Surface of Aluminum or Aluminum Alloy |
11/22/2007 | US20070267298 Selective catalytic activation of non-conductive substrates |
11/22/2007 | US20070267297 Electroplating Chemistries and Methods of Forming Interconnections |
11/22/2007 | US20070267286 Increasing an electrical resistance of a resistor by oxidation or nitridization |
11/22/2007 | US20070266886 Printed wiring board and its manufacturing method |
11/22/2007 | DE10358147C5 Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen Method and apparatus for treating a level well in continuous flow systems |
11/22/2007 | DE102006022538A1 Schutzmittel für Oberflächen von Werkstück-Hohlbereichen sowie Vorrichtung und Verfahren zu dessen Bearbeitung Protection for surfaces of work piece hollow areas, and apparatus and method for processing |