Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
10/2007
10/11/2007US20070235409 Controlled fluid meniscus continuously fills the region between a tool head and the surface of the substrate; removing fluid by vacuum
10/11/2007DE10344723B4 Verfahren und Vorrichtung zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes Method and apparatus for manufacturing a bearing eye having at least one workpiece
10/10/2007CN200958127Y High-frequency metal electric panting machine
10/10/2007CN101053095A Nickel bright-plated battery
10/10/2007CN100342062C Electroplate device, electroplate method and method for manufacturing semiconductor device
10/10/2007CN100342054C Pantograph slip plate for electric locomotive and mfg. method thereof
10/10/2007CN100342037C Heat treatment method for a cold-rolled strip with an Ni and/or Co surface coating, sheet metal producible by said method and battery can producible by said method
10/09/2007US7279085 Gated nanorod field emitter structures and associated methods of fabrication
10/04/2007WO2007112380A2 Fabrication of topical stopper on head gasket by active matrix electrochemical deposition
10/04/2007WO2007111757A2 Precoat composition for organic solderability preservative
10/04/2007WO2007111676A2 Method of direct plating of copper on a substrate structure
10/04/2007US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
10/04/2007US20070227893 Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
10/04/2007US20070227892 Fluid injection apparatus and fabrication method thereof
10/04/2007US20070227633 Composition control for roll-to-roll processed photovoltaic films
10/04/2007US20070227632 Metal Strip Electroplating
10/03/2007EP1840246A1 Method for manufacturing plated resin molted article
10/03/2007EP1838905A2 Wafer support apparatus for electroplating process and method for using the same
10/03/2007EP1838903A2 Method for electroplating a metal to obtain cells with electrodes-solid polymer electrolyte
10/03/2007EP1838902A2 Nanoporous filter
10/03/2007EP1838490A1 Method of electroplating and pre-treating aluminium workpieces
10/03/2007EP1799884A4 Process for preparing a non-conductive substrate for electroplating
10/03/2007CN101048538A Article of manufacture and process for anodically coating aluminum and/or titanium with ceramic oxides
10/03/2007CN101048537A Surface comprising a microstructure that reduces adhesion and associated production method
10/03/2007CN100340369C Brazing product and method of manufacturing a brazing product
10/02/2007CA2275214C Process to electrolytically deposit copper layers
09/2007
09/27/2007WO2007108865A1 Improved process for coloring low temperature carburized austenitic stainless steel
09/27/2007WO2007082786A8 Galvanized rolling-hardened cold-rolled flat product and process for producing it
09/27/2007WO2006110178A3 Use of controlled atmosphere plasma spray combined with electrodeposition to fabricate a rocket engine chamber
09/27/2007US20070221505 Electrochemical deposition of one or more materials according to desired cross-sectional configurations so as to build up three dimensional structures from a plurality of at least partially adhered layers of deposited material; simplification
09/27/2007US20070221504 Fabrication of Topical Stopper on MLS Gasket by Active Matrix Electrochemical Deposition
09/27/2007US20070221503 Precoat composition for organic solderability preservative
09/27/2007US20070221502 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/27/2007CA2640937A1 Improved process for coloring low temperature carburized austenitic stainless steel
09/26/2007EP1836331A2 Anodising aluminum alloy
09/26/2007EP1678351B1 Method and system for selectively coating metal surfaces
09/26/2007CN200952045Y Gyrarotor electrical brush plating anode
09/26/2007CN101044269A Pulse reverse electrolysis of acidic copper electroplating solutions
09/26/2007CN101042044A Pumping rod or oil sucking pipe electroplating iron-nickel/tungsten alloy double-layer coating and surface processing technology
09/26/2007CN100340140C Flexible printed circuit board and process for producing the same
09/26/2007CN100339177C Brazing product and method of manufacturing a brazing product
09/25/2007US7273669 Spray-formed articles made of pseudo-alloy and method for making the same
09/25/2007US7273540 Electrolytic plating using a solution of water, a sulfonic acid, and tin, copper, and silver ions, and an organic complexing agent; separating a solution around a soluble anode from the plating solution on a cathode side by a non-ionic micro-porous membrane
09/25/2007US7273538 Composite material layer having positive temperature coefficient on a composite electroplated layer containing carbon black; double-sided metal foil clad substrate
09/25/2007US7273535 Insoluble anode with an auxiliary electrode
09/20/2007WO2007106911A2 Pattern transfer by solid state electrochemical stamping
09/20/2007WO2007021327A3 Pretreatment of magnesium substrates for electroplating
09/20/2007US20070215482 Method for Repeatable Post Cure Dye for Organic Coatings
09/20/2007US20070215481 In-situ cleaning processes for semiconductor electroplating electrodes
09/20/2007US20070215480 Pattern transfer by solid state electrochemical stamping
09/20/2007US20070215479 Method for monitoring the filling performance of copper plating formula for microvia filling
09/20/2007US20070215457 Apparatus for electroplating an article
09/19/2007EP1835051A2 Self-cleaning surface
09/19/2007CN101040065A Process for preparing a non-conductive substrate for electroplating
09/19/2007CN101039743A Filter for purifying hydrogen and method for manufacture thereof
09/19/2007CN101038440A Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
09/19/2007CN101037780A Pre-infusion for copper plating pf steel iron member and preparation method thereof
09/19/2007CN101037779A Double flute continuous plating process for hyposulfite electroplating bright thick silver
09/19/2007CN101036941A Method of forming small components
09/19/2007CN100338264C Electroplating method and special electroplating device using said electroplating method
09/19/2007CN100338261C Method for ceramic treatment of metal surface
09/18/2007US7271888 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
09/18/2007US7270734 Electroplating the articles to provide the electroplated metal deposits;subjecting the articles to processing that include heating,treating the electroplated articles after the processing to provide the electroplatable metal deposit portions with enhanced electroplatability by passing a current
09/13/2007WO2007102605A1 Plating method, electroconductive film, process for producing the electroconductive film, and light-transparent electromagnetic wave shielding film
09/13/2007US20070212883 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material
09/13/2007US20070212563 Workpieces Coated with an Aluminum/Magnesium Alloy
09/11/2007US7268021 Lead frame and method of manufacturing the same
09/11/2007US7267755 Multilater; dielectric and electroconductive layers
09/11/2007US7267749 Workpiece processor having processing chamber with improved processing fluid flow
09/11/2007US7267259 Method for enhancing the solderability of a surface
09/07/2007WO2007100297A1 Porous layer
09/07/2007WO2007099210A1 Method for electrochemically structuring a conductuve or semiconductor material, and device for implementing it
09/06/2007DE19982452B4 Flüssigkristall-Zusammensetzung und ihre Verwendung in einer Flüssigkristall-Anzeigevorrichtung A liquid crystal composition and its use in a liquid crystal display device
09/06/2007DE102006008027B3 Bauteil mit einer nanoskalige Strukturelemente aufweisenden Schicht und Verfahren zur Herstellung dieser Schicht Component having a nano-scale structural elements containing layer and methods of making this layer
09/05/2007EP1828440A1 Pulse-plating method and apparatus
09/05/2007EP1766106A4 Pulse reverse electrolysis of acidic copper electroplating solutions
09/05/2007CN200943105Y Shielding device for non-plating part of workpiece
09/05/2007CN101031367A Silver plating in electronics manufacture
09/05/2007CN101029409A Pretreatment and pretreatment solution for direct porous metallizing printing IC board
09/05/2007CN101029408A Whiskerless plated structure and plating method
09/05/2007CN100335200C Process for electrolytic coating of a strand casting mould
09/04/2007US7264740 cleaning and drying the metal or alloy surfaces, then etching to remove defects on the surface, rinsing with water and coating with corrosion inhibitors; surface treatment
09/04/2007US7264698 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/04/2007US7264007 Method and apparatus for cleaning a substrate using megasonic power
08/2007
08/30/2007WO2007097338A1 Plating material and electrical and electronic component using the plating material
08/30/2007WO2007097335A1 Plating apparatus and method of plating
08/30/2007WO2007096390A1 Method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices
08/30/2007US20070202258 Micro-pattern forming apparatus, micro-pattern structure, and method of manufacturing the same
08/30/2007US20070202246 Designing a plated pattern in printed wiring board
08/30/2007US20070199825 Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures
08/30/2007US20070199824 Electrospray coating of objects
08/30/2007US20070199822 Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
08/30/2007US20070199194 Method of electroplating a plurality of conductive fingers
08/30/2007DE102006007231A1 Verfahren zur Umhüllung eines Stents Method for coating a stent
08/30/2007CA2643018A1 Method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices
08/29/2007EP1826296A1 Process and apparatus for the manufacturing of an embossed and galvanised die-cast component
08/29/2007EP1826294A1 Process for electroplating metallic and metal matrix composite foils and microcomponents
08/29/2007EP1825539A1 Zinc/air cell
08/29/2007EP1825032A2 Anodized coating over aluminum and aluminum alloy coated substrates and coated articles
08/29/2007EP1753896B1 Method and system for selectively coating or etching surfaces
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