Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
02/2008
02/28/2008US20080047837 Method for anodizing aluminum-copper alloy
02/28/2008US20080047829 Plating Apparatus
02/27/2008EP1892322A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
02/27/2008EP1583871B1 Security film and method for the production thereof
02/27/2008EP1516076B1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
02/27/2008CN101133178A Method for producing a steel sheet protected against corrosion
02/27/2008CN100371118C Saw blade with grinding function
02/27/2008CN100371091C Method for processing surface of rim and its products
02/26/2008US7335288 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density
02/21/2008WO2008022316A2 Method and system for depositing alloy composition
02/21/2008WO2007112380A3 Fabrication of topical stopper on head gasket by active matrix electrochemical deposition
02/21/2008US20080044685 Articles Comprising High-Electrical-Conductivity Nanocomposite Material and Method for Fabricating Same
02/21/2008US20080041727 Method and system for depositing alloy composition
02/21/2008US20080041726 uniform thickness via aligning lines of electric force uniformly and parallel by disposing pair of conductive perforated plates, which are electrically connected to each other, between plating metals immersed in plating solution
02/20/2008EP1490602B1 Plated fastener inserts and method of producing the same
02/20/2008CN201024218Y Planar brush plating device
02/20/2008CN101128624A Anodising aluminium alloy
02/20/2008CN101126168A Surface treatment electrolysis copper foil, method for manufacturing the same , and circuit board
02/20/2008CN100370063C Apparatus for removing fir-tree crystal of metal strip edge
02/19/2008US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
02/14/2008WO2008018471A1 Partial plating method, laser plating apparatus, and plated member
02/14/2008WO2008018382A1 ELECTRICALLY Zn-PLATED STEEL SHEET HAVING EXCELLENT STAIN RESISTANCE
02/14/2008WO2008017156A1 Composite metallic materials, uses thereof and process for making same
02/14/2008US20080038574 Electronic Component Having Tin Rich Deposit Layer and the Process for Depositing the Same
02/14/2008US20080035489 Plating process
02/14/2008US20080035487 Probe and method of making same
02/14/2008US20080035486 of platinum and/or palladium; uniform thickness; aluminizing; in first stage a current magnitude is increased continuously or step-wise beginning from an initial value up to a maximum value; in second stage current magnitude is maintained constant at the maximum value; corrosion resistant; turbine blade
02/14/2008US20080035475 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
02/14/2008DE102006037535A1 Process to manufacture a two-part composite plastic of soft and hard plastic with selective galvanized finish
02/14/2008CA2660141A1 Composite metallic materials, uses thereof and process for making same
02/13/2008CN101123127A A micro silver plating and copper-coated copper multi-strand line and its making method
02/13/2008CN101122038A Electro chemical machining nano Ni-Fe alloy coat and its electroplate liquid, preparation method and use
02/12/2008US7329335 Device providing electrical contact to the surface of a semiconductor workpiece during processing
02/12/2008US7329334 Plating with a pulse-reverse current profile to produce a desired thickness of copper; controlling the ratio of cathodic pulse time or current density to anodic pulse time or current density; sulfur hardener (H2SO4) and polyalkylene glycol; softer than coatings formed using direct current
02/07/2008WO2008015168A1 Method for applying a metal layer to a substrate
02/07/2008WO2008015167A1 Dispersion for applying a metal layer
02/07/2008US20080029400 Selective electroplating onto recessed surfaces
02/07/2008US20080029399 Method of manufacturing nanostructures
02/07/2008US20080029398 Electroplating apparatus and electroplating method
02/07/2008US20080028976 Electroplated Coating of Zinc Alloy with Excellent Corrosion Resistance and Plated Metal Material Having Same
02/07/2008US20080028581 Screen, in particular for manufacturing nonwoven fabrics by means of a gaz jet or liquid jet solidification process
02/07/2008DE102006035660A1 Korrosionsschutzschicht mit verbesserten Eigenschaften Anti-corrosion layer having improved properties
02/06/2008EP1884577A2 Method for manufacturing a ceramic mould using electrophoresis and subsequent sintering and its application
02/06/2008CN201016123Y Cathode guard board structure for flexible circuit board plating technology
02/06/2008CN101120120A Ultrasonic treatment plant
02/06/2008CN101117724A Polish-plating machine
02/06/2008CN100367487C Method for the production of thin metal-containing layers having low electrical resistance
02/05/2008US7326328 Gated nanorod field emitter structures and associated methods of fabrication
02/05/2008US7326327 Rhodium electroplated structures and methods of making same
01/2008
01/31/2008WO2008013535A1 Process and apparatus for plating articles
01/31/2008WO2008012862A1 Whisker preventive agent for tin or tin alloy plating, and method of whisker prevention making use of the same
01/31/2008US20080026144 Method for manufacturing plastic products
01/31/2008US20080025805 Tool Holder with Vibration Damping Means and a Method for Manufacturing the Same
01/31/2008US20080023336 Technique for doping compound layers used in solar cell fabrication
01/31/2008US20080023335 Method of fabricating semiconductor device, and plating apparatus
01/31/2008DE10304533B4 Bead-Kristall sowie Verfahren zur Herstellung eines Bead-Kristalls und Verwendung Bead-crystal and methods of making and using a bead crystal
01/31/2008DE102006035233A1 Galvanische Oberflächenbeschichtung eines Bauteils Galvanic surface coating of a component
01/30/2008EP1882759A2 Galvanic surface plating of a component
01/30/2008CN101113527A Electroplating product and method for preparing same
01/29/2008US7323097 Electroplating method for a semiconductor device
01/29/2008US7323096 Electrochemical treatment on an object to be treated, capable of avoiding contact between the object and the atmosphere, uniformly activating the surface of the object with precision, obtaining a good precipitation of metal ion Oon surface
01/29/2008US7323095 Integrated multi-step gap fill and all feature planarization for conductive materials
01/29/2008US7323094 For electroplating metal-containing layers on semiconductor substrates
01/29/2008US7323093 Producing method of flexible wired circuit board
01/24/2008WO2006036252A3 Controlling the hardness of electrodeposited copper coatings by variation of current profile
01/24/2008US20080017516 Plasma chamber; electroplated coating of yttrium-containing aluminum oxide and zirconium oxide; exhibit improved corrosion or erosion resistance to energized gases; not easily susceptible to flaking off during operation, thermal cycling
01/23/2008EP1881091A1 Process and apparatus for controlling the plating result on a substrate surface
01/23/2008CN201010701Y Side guide component used for electroplating machine
01/23/2008CN101109094A Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate
01/23/2008CN101109093A Method for electrodepositing nanocrystalline chromium-nickel alloy coating with carboxylic acid or its salt -urea impulse
01/23/2008CN101108436A Product used for fluxless brazing and its preparing method
01/17/2008WO2007110246A3 Preparation of nanostructured metals and metal compounds and their uses
01/17/2008US20080011612 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
01/17/2008US20080011611 electroless plating; coating of color filter dyes, pigments, or conductive photoresistive material; electroless plating
01/17/2008US20080011610 Plating method
01/17/2008US20080011609 Method and Apparatus for Controlling Vessel Characteristics, Including Shape and Thieving Current For Processing Microfeature Workpieces
01/17/2008US20080010823 Method for increasing a production rate of printed wiring boards
01/17/2008US20080010822 Method for increasing a production rate of printed wiring boards
01/17/2008DE10234705B4 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen Electroplating and plating system for coating already formed conductive structures
01/16/2008EP1506056A4 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
01/16/2008CN101107388A Method for producing plated resin formed article
01/16/2008CN101104369A Vacuum coating image-forming method, special-purpose equipment and product
01/15/2008US7318963 Composite chromium plating film and sliding member having the same and method for manufacture thereof
01/10/2008WO2008004558A1 Process for producing ornamental plated article with use of conversion of resin to conductive one by sputtering, and hanging jig for fixing of resin molding
01/10/2008WO2008004315A1 Process for production of decoratively plated articles by utilizing the impartation of electroconductivity to resin by sputtering
01/10/2008WO2008003216A1 Electroplated product and preparation method thereof
01/10/2008US20080006911 Silver layer formed by electrosilvering substrate material
01/10/2008US20080006537 Method of plating and method of manufacturing a micro device
01/10/2008US20080006307 Substrate proximity processing structures
01/09/2008EP1876268A1 Black chromium process free of Cr-VI
01/09/2008EP1876267A2 Silver layer formed by electrosilvering substrate material
01/09/2008EP1876266A1 Electrolytic copper foil and process for producing electrolytic copper foil, surface treated elctrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic copper foil
01/09/2008EP1875279A1 A method of forming mirrors on a conducting substrate
01/09/2008CN101103138A Metal film and formation method of metal film
01/09/2008CN101101950A Silver layer formed by electrosilvering substrate material
01/09/2008CN101100748A Method for forming colored oxide film layer on nickel plating or chrome plating layer
01/09/2008CN100361234C Method for increasing the copper to superconductor ratio in a superconductor wire
01/09/2008CN100360716C Method for producing plated molded product
01/09/2008CN100360713C Anti-corrosion heat-resistant zine diffusion alloy claddiy material
01/08/2008US7316783 Method of wiring formation and method for manufacturing electronic components
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