| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/31/2013 | EP2620478A1 Curable composition for inkjet and method for producing electronic component |
| 07/31/2013 | EP2620460A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| 07/31/2013 | CN103229094A Sealant for liquid crystal dropping technique, method for producing sealant for liquid crystal dropping technique, vertical conducting material, and liquid crystal display element |
| 07/31/2013 | CN103228709A Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device |
| 07/31/2013 | CN103228697A High-heat-resistant epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
| 07/31/2013 | CN103228696A One component epoxy resin composition |
| 07/31/2013 | CN103228695A Epoxy composition with crystallization inhibition |
| 07/31/2013 | CN103228694A Thermosettable compositions and thermosets prepared therefrom |
| 07/31/2013 | CN103224769A Fast curing high-strength removable structural adhesive and storage method thereof |
| 07/31/2013 | CN103224735A Benzoxazine-modified epoxy glass printing ink and preparation method and application thereof |
| 07/31/2013 | CN103224701A High-strength low-heat-release mining flame-retardant grouting reinforcement material and preparation method thereof |
| 07/31/2013 | CN103224691A Composite material of modified boride filled with epoxy resin |
| 07/31/2013 | CN103224612A Solvent-free self-leveling epoxy resin curing agent and preparation method thereof |
| 07/31/2013 | CN103224611A Modified alicyclic amine curing agent and preparation method thereof |
| 07/31/2013 | CN103224610A Sustained-and-controlled-release acid-sensitive cationic polymer gene vector with branched structure, and preparation method and application thereof |
| 07/31/2013 | CN103224609A Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same |
| 07/31/2013 | CN103224608A Heat-curable epoxy-amine anti-seepage sealant |
| 07/31/2013 | CN103224604A Modified epoxy acrylate and paint for wood underground heat floor prepared by the modified epoxy acrylate |
| 07/31/2013 | CN102492140B Bi-phthalonitrile prepolymer, bi-phthalonitrile prepolymer/epoxy resin copolymer, bi-phthalonitrile prepolymer/epoxy resin cured material , as well as preparation method and application thereof |
| 07/31/2013 | CN102464792B Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin |
| 07/31/2013 | CN102445850B Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same |
| 07/31/2013 | CN102317343B Long chain alkylene group-containing epoxy compound |
| 07/31/2013 | CN102089346B Composition, polymerizable composition, resin, optical component, and production method of composition |
| 07/31/2013 | CN101981080B Process for continuous production of epoxy resins |
| 07/31/2013 | CN101952365B Curable resin composition and cured resin |
| 07/25/2013 | WO2013108890A1 Resin composition, layered product, multilayered printed wiring board, multilayered flexible wiring board, and process for producing same |
| 07/25/2013 | WO2013108629A1 Composition, composition for display device end-face sealing agent comprising composition, and display device and method for manufacturing same |
| 07/25/2013 | US20130190474 Epichlorohydrin, manufacturing process and use |
| 07/25/2013 | US20130190445 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 07/24/2013 | EP2617784A1 Primer composition |
| 07/24/2013 | EP2617752A1 Composition usable as heat-latent polymerization initiator |
| 07/24/2013 | EP2617751A1 Method for producing latent curing agent |
| 07/24/2013 | EP2617747A1 Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film |
| 07/24/2013 | EP2616497A1 Paper coating compositions |
| 07/24/2013 | CN203075951U Reaction kettle for preparing epoxy acrylate |
| 07/24/2013 | CN103221888A Resist underlayer film forming composition, and method for forming resist pattern using same |
| 07/24/2013 | CN103221480A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/24/2013 | CN103221452A Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material |
| 07/24/2013 | CN103221451A Epoxy resin composition for transparent sheets and cured product thereof |
| 07/24/2013 | CN103221450A Curable and cured compositions |
| 07/24/2013 | CN103221449A Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-<wbr/>curing adhesive sheet |
| 07/24/2013 | CN103221448A Epoxy resin comprising an adduct of DVBDO as toughener |
| 07/24/2013 | CN103221442A Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-p film |
| 07/24/2013 | CN103214794A Halogen-free epoxy resin composition for copper-clad plate and application thereof |
| 07/24/2013 | CN103214793A Advanced composite material matrix resin and preparation method thereof |
| 07/24/2013 | CN103214791A Resin composition sheet for encapsulating electronic parts and method of producing electronic part apparatus using the sheet |
| 07/24/2013 | CN103214657A Preparation method of anacardol glycidyl ether modified polyamine epoxy hardener |
| 07/24/2013 | CN103214656A Thermosetting resin composition |
| 07/24/2013 | CN103214655A Modified epoxy resin and high-solid anticorrosive coating prepared therewith |
| 07/24/2013 | CN103214654A One-step-feeding method for preparing phthalic-anhydride-modified epoxy acrylate, and formula thereof |
| 07/24/2013 | CN102643517B Method for preparing composite material by blending PHQEP/montmorillonite and modified epoxy resin |
| 07/24/2013 | CN102432980B Epoxy resin composition for semiconductor packaging and preparation method thereof |
| 07/24/2013 | CN102432831B Single-component aqueous epoxy resin emulsion capable of being self-cured at normal temperature, and preparation method thereof |
| 07/24/2013 | CN102432829B Sulphur-containing optical epoxy resin and preparation method thereof |
| 07/24/2013 | CN102432795B Sulfonated aqueous UV polyurethane modified epoxy acrylate emulsion and its preparation method |
| 07/24/2013 | CN102341426B 环氧树脂组合物 The epoxy resin composition |
| 07/24/2013 | CN102321252B Polyurea-modified self-emulsifying nano aqueous epoxy emulsion and preparation method thereof |
| 07/24/2013 | CN101768245B Naphthol resin, epoxy resin, epoxy resin composition, and solidified products thereof |
| 07/24/2013 | CN101724225B Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam |
| 07/18/2013 | WO2013105425A1 Epoxy resin composition, cured product of same, and optical semiconductor device |
| 07/18/2013 | US20130184378 Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions |
| 07/17/2013 | EP2614179A1 Electrodeposition coatings including a lanthanide series element for use over aluminum substrates |
| 07/17/2013 | CN103210012A Polyfunctional epoxy compound |
| 07/17/2013 | CN103205224A Acrylate emulsion laminating adhesive, and preparation method and application thereof |
| 07/17/2013 | CN103205087A Resin Sheet For Hollow Encapsulation And Production Method For The Sheet, And Production Method For Hollow Electronic Part Apparatus And Hollow Electronic Part Apparatus |
| 07/17/2013 | CN103204986A Cardanol Based Dimers And Uses Therefor |
| 07/17/2013 | CN102634263B Waterborne phosphorus-containing epoxy resin fire-retardant coating |
| 07/17/2013 | CN102391810B Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof |
| 07/17/2013 | CN102369482B Curable resin composition and printed wiring board |
| 07/17/2013 | CN102295735B Polyurethane-urea modified self-emulsifying nanometer waterborne epoxy emulsion and preparation method thereof |
| 07/17/2013 | CN102257028B Epoxy resin composition, prepreg, laminate board and multilayer board |
| 07/17/2013 | CN102030886B Epoxy resin combination and coating combination containing the same |
| 07/17/2013 | CN101679612B Resin composition for interlayer insulation of multilayer printed wiring board |
| 07/17/2013 | CN101583678B A cationic resin for pigment dispersion and an electrodepositable paint composition comprising the same |
| 07/16/2013 | US8486518 Epoxy resin for prepreg, prepreg, and fiber-reinforced composite material and methods for production thereof |
| 07/16/2013 | US8486303 Granule mass |
| 07/11/2013 | US20130177807 Binder for electrode of lithium battery and lithium battery containing the binder |
| 07/10/2013 | EP2612885A1 Resin composition, prepreg, and laminate |
| 07/10/2013 | EP2612884A1 Thermosetting epoxy resin composition and uses thereof |
| 07/10/2013 | EP2611849A1 Elastomeric insulation materials and the use thereof in subsea applications |
| 07/10/2013 | EP2611848A1 Elastomeric epoxy materials and the use thereof |
| 07/10/2013 | CN103201306A Condensation products of aminofunctional polymers |
| 07/10/2013 | CN103194166A Photo-thermal double-curing conductive adhesive and preparation method thereof |
| 07/10/2013 | CN103194163A Preparation method of moderate-temperature solidified and high-temperature resistant conductive adhesive |
| 07/10/2013 | CN103194070A Epoxy asphalt material, as well as preparation method and use method thereof |
| 07/10/2013 | CN103194046A Method for modifying epoxy resin by using mesogen-jacketed liquid crystal polymers |
| 07/10/2013 | CN103194043A Photosemiconductor package sealing resin material |
| 07/10/2013 | CN103193979A Application of hydroxyl-containing crosslinked polymer guanidinated product in gene transfer |
| 07/10/2013 | CN103193960A Modified UV (Ultraviolet) photocuring pure-acrylic resin and preparation method thereof |
| 07/10/2013 | CN103193959A Degradable hydrazide latent epoxy resin curing agent and application thereof |
| 07/10/2013 | CN103193958A Preparation method and applications of hyperbranched epoxy polymer |
| 07/10/2013 | CN102627752B Preparation method for waterborne epoxy resin emulsion |
| 07/10/2013 | CN102369230B Polyester composition for forming thermoset films |
| 07/10/2013 | CN102181044B Novel diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 07/10/2013 | CN102159991B Liquid crystal sealing agent, liquid crystal display panel using same, method for producing liquid crystal display panel, and liquid crystal display device |
| 07/10/2013 | CN102143985B Process for continuous production of epoxy resins |
| 07/10/2013 | CN102010572B Environment-friendly epoxy resin composition as well as preparation method and application thereof |
| 07/10/2013 | CN101824206B Ultra-high-strength buoyancy material and preparation method thereof |
| 07/10/2013 | CN101654504B Alkylated 4-aminobenzyl-4-aminocyclohexane |
| 07/10/2013 | CN101597475B Encapsulation material composition and encapsulation material manufacture method |