| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/31/2013 | WO2013161480A1 Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body |
| 10/31/2013 | WO2013161088A1 Curable resin composition, cured product and method of producing a cured product |
| 10/31/2013 | WO2013159339A1 Curable epoxy resin compositions and composites made therefrom |
| 10/30/2013 | EP2657297A1 Curable epoxy resin composition and photosemiconductor device using same |
| 10/30/2013 | EP2657296A1 Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same |
| 10/30/2013 | EP2657295A1 Halogen-free high-tg resin composition and prepreg and laminate fabricated by using the same |
| 10/30/2013 | EP2657271A1 Surfactant compositions and use for aqueous compositions |
| 10/30/2013 | EP2657270A1 Optical waveguide forming epoxy resin composition, optical waveguide forming curable film, light transmission flexible printed board, and production method for the flexible printed board |
| 10/30/2013 | EP2655470A1 Storage-stable heat-curable granular material mixture |
| 10/30/2013 | EP2655469A1 Curable adhesive composition |
| 10/30/2013 | EP2655468A1 Epoxy resin compositions containing epoxy and vinyl ester groups |
| 10/30/2013 | EP2655463A1 Heat-curing sealing compound compositions having fast skin formation and good storage stability |
| 10/30/2013 | EP2655384A2 Oligomeric phosphonates and compositions including the same |
| 10/30/2013 | EP2655383A2 Hyperbranched oligomeric phosphonates and compositions including the same |
| 10/30/2013 | CN103380161A Production method for obtaining fiber-reinforced composite material, and epoxy resin composition used therein |
| 10/30/2013 | CN103380160A Curable polymer materials |
| 10/30/2013 | CN103374204A Epoxy resin composite material, film and circuit substrate |
| 10/30/2013 | CN103374202A Epoxy resin composite material, film and circuit board |
| 10/30/2013 | CN103374115A Preparation method of modified epoxy resin |
| 10/30/2013 | CN102702473B Epoxy modified polyurethane double-component grouting material for road engineering maintenance and preparation method thereof |
| 10/30/2013 | CN102675631B Cyanate/bis (oxazoline)/epoxy/polyethylene glycol modified resin composition |
| 10/30/2013 | CN102395614B Photosensitive polyester composition for use in forming thermally cured film |
| 10/30/2013 | CN102211984B Epoxy molding compound, epoxy resin and preparation methods thereof |
| 10/30/2013 | CN102146249B High-voltage power transmission line ice-covering-proof paint and preparation method thereof |
| 10/29/2013 | US8569444 Polyalkylene glycol derivative and process for producing same |
| 10/29/2013 | US8569442 Hydrogenation process for improving yield of hydrogenated bisphenol-A-based epoxy resin |
| 10/29/2013 | US8569398 Jettable compositions |
| 10/29/2013 | US8569393 UV-LED curable compositions and inks |
| 10/24/2013 | WO2013158517A1 Low density epoxy composition with low water uptake |
| 10/24/2013 | WO2013157599A1 Novel epoxy resin, epoxy resin composition comprising said epoxy resin, cured product of said resin composition, and material for preventing adhesion of microorganisms |
| 10/24/2013 | WO2013157424A1 Lignin-derived epoxy resin composition and use thereof |
| 10/24/2013 | WO2013157382A1 Heat-curable protective liquid for glass mask and glass mask |
| 10/24/2013 | WO2013157061A1 Epoxy resin composition and cured product |
| 10/24/2013 | WO2013087592A3 Epoxy resin compositions |
| 10/23/2013 | EP2654389A1 Joining sheet, electronic component, and producing method thereof |
| 10/23/2013 | EP2653492A1 Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same |
| 10/23/2013 | EP2653486A1 Low density epoxy composition with low water uptake |
| 10/23/2013 | EP2652002A1 Curable compositions |
| 10/23/2013 | EP2651876A1 Polyamines having secondary aliphatic amino groups |
| 10/23/2013 | EP2651875A1 Amines having secondary aliphatic amino groups |
| 10/23/2013 | CN103370371A Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board |
| 10/23/2013 | CN103370354A Epoxy resin composition, method for producing same, and semiconductor device using same |
| 10/23/2013 | CN103370353A Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 10/23/2013 | CN103370352A 可固化环氧树脂组合物 The curable epoxy resin composition |
| 10/23/2013 | CN103370304A Sulfonium sulfates, preparation and use thereof |
| 10/23/2013 | CN103360579A Method for producing phosphorus-containing epoxy resin |
| 10/23/2013 | CN103360578A Synthetic resin and adhesive containing synthetic resin and for fixing during silicon rod cutting |
| 10/23/2013 | CN103360577A A thermosetting resin composition, a resin film, a copper-clad plate, and a flexible printed circuit board |
| 10/23/2013 | CN103360576A Synthetic method of modified bisphenol A epoxy acrylate |
| 10/23/2013 | CN103360575A Aqueous organic salt modified epoxy ester resin, and preparation method and application thereof |
| 10/23/2013 | CN103360556A Preparation method of low-viscosity o-cresol formaldehyde resin |
| 10/23/2013 | CN103360405A Synthesis method of spiro-compound 2,4,8,10-tetracarbonyl-3,9-dioxaspiro[5,5]undecane |
| 10/23/2013 | CN102604043B Double-component imine modified epoxy solvent-free impregnated resin and preparation and use methods |
| 10/23/2013 | CN102483571B Photosensitive composition and printed wiring board |
| 10/23/2013 | CN102471495B Aluminum chelate-based latent curing agent |
| 10/23/2013 | CN101809055B Curable resin composition for molded bodies, molded body, and production method thereof |
| 10/22/2013 | US8564391 Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| 10/22/2013 | US8563661 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 10/22/2013 | US8563652 Polymer material and method for the production thereof |
| 10/22/2013 | US8563630 Dry adhesive and method of preparing the same |
| 10/22/2013 | CA2473526C Polyalkylene polymer compounds and uses thereof |
| 10/17/2013 | WO2013154785A1 Hardeners for cold-curing epoxy systems |
| 10/17/2013 | WO2013153988A1 Diepoxy compound and method for producing same |
| 10/17/2013 | WO2013126642A3 Preparation and uses of epoxy resins of cyclododecane polyphenols |
| 10/17/2013 | US20130274433 Polyfunctional epoxy compound |
| 10/17/2013 | US20130270726 Encapsulation Of Active Agents For On-Demand Release |
| 10/16/2013 | EP2650323A1 Method for producing porous epoxy resin sheet |
| 10/16/2013 | CN103351777A Nanometer antifouling and antifingerprint coating composition and preparation method thereof |
| 10/16/2013 | CN103351581A High-dielectric-constant resin composition and application thereof |
| 10/16/2013 | CN103351580A Preparation method of epoxy resin pouring sealant |
| 10/16/2013 | CN102675580B Electrochromatic epoxy resin polymer and preparation method thereof |
| 10/16/2013 | CN102634168B Epoxy glass fiber and high-silica sand core packing material and preparation method thereof |
| 10/16/2013 | CN102585167B Preparation method of epoxy resin |
| 10/16/2013 | CN102199276B Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof |
| 10/16/2013 | CN101971106B Composition for holographic recording medium |
| 10/16/2013 | CN101842408B Resin composition for forming insulating layer of printed wiring board |
| 10/15/2013 | DE202013104133U1 Polymerwerkstoff auf Basis nachwachsender Rohstoffe Polymer materials based on renewable resources |
| 10/10/2013 | WO2013151835A1 Epoxy adhesive, manufacture and use thereof |
| 10/10/2013 | WO2013151308A1 Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group |
| 10/10/2013 | WO2013151157A1 Optical stereolithography resin composition containing thermally expandable microcapsule |
| 10/10/2013 | WO2013150900A1 Curable epoxy resin composition |
| 10/10/2013 | WO2013150753A1 Epoxy resin composition, prepreg, laminate, and printed wiring board |
| 10/10/2013 | US20130267663 Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same |
| 10/09/2013 | EP2647667A1 Curable epoxy resin composition |
| 10/09/2013 | CN103347939A Prepreg and method for manufacturing same |
| 10/09/2013 | CN103347925A 可固化组合物 The curable composition |
| 10/09/2013 | CN103347924A High performance thermoset useful for electrical laminate, high density interconnect and interconnect substrate applications |
| 10/09/2013 | CN103342943A Method for preparing high-charge-density cathode electrophoretic paint |
| 10/09/2013 | CN103342877A Resin composition, prepreg, laminate and wiring board |
| 10/09/2013 | CN103342876A Resin composition, prepreg, laminated board and wiring board |
| 10/09/2013 | CN103342799A Fluorine-containing, phosphorus-containing and silicon-containing epoxy resin and preparation method for same |
| 10/09/2013 | CN103342798A Synthesis method for low-viscosity high-temperature-resistant modified epoxy resin |
| 10/09/2013 | CN103342764A Photoinitiator and preparation method thereof |
| 10/09/2013 | CN102757579B Oxa-phosphaphenanthrene flame retardant containing cyclotriphosphonitrile structure, and preparation method and application thereof |
| 10/09/2013 | CN102558570B Epoxy acrylate for UV (ultraviolet) curable coating and preparation method of epoxy acrylate |
| 10/09/2013 | CN102459406B Cationically polymerizable resin composition and cured object obtained therefrom |
| 10/09/2013 | CN102352023B Preparation method of modified epoxy resin |
| 10/09/2013 | CN102076733B Epoxy resin composition |
| 10/09/2013 | CN101983217B Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same |
| 10/09/2013 | CN101848915B Epoxy group-containing organosiloxane compound, curable composition for transfer material, and fine pattern forming method using the composition |