Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
12/2013
12/03/2013US8598309 Catalytic system of nitrate anions for CO2/epoxide copolymerization
12/03/2013US8598308 Multifunctional dendrons and dendrimers with a high loading capacity
12/03/2013US8597749 High-solid anticorrosive coating composition
11/2013
11/28/2013WO2013177546A2 Polycarbonate polyol compositions and methods
11/27/2013EP2666826A1 Resin composition, and printed wiring board, laminated sheet, and prepreg using same
11/27/2013EP2666825A1 Resin composition, and printed wiring board, laminated sheet, and prepreg using same
11/27/2013EP2665761A1 High performance thermoset useful for electrical laminate, high density interconnect and interconnect substrate applications
11/27/2013CN103415545A 粉末涂料 Powder Coatings
11/27/2013CN103415540A Photosensitive composition, cured article, and method for producing actinically cured article
11/27/2013CN103410003A Fluorine-containing self-lubricating fabric coating material and preparation method thereof
11/27/2013CN103409100A Epoxy-resin-modified water-based polyurethane adhesive and preparation method thereof
11/27/2013CN103409093A Solventless TGDADPE type multifunctional epoxy resin adhesive and preparation method thereof
11/27/2013CN103408903A High-strength insulating support beam and preparation method thereof
11/27/2013CN103408900A Epoxy resin plastic capable of curing quickly and preparation method thereof
11/27/2013CN103408899A Tree-like structure micro-nano wave absorption agent/epoxy resin composite wave absorption material preparation method
11/27/2013CN103408767A Amination lignin containing reactive amino and preparation and application thereof
11/27/2013CN103408727A TGBAPOPP type matrix resin used for preparing advanced composite and preparation method of TGBAPOPP type matrix resin
11/27/2013CN103408726A Toughening epoxy resin curing agent and preparation method and application thereof
11/27/2013CN103408725A Hydrophilic epoxy resin curing agent and preparation method thereof
11/27/2013CN103408724A Method for preparing novolac epoxy resin containing POSS (Polyhedral Oligomeric Silsesquioxane) and tungstic acid
11/27/2013CN103408510A Epoxy resin compound of liquid crystal containing naphthalene, and preparation method and composition thereof
11/27/2013CN102757551B Aqueous epoxy modified alkyd resin and preparation method and application thereof
11/27/2013CN102617830B Room temperature curing water-based epoxy hardener and preparation method thereof
11/27/2013CN102344539B Silicon-containing double-curing group resin and preparation method thereof
11/27/2013CN102333808B Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article
11/27/2013CN102295740B Polyamideimide cured epoxy resin composite material and preparation method thereof
11/26/2013US8592038 Multilayer decorative coating comprising a two-component paint and a protective resin
11/26/2013CA2649841C Resin composition, prepreg, laminate, and wiring board
11/26/2013CA2644706C Universal wetting and dispersing agents based on isocyanate monoadducts
11/21/2013WO2013172450A1 Esterified epoxy resin, method for producing same, and curable composition comprising same
11/21/2013WO2013172433A1 Alkali-developable thermosetting resin composition, and printed wiring board
11/21/2013WO2013172406A1 Resin composition for optical stereolithography
11/21/2013WO2013172200A1 Epoxy-amine adduct, resin composition, sizing agent, carbon fiber coated with sizing agent, and fiber-reinforced composite material
11/21/2013WO2013172199A1 Curable resin composition, cured product thereof, prepreg, and fiber-reinforced composite material
11/21/2013WO2013172145A1 Photocurable resin composition
11/21/2013WO2013172064A1 Epoxy/vinyl copolymer-type liquid resin composition, cured article thereof, electrical/electronic device using said cured article, and method for producing said cured article
11/21/2013WO2013172009A1 Reactive polyester compound and active energy ray-curable resin composition
11/21/2013WO2013171888A1 Alkali-development-type thermoset resin composition and printed circuit board
11/21/2013WO2013171292A1 Fast cure epoxy resins and prepregs obtained therefrom
11/21/2013WO2013170313A1 Epoxy resins
11/21/2013US20130310485 Epoxy-adduct hardening agents
11/20/2013CN103403054A Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment
11/20/2013CN103396722A Aqueous UV (ultraviolet)-curable fluorine-alcohol-modified epoxy resin coating and preparation method thereof
11/20/2013CN103396655A Potting adhesive for magnetorheological dampers, and preparation and application methods thereof
11/20/2013CN103396652A Bituminous concrete crack self-healing microcapsule and preparation method of same
11/20/2013CN103396529A High temperature resistant electrical insulation laminate matrix resin and preparation method of same
11/20/2013CN103396517A High temperature resistant vinyl ester resin
11/20/2013CN102365310B Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
11/20/2013CN102304215B Sealant of liquid crystal panel and modification method thereof
11/19/2013US8586699 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
11/19/2013US8586683 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
11/19/2013US8586063 Thickeners
11/19/2013US8585861 Heat-resistant structural epoxy resins
11/14/2013WO2013168691A1 Curing agent for anionically curable compounds, curable composition, cured product, novel imidazole-based compound and use of same
11/14/2013WO2013081895A3 Liquid accelerator composition for hardeners
11/14/2013WO2013075806A3 Epoxy compositions
11/14/2013WO2013075805A3 Epoxy compositions
11/14/2013US20130303661 Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same
11/14/2013US20130300020 Hot-formable and recyclable epoxy anhydride thermosetting resins and thermosetting composites
11/13/2013EP2662395A2 Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
11/13/2013CN103391955A Polyether hybrid epoxy curatives
11/13/2013CN103387658A Ultraviolet light-moisture-heat triple curable automobile aqueous intermediate coat and preparation method thereof
11/13/2013CN102618200B Organosilicone-epoxy-polyimide adhesive and preparation method thereof
11/13/2013CN102408678B Vacuum pouring type carbon nano tube reinforced epoxy resin material for megawatt-grade wind power generation blade and preparation method thereof
11/13/2013CN101925628B Thermosetting epoxy resin composition
11/13/2013CN101735617B Heat-curable resin composition
11/12/2013US8580916 Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use
11/12/2013US8580455 Crosslinked polybenzoxazines, electrolyte membrane including the same, and fuel cell employing the electrolyte membrane
11/07/2013WO2013165486A1 Epoxylated polyalkyleneimine film coatings
11/07/2013WO2013048668A3 Reciprocating-plate column reactor for epoxidation of epoxy resins
11/07/2013US20130291992 Elastomeric insulation materials and the use thereof in subsea applications
11/06/2013EP2660927A1 Sealant composition for photoelectric conversion element
11/06/2013EP2660283A1 Resin composition for expansion molding
11/06/2013EP2660263A1 Curable epoxy resin composition
11/06/2013EP2658894A2 Adhesion promoter resin compositions and coating compositions having the adhesion promoter resin compositions
11/06/2013CN103382280A Temperature-response epoxy alloy material and preparation method thereof
11/06/2013CN103382267A Organic amine modified ammonium polyphosphate, preparation method and applications thereof
11/06/2013CN103382242A Phosphorus-containing flame-retardant phenolic resin and flame-retardant cured epoxy resin prepared with phosphorus-containing flame-retardant phenolic resin as raw material
11/06/2013CN102838960B Low-viscosity epoxy structure adhesive and preparation method thereof
11/06/2013CN102559120B Temperature-resistant, corrosion-resistant and high-adhesion adhesive and preparation method thereof
11/06/2013CN102532482B Epoxy resin organosilicon modifier and preparation method thereof
11/06/2013CN102504743B Single-component underfill capable of being stored at room temperature and preparation method thereof
11/06/2013CN102443114B Air-dried unsaturated polyester resin with excellent comprehensive property and its preparation method
11/06/2013CN102388077B Photocurable resin and photocurable resin composition
11/06/2013CN102341430B Epoxy resin composition, curing agent, and curing accelerator
11/06/2013CN102307925B Room temperature curing epoxy adhesive
11/06/2013CN102304218B Plating solution and plating method
11/06/2013CN102127205B Phosphorus-containing epoxy resin semi-cured material and preparation method thereof
11/06/2013CN101910239B Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
11/06/2013CN101560286B Epoxide polymer of shape memory
11/05/2013US8575238 X-ray opaque coating
11/05/2013US8575237 Corrosion inhibitor systems using environmentally friendly green solvents
10/2013
10/31/2013WO2013162840A1 Epoxy adhesive composition
10/31/2013WO2013162232A1 Self-extinguishing epoxy resin for use in epoxy molding compound and method for manufacturing same, and epoxy resin composition for use in epoxy molding compound
10/31/2013WO2013162015A1 Light-curing/heat-curing resin composition, hardened material, and printed circuit board
10/31/2013WO2013161917A1 Curable resin composition, cured product and method of producing a cured product
10/31/2013WO2013161862A1 Chemically amplified positive photosensitive resin composition, method for manufacturing hardened film, hardened film, organic el display device, and liquid-crystal display device
10/31/2013WO2013161826A1 Radiation-curing composition, adhesive and polarizing plate
10/31/2013WO2013161606A1 Epoxy resin composition, resin sheet, cured article, and phenoxy resin
10/31/2013WO2013161481A1 Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body
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