Patents for B81B 7 - Micro-structural systems (8,983)
08/2014
08/13/2014CN103979481A Mems铝锗键合结构及其制造方法 Mems AlGe bonded structure and manufacturing method
08/13/2014CN103475262B 压电和摩擦电混合纳米发电机 Piezo-electric hybrid nano-generator and friction
08/13/2014CN102627253B 一种用于mems器件的自对准封装结构及其制造方法 Self-aligning method of manufacturing a package structure and device for mems
08/13/2014CN102079502B 一种mems器件及其圆片级真空封装方法 One kind of mems devices and wafer level vacuum packaging method
08/13/2014CN101870444B 具有功能连结导线的微机电系统芯片 Connecting wires with functional MEMS chip
08/12/2014US8803296 Coatings for relatively movable surfaces
08/07/2014WO2014120206A1 Sensor having particle barrier
08/07/2014WO2014093304A3 Sensor with an embedded thermistor for precise local temperature measurement
08/07/2014DE102013201795A1 Mikromechanisches Bauelement mit einer Membranstruktur A micromechanical component having a membrane structure
08/07/2014DE102012015204B4 Verfahren zur Herstellung eines Flammenionisationsdetektors A process for producing a flame ionization detector
08/06/2014EP2762864A1 Membrane-based sensor device and method for manufacturing the same
08/06/2014EP2762441A2 Internal electrical contact for enclosed MEMS devices
08/06/2014CN203754412U 一种mems红外光源 One kind of infrared light mems
08/06/2014CN203754411U 一种双腔体mems混合集成金属封装结构 One kind of double-chamber structure mems hybrid integrated metal packaging
08/06/2014CN103974896A 用于垂直集成的堆叠式通孔 For vertically integrated stacked vias
08/06/2014CN103969467A 一种压阻式mems高过载加速度计 One kind of high overload piezoresistive accelerometer mems
08/06/2014CN103968997A 一种soi微型皮拉尼计及其制作方法 One kind of miniature soi Pirani gauge its production methods
08/06/2014CN103964376A 双层微机电系统器件及其制造方法 Double MEMS device and manufacturing method
08/06/2014CN103964373A 具有抗裂膜结构的微机电系统器件及其制造方法 Having a MEMS device and method of manufacturing the film structure of Cracking
08/06/2014CN103964372A 一种整合式微机电元件及其制造方法 An integrated micro-electromechanical device and manufacturing method
08/06/2014CN103964369A 电极横向可动的微机械圆盘谐振器 The movable electrode lateral micromechanical disc resonators
08/06/2014CN103964368A Mems器件和制造mems器件的方法 Mems device and method of manufacturing the mems device
08/06/2014CN103964367A 抗静摩擦的mems器件及其操作方法 Mems device and its method of operation of the anti-static friction
08/06/2014CN103964366A 封闭的mems器件的内部电接触 Internal electrical contacts closed mems device
08/06/2014CN103964365A 用于密封环结构的方法和装置 Method and apparatus for the sealing ring structure
08/06/2014CN102424354B 分形结构粗糙表面 Fractal rough surface
08/06/2014CN102375090B 微机械悬臂梁开关在线式微波功率检测器及制备方法 Micromechanical cantilever switch line microwave power detector and preparation methods
08/06/2014CN101776501B 一种mems压力敏感芯片及其制作方法 Mems one kind of pressure-sensitive chip and production methods
08/06/2014CN101742389B 集成电路结构 Integrated circuit structure
08/06/2014CN101301992B 微机械装置及在其上调节确定温度或确定温度过程的方法 Micromechanical device and a method to determine the temperature or determine the temperature adjustment process thereon
08/05/2014DE202007019626U1 Mikromechanisches Bauteil mit mindestens zwei Kavitäten mit unterschiedlichem Innendruck und/oder unterschiedlicher Gaszusammensetzung Micromechanical element having at least two cavities having different internal pressures and / or different gas composition
07/2014
07/31/2014WO2014116183A1 Microdevices for separation of non-spherical particles and applications thereof
07/31/2014DE102014100722A1 MEMS-Vorrichtung und Verfahren zur Herstellung einer MEMS-Vorrichtung The MEMS device and method of manufacturing a MEMS device
07/31/2014DE102013200363A1 Mikrofluidisches Kanalsystem mit Blasenfängereinrichtung und Verfahren zum Entfernen von Gasblasen The microfluidic channel system with bubble catcher device and method for removing gas bubbles
07/30/2014EP2758335A1 Vented mems apparatus and method of manufacture
07/30/2014CN203741034U 用于mems集成器件的封装体及电子装置 And the electronic device package of the integrated device for mems
07/30/2014CN103958393A Mems传感器封装及其方法 Mems sensor package and method
07/30/2014CN103954793A 一种mems加速度计 One kind of mems accelerometer
07/30/2014CN103950886A 一种mems传感器封装结构及其封装方法 One kind mems sensor package structure and packaging method
07/30/2014CN102356323B 基于三相电容的感测 Based on the three-phase capacitor sensing
07/29/2014US8792179 Laminated micromirror package
07/24/2014US20140203422 Microchip with Blocking Apparatus and Method of Fabricating Microchip
07/24/2014US20140203421 Micro-electro mechanical system (mems) structures and methods of forming the same
07/24/2014US20140203379 Integration of laminate mems in bbul coreless package
07/24/2014DE102014100755A1 Chipanordnung und verfahren zu ihrer herstellung Chip system and process for their production
07/24/2014DE102014100743A1 Chipgehäuse und Verfahren zu seiner Herstellung Chip package and process for its preparation
07/24/2014DE102013211693B3 Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip) Sensor with a micro-electro-mechanical chip (MEMS chip)
07/24/2014DE102013200904A1 MEMS-Bauelement MEMS device
07/24/2014DE102013100388B4 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making
07/23/2014EP2757812A1 Semiconductor device and microphone
07/23/2014CN103935953A 复合腔体及其形成方法 And method of forming the composite cavity
07/23/2014CN103935952A 芯片封装体及其制造方法 Chip package and method of manufacturing
07/23/2014CN102633227B 一种mems惯性传感器结构压膜阻尼可调装置 One kind mems inertial sensor structure film damping adjustable devices
07/23/2014CN102398886B 具微机电元件的封装结构及其制法 Jiqizhifa package structure with micro-electromechanical components
07/22/2014US8786035 Electronic device having MEMS element and resistive element
07/17/2014US20140197101 Systems and methods for increasing convective clearance of undesired particles in a microfluidic device
07/17/2014DE102014100470A1 Kamm-MEMS-Vorrichtung und Verfahren zur Herstellung einer Kamm-MEMS-Vorrichtung Comb-MEMS device and method of manufacturing a comb-MEMS device
07/17/2014DE102014100238A1 MEMS-Vorrichtung mit Polymerschicht, System einer MEMS-Vorrichtung mit einer Polymerschicht, Verfahren zum Herstellen einer MEMS-Vorrichtung mit einer Polymerschicht MEMS device with polymer layer system of a MEMS device with a polymer layer, A method of manufacturing a MEMS device with a polymer layer
07/17/2014DE102013100388A1 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making
07/16/2014CN203719812U 气压与加速度传感器相集成的mems芯片 Pressure and acceleration sensor chip with integrated mems
07/16/2014CN203715270U 一种传感器装配封装系统 A sensor assembly packaging system
07/16/2014CN103926034A 硅压力芯片结构设计及工艺 Silicon chip design and process pressure
07/16/2014CN103926028A 一种应变片的结构设计及制作工艺 Structural design and fabrication process of a strain gauge
07/16/2014CN103922274A 一种三维红外光源及其制作方法 A three-dimensional infrared light source and its production method
07/16/2014CN103922273A 叠层组合式mems芯片的制造方法及其叠层组合式mems芯片 The method of manufacturing a laminated composite mems chip and chip stacked modular mems
07/16/2014CN103922270A 非制冷光读出红外焦平面阵列结构和制作方法 Optical readout uncooled infrared focal plane array structure and production methods
07/16/2014CN103922269A Mems器件、mems器件的系统、制作mems器件的方法 Mems device, mems device system, method of making mems device
07/16/2014CN103922268A 阶梯梁式高q值抗过载mems悬浮电感 Ladder beam high q value of anti-overload mems suspended inductors
07/16/2014CN103922267A 一种基于mems的惯性传感器生产及晶圆级封装工艺 A mems inertial sensor production and wafer-level packaging technology based
07/16/2014CN102253645B 微机电系统电路以及控制微机电系统电路的方法 System circuit and a control method for micro-electromechanical systems MEMS circuit
07/15/2014US8779583 Semiconductor device and manufacturing method
07/15/2014US8778741 Low cost hermetically sealed package
07/15/2014US8776597 Capacitive type humidity sensor and manufacturing method thereof
07/10/2014US20140191233 Microphone component
07/10/2014DE112012004498T5 Gehäuse für einen dünnen Halbleiter-Chip Housing for a thin semiconductor chip
07/10/2014DE102011077933B4 Verfahren zum Bonden zweier Substrate A method of bonding two substrates
07/09/2014CN103917483A 通风微机电系统装置和制造方法 Ventilation MEMS device and method of manufacture
07/09/2014CN103917482A 具有掩埋的导电区域的微机电器件及其制造工艺 MEMS devices and manufacturing process having the buried conductive regions
07/09/2014CN103915422A 用于半导体结构的方法和装置 Method and apparatus for a semiconductor structure
07/09/2014CN103910326A 自供电射频收发组件中硅基热电和光电传感器 Self-powered radio transceiver components based thermoelectric and photoelectric sensors
07/09/2014CN103910325A 一种可实现键合间隙精确可控的高可靠性的mems封装结构及封装方法 A bonding gap precisely controllable high reliability mems packaging structure and packaging method can be realized
07/09/2014CN103910324A 金属玻璃微流体通道及其制备方法 Metallic glass microfluidic channel and its preparation method
07/09/2014CN103910323A 微机电装置 MEMS devices
07/09/2014CN102381677B 复合晶片半导体元件及其形成方法 Compound semiconductor device and method of forming a wafer
07/09/2014CN102234096B 半导体结构体及半导体结构体的制造方法 The method of manufacturing a semiconductor structure and semiconductor structure
07/09/2014CN102190279B 半导体装置 Semiconductor device
07/08/2014CA2688795C Systems and methods for monitoring health and delivering drugs transdermally
07/03/2014WO2014105471A1 Preventing glass particle injection during the oil fill process
07/03/2014WO2014105178A1 Hybrid radio frequency component
07/03/2014US20140184029 Microelectromechanical system-based resonator device
07/03/2014US20140183671 Semiconductor device and microphone
07/03/2014US20140183670 Capacitive Intravascular Pressure-Sensing Devices and Associated Systems and Methods
07/03/2014US20140183340 Optically controlled mems switch and method of using the same
07/02/2014CN103904074A 电路和用于制造电路的方法 Circuit and a method for manufacturing the circuit
07/02/2014CN103900544A 一种基于热膨胀流的mems三轴陀螺及其加工方法 A three-axis thermal expansion of the flow of mems gyro and processing method based on
07/02/2014CN103896203A 一种mems红外光源及其制备方法 Mems one kind of infrared light source and its preparation method
07/02/2014CN102430512B Mems玻璃球面超声换能器片上集成系统及其制备方法 Mems glass sphere transducer ultrasound transducer on-chip system and its preparation method
07/01/2014US8767170 Flow through MEMS package
07/01/2014US8765530 Methods of manufacture of top port surface mount silicon condenser microphone packages
07/01/2014US8765511 Semiconductor device and method for manufacturing the same
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