Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
03/2009
03/05/2009US20090061737 Lapping apparatus and lapping method
03/05/2009US20090061734 Endpoint detection system for wafer polishing
03/05/2009US20090061733 Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness
03/04/2009CN101376230A Lapping apparatus and lapping method
03/04/2009CN100466191C Polishing device
03/03/2009US7497763 Polishing pad, a polishing apparatus, and a process for using the polishing pad
03/03/2009US7497762 Apparatus and method for correcting grinding amount of liquid crystal display panel
02/2009
02/26/2009WO2009023979A1 Method and device for machining workpieces
02/26/2009US20090051939 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
02/25/2009EP2028437A1 Apparatus and method for the dimensional checking of cylindrical parts
02/25/2009CN101372090A Method for measuring thickness of substrate and equipment for processing substrate
02/25/2009CN100464211C Manufacture device and method of liquid crystal display panel
02/24/2009US7495759 Damage and wear detection for rotary cutting blades
02/24/2009US7494399 Single-step fiber grinding process and apparatus
02/19/2009US20090047869 Precision Machining Method
02/18/2009EP2025470A1 Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/18/2009EP2025469A1 Multi-layer polishing pad material for CMP
02/18/2009EP2025450A2 Grinding apparatus and method of controlling grinding apparatus
02/18/2009CN201195276Y On-line testing numerical control cam grinder
02/18/2009CN101367199A Novel device and method for testing thermal stress at time of processing of camshaft of grinder
02/18/2009CN100463136C Chemical mechanical polishing and method for manufacturing semiconductor device using the same
02/17/2009US7491115 Indexing device for performing operational tasks on a tool element
02/12/2009WO2009019537A1 Process and apparatus for grinding tyres
02/12/2009US20090042487 Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/12/2009US20090042483 Working System, Method for Detecting Contact, and Acoustic Emission Contact Detection Device
02/12/2009US20090042482 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
02/12/2009US20090042481 Method of calibrating or compensating sensor for measuring property of a target surface
02/11/2009EP2021887A1 Numerically controlled grinding machine and process for controlling same
02/11/2009CN101362309A Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
02/10/2009US7488235 Polishing apparatus and related polishing methods
02/05/2009WO2009018012A1 Automated detection of characteristics of abrasive products during use
02/05/2009WO2009018011A1 Abrasive products with splice marks and automated splice detection
02/05/2009US20090036029 Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback
02/05/2009US20090036028 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof
02/05/2009US20090036027 Automated detection of characteristics of abrasive products during use
02/05/2009US20090036026 Substrate thickness measuring during polishing
02/05/2009US20090036024 Cmp apparatus and method of polishing wafer using cmp
02/05/2009CA2694713A1 Abrasive products with splice marks and automated splice detection
02/04/2009CN201189638Y Electric control device of energy-saving grinder
02/03/2009US7486407 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device
02/03/2009US7485026 Sander
01/2009
01/29/2009WO2009013231A1 Apparatus and method for checking thickness dimensions of an element while it is being machined
01/29/2009US20090028655 Device and method for machining bevel gears in the indexing method having complete indexing error compensation
01/28/2009CN101352836A Method and device for controlling polishing temperature of freezing fixed abrasive
01/28/2009CN100455410C Method and device for precisely controlling axial fiber polishing thickness
01/27/2009US7481945 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device
01/27/2009US7481697 Head slider and method of manufacturing same
01/27/2009US7481695 Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
01/22/2009US20090023361 Cmp apparatus and method of polishing wafer using cmp
01/20/2009US7479206 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
01/20/2009US7479056 Automated drill bit re-sharpening and verification system
01/15/2009WO2009007121A2 Method and arrangement for maintenance of gas-turbine blades
01/15/2009US20090017726 Spectra based endpointing for chemical mechanical polishing
01/14/2009EP2014413A1 Assembly, method and device for maintaining gas turbine blades
01/14/2009CN101342696A Power tool
01/13/2009US7476144 Sander
01/13/2009US7476143 Eyeglass lens processing system
01/08/2009WO2009006022A1 Tire for material treatment system
01/08/2009US20090011680 Polishing state monitoring apparatus and polishing apparatus and method
01/08/2009DE102007031299A1 Workpiece i.e. semiconductor wafer, machining tool i.e. double side machining tool, has wear sensor with sections running out from machining surfaces plane, where electrical resistances of sections exhibit different temperature dependencies
01/07/2009EP1722950B1 Nozzle assembly for a saw for a semiconductor device
01/07/2009CN201178090Y A method for measuring wafer liquid film middle variant in CMP process
01/07/2009CN201175855Y System for measuring abrasion amount of panel
01/07/2009CN101339893A Method for judging wafer thinning, device structure and device and its manufacture method
01/07/2009CN100448616C Pneumatic loading equipment of accurate doublefaced polisher
01/06/2009US7473162 Pad conditioner dresser with varying pressure
01/06/2009US7473161 Lapping machine and head device manufacturing method
01/06/2009US7473160 Method and apparatus for grinding a workpiece
01/06/2009US7473159 Detection of diamond contamination in polishing pad and reconditioning system therefor
01/01/2009US20090004951 Apparatus and method for removing material from microfeature workpieces
12/2008
12/31/2008WO2009003008A1 Methods of crystallographically reorienting single crystal bodies
12/31/2008EP2009426A2 Method for processing a substrate
12/31/2008CN100446927C Modeling an abrasive process to achieve controlled material removal
12/25/2008US20080318503 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
12/25/2008US20080318499 Substrate holding apparatus, polishing apparatus, and polishing method
12/25/2008US20080318492 Substrate holding apparatus, polishing apparatus, and polishing method
12/24/2008DE102004004556B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
12/23/2008US7467990 Back pressure control system for CMP and wafer polishing
12/17/2008EP2002933A1 Sander
12/17/2008EP2002932A1 Sander
12/17/2008EP2002931A1 Sander
12/17/2008EP2002930A1 Sander
12/16/2008US7465215 Sponge blasting apparatus and sponge blasting method
12/16/2008US7465214 Substrate holding apparatus and polishing apparatus
12/16/2008US7464482 Apparatus for the dimensional checking of orbitally rotating pins
12/16/2008CA2463209C Proportional pressure regulator having positive and negative pressure delivery capability
12/11/2008WO2008148638A1 Grinding center and method for the simultaneous grinding of multiple crankshaft bearings
12/11/2008US20080305717 Platen assembly and work piece carrier head employing flexible circuit sensor
12/11/2008US20080305716 Honing method and honing control device
12/11/2008US20080305715 Manufacturing method of semiconductor integrated circuit device
12/10/2008EP2000259A2 Substrate holding apparatus, polishing apparatus, and polishing method
12/10/2008EP2000258A2 Honing method and honing control device
12/10/2008EP1771279B1 Polishing apparatus and substrate processing method
12/10/2008CN101320708A Manufacturing method of semiconductor integrated circuit device
12/10/2008CN101318280A Overlength bed way precision finishing process
12/10/2008CN100442180C Numerical control apparatus
12/09/2008US7462092 Method of finishing bevel gears to produce a diffuse surface structure
12/04/2008US20080299872 Independent Measuring Apparatus for Grinding Machines
12/04/2008US20080299871 Methods and apparatus for polishing a semiconductor wafer
12/04/2008US20080297794 Apparatus for optical inspection of wafers during polishing
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