Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
08/2012
08/02/2012US20120196515 Polishing pad
08/02/2012US20120193573 Additive for polishing composition
08/02/2012US20120193506 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
08/02/2012DE112009002622T5 Maskenrohlingsubstrat Mask blank substrate
08/01/2012EP1261454B1 Dressing apparatus and polishing apparatus
08/01/2012CN202357028U Adjustment device
08/01/2012CN202357027U A strip billet cleaning and grinding device
08/01/2012CN202357026U Grinding device
08/01/2012CN202357025U Gate grinding device for gate valve
08/01/2012CN202357024U Four-axis coordinated high linear speed full-automatic roller grinder
08/01/2012CN1684234B Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units
08/01/2012CN102625741A Polishing pad, manufacturing method therefor, and polishing method
08/01/2012CN102623327A Chemical mechanical lapping method
08/01/2012CN102618172A Slurry and method for chemical mechanical polishing
08/01/2012CN102615589A Polishing system and polishing method using polishing disk guide disc
08/01/2012CN102615588A Process for producing glass substrate for magnetic disk and process for manufacturing magnetic disk
08/01/2012CN102615587A Grinding process for high-precision steel bearing ball for automobile
08/01/2012CN102615586A Full-automatic drill point grinding device and grinding method thereof
08/01/2012CN102615585A Grinding apparatus
08/01/2012CN102615584A Chemical mechanical grinding method
08/01/2012CN102615583A 研磨装置 Grinding device
08/01/2012CN102091999B Processing method for hot-pressing grinding of bearing bush working faces
08/01/2012CN101673668B Method for polishing gallium nitride crystals
07/2012
07/31/2012US8231735 slurries comprising cerium oxide particles, a water soluble polymer selected from acrylic polymers, polyvinyl acetate, polyvinyl imidazole and polyvinyl pyrrolidone, and an acetylenic organic compound such as ethoxylated tetramethyl-5-decyne-4,7-diol; polishes for dielectrics; semiconductors
07/26/2012WO2012098933A1 Polishing agent, polishing method, and method for manufacturing semiconductor integrated circuit device
07/26/2012WO2012048120A4 Nonwoven composite abrasive comprising diamond abrasive particles
07/26/2012US20120187333 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
07/26/2012DE102011003008A1 Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben Guide cage and method for simultaneously sided material-removing processing of semiconductor wafers
07/26/2012DE102011003006A1 Verfahren zur Bereitstellung jeweils einer ebenen Arbeitsschicht auf jeden der zwei Arbeitsscheiben einer Doppelseiten-Bearbeitungsvorrichtung A method for providing a level each work shift to each of the two work pane of a double sided machining device
07/25/2012EP2478999A2 Polishing method and polishing apparatus
07/25/2012CN202344383U Levelling-fastening device for grinding a plurality of hard-alloy test sample strips
07/25/2012CN202344382U Grinding dust absorption device
07/25/2012CN202344381U Positioning device for grinding and polishing material of turntable of grinding and polishing machine
07/25/2012CN202344380U Multi-body type long-distance coaxial hole grinding tooling
07/25/2012CN202344379U Novel grinder
07/25/2012CN202344378U Multifunctional stone grinding machine
07/25/2012CN1915596B 透明抛光垫 Transparent polishing pad
07/25/2012CN102610510A Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
07/25/2012CN102610509A Method of forming element isolation layer
07/25/2012CN102601727A Chemical mechanical polishing pad and chemical mechanical polishing method
07/25/2012CN102601726A Grinding rod and production method of high-precision air seal ring
07/25/2012CN102601725A Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus
07/25/2012CN102601724A Active-driving grinding device
07/25/2012CN102601723A Grinding method for semi-conductor device
07/25/2012CN102601722A Grinding method and grinding device
07/25/2012CN102601721A Method for grinding a cam contour of a push camshaft and device for executing the method
07/25/2012CN102601720A Punch grinder
07/25/2012CN102601719A Polishing method and polishing apparatus
07/25/2012CN102601718A Control method and control device for chemical mechanical grinding and method and equipment for chemical mechanical grinding
07/25/2012CN101992422B Process control method and system of copper chemical mechanical polishing
07/25/2012CN101934491B Polishing apparatus
07/25/2012CN101905434B Rotary grinding sucking disc adjusting mechanism of wafer back grinder
07/25/2012CN101829947B Feeding mechanism for numerical control double surface lapping machine
07/25/2012CN101670547B Polishing apparatus and method for separating a substrate from a substrate holding part
07/24/2012US8226924 Method for producing boehmite particles and method for producing alumina particles
07/24/2012US8226849 a mixture of oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors
07/19/2012US20120180317 Green ball grinding method, ceramic sphere fabrication method, and grinding apparatus
07/19/2012DE102008032908A1 Verfahren und Vorrichtung zur Vorherbestimmung/ Detektierung des Polierendpunkts und Verfahren und Vorrichtung zur Aufzeichnung der Filmdicke inEchtzeit Method and apparatus for predetermining / detecting the polishing endpoint and method and apparatus for recording the film thickness inEchtzeit
07/18/2012EP2071615B1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
07/18/2012CN202336794U 一种研磨机 A polishing machine
07/18/2012CN102598094A Glass substrate for display and method for manufacturing the glass substrate
07/18/2012CN102596506A Polishing pad
07/18/2012CN102593042A Chemical and mechanical grinding method and semiconductor chip cleaning method
07/18/2012CN102585765A Cmp研磨剂以及衬底的研磨方法 Cmp abrasive polishing method and substrate
07/18/2012CN102581750A Wax-free grinding and polishing template with double inlaying layers
07/18/2012CN102581749A Ultrasonic grinding head structure based on CCOS (computer-controlled optical surfacing) technology
07/18/2012CN102581748A Float disc feeding method for planar wafer optical parts
07/18/2012CN102581747A Runner collar grinding equipment
07/18/2012CN102581746A Ball feeding-discharging hole structure of ball mill
07/18/2012CN102581745A Handling robot system for chemical mechanical polishing
07/18/2012CN102581744A Automatic control method and automatic control device of grinding machine
07/18/2012CN102581743A Method for polishing aspheric optical part
07/18/2012CN102581723A Machining device for convex non-spherical lens
07/18/2012CN101837564B Valve grinding machine
07/18/2012CN101659035B Polishing pad and manufacturing method thereof
07/18/2012CN101321841B Cerium polishing agent
07/18/2012CN101268111B Polymer material, foam obtained from same, and polishing pad using those
07/18/2012CN101140857B Method and apparatus of manufacturing semiconductor device
07/17/2012US8222144 Method for manufacturing semiconductor device, and polishing apparatus
07/17/2012US8221198 Polishing apparatus for polishing a work having two surfaces
07/17/2012US8221191 CMP apparatus and method of polishing wafer using CMP
07/12/2012DE112010003349T5 Doppelseitige Poliervorrichtung und Träger für diedoppelseitige Poliervorrichtung Double-sided polishing device and carrier for diedoppelseitige polishing apparatus
07/12/2012DE102009030298B4 Verfahren zur lokalen Politur einer Halbleiterscheibe Process for the local polishing of a semiconductor wafer
07/11/2012EP2474978A1 Method and apparatus for repairing optical disc
07/11/2012CN202332807U Device for preventing corrosion of metal and grinding apparatus
07/11/2012CN202317971U 可旋转磨针机治具 Rotating jig grinding machine
07/11/2012CN202317970U 一种铁氧体磁芯研磨夹具 One kind of ferrite core grinding fixture
07/11/2012CN202317969U 电磨机 Electric grinder
07/11/2012CN202317968U 发光二极管晶圆的研磨头 A light emitting diode wafer polishing head
07/11/2012CN202317967U 在脱模纸和研磨片上分别具有捏片的带脱模纸的研磨片 Abrasive sheet with a release paper on the release paper and the abrasive sheet having a grip flap, respectively, of
07/11/2012CN202317966U 快速研磨页轮 Fast grinding wheel page
07/11/2012CN202317965U 四头对转行星研磨机械 Four pairs of planetary rotation grinding machinery
07/11/2012CN202317964U 一种倒扣式压板输送装置 Button down a plate conveying device
07/11/2012CN202317963U 一种化学机械研磨装置 A chemical mechanical polishing apparatus
07/11/2012CN202317962U 用于研磨机运行过程中的全自动硅片测厚仪 Process for automatic grinding machine running silicon thickness
07/11/2012CN202317961U 一种磁芯气隙研磨的简易装置 Simple device for grinding core gap
07/11/2012CN202317960U 一种气门研磨装置 A valve grinding apparatus
07/11/2012CN102574969A Polyurethane composition for CMP pads and method of manufacturing same
07/11/2012CN102574276A Abrasive article with solid core and methods of making the same
07/11/2012CN102574267A Supporting pad
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