| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/04/2012 | CN101496458B Method for fixing an electrical or electronic component, in particular a printed circuit board, in a housing and fixing element therefor |
| 07/04/2012 | CN101473386B Method for producing conductive material |
| 07/04/2012 | CN101394711B Manufacture method of buildup circuit board |
| 07/04/2012 | CN101385404B Circuit board manufacturing method and circuit board |
| 07/04/2012 | CN101320213B Light sensitive resin composition and flexible printed circuit board produced with the same |
| 07/04/2012 | CN101316001B Method for producing radio frequency label antenna |
| 07/04/2012 | CN101223835B Process for producing wiring board covered with thermoplastic liquid crystal polymer film |
| 07/04/2012 | CN101199242B Method for manufacturing a circuit board structure, and a circuit board structure |
| 07/04/2012 | CN101193502B Circuit board structure and its making method |
| 07/04/2012 | CN101163376B Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same |
| 07/04/2012 | CN101056758B Metal-clad laminate and method for production thereof |
| 07/04/2012 | CN101039553B Improved adhesion of polymeric materials to metal surfaces |
| 07/04/2012 | CN101017925B The making method of the thin film antenna |
| 07/03/2012 | US8211494 Method and apparatus for manufacturing circuit board |
| 07/03/2012 | US8210357 Taped component and method of mounting product using the same |
| 07/03/2012 | US8209861 Method for manufacturing a touch screen sensor assembly |
| 07/03/2012 | US8209859 Techniques for direct encasement of circuit board structures |
| 07/03/2012 | US8209857 Method of making a thin film device |
| 07/03/2012 | US8209856 Printed wiring board and method for manufacturing the same |
| 06/28/2012 | WO2012088360A1 Substrates having voltage switchable dielectric materials |
| 06/28/2012 | WO2012087552A1 Reduced plated through hole (pth) pad for enabling core routing and substrate layer count reduction |
| 06/28/2012 | WO2012087073A2 Printed circuit board and method for manufacturing same 인쇄회로기판 및 그의 제조 방법 |
| 06/28/2012 | WO2012087072A2 Printed circuit board and method for manufacturing same |
| 06/28/2012 | WO2012087060A2 Printed circuit board and method for manufacturing the same |
| 06/28/2012 | WO2012087059A2 Printed circuit board and method for manufacturing the same |
| 06/28/2012 | WO2012087058A2 Printed circuit board and method for manufacturing the same |
| 06/28/2012 | WO2012086771A1 Thermocompression head, mounting device, mounting method, and assembly |
| 06/28/2012 | WO2012086745A1 Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component |
| 06/28/2012 | WO2012086533A1 Reflow soldering apparatus and method therefor |
| 06/28/2012 | WO2012086371A1 Photosensitive resin composition |
| 06/28/2012 | WO2012086219A1 Flexible printed wiring board, and laminate for use in production of flexible printed wiring board |
| 06/28/2012 | WO2012086201A1 Mounting structure and production method for mounting structure |
| 06/28/2012 | WO2012086140A1 Multilayer wiring substrate, production method for multilayer wiring substrate, and via paste |
| 06/28/2012 | WO2012086132A1 Tape adhering device and tape adhering method |
| 06/28/2012 | WO2012085472A2 Printed circuit board with an insulated metal substrate |
| 06/28/2012 | WO2012085397A1 Device for connecting an electronic card to a plurality of components |
| 06/28/2012 | WO2012084736A1 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates |
| 06/28/2012 | WO2012084569A1 Epoxy resin compositions containing epoxy and vinyl ester groups |
| 06/28/2012 | WO2012084556A1 Electrical module for being received by automatic placement machines by means of generating a vacuum |
| 06/28/2012 | WO2012084291A1 Method of manufacturing a surface mounted device and corresponding surface mounted device |
| 06/28/2012 | WO2012084223A1 Printing table assembly, method for operating a printing table assembly |
| 06/28/2012 | WO2012083595A1 Manufacturing method for printed circuit board with insulated micro radiator |
| 06/28/2012 | WO2012058131A3 Composite film for board level emi shielding |
| 06/28/2012 | WO2012026791A3 Conductive metal ink composition, and method for preparing a conductive pattern |
| 06/28/2012 | WO2011134770A3 Printed circuit board with partial housing encapsulated in a pressure-resistant manner |
| 06/28/2012 | US20120166102 Method and system for online creep monitoring |
| 06/28/2012 | US20120165903 Implantable pulse generator feedthrus and methods of manufacture |
| 06/28/2012 | US20120165759 Waterproof stretchable optoelectronics |
| 06/28/2012 | US20120164888 Metalized pad to electrical contact interface |
| 06/28/2012 | US20120164854 Packaging substrate and method of fabricating the same |
| 06/28/2012 | US20120162948 Sensor module |
| 06/28/2012 | US20120162930 Module ic package structure with electrical shield function and method for making the same |
| 06/28/2012 | US20120162928 Electronic package and method of making same |
| 06/28/2012 | US20120162923 Thermal loading mechanism |
| 06/28/2012 | US20120162860 Chip capacitor and method of manufacturing same |
| 06/28/2012 | US20120162623 Surface position detection apparatus, exposure apparatus, and exposure method |
| 06/28/2012 | US20120160920 Radio frequency (rf) particles |
| 06/28/2012 | US20120160803 Method for manufacturing multilayer printed circuit board |
| 06/28/2012 | US20120160556 Circuit board and method of manufacturing the same |
| 06/28/2012 | US20120160553 Circuit board production method and circuit board |
| 06/28/2012 | US20120160550 Printed circuit board having embedded electronic component and method of manufacturing the same |
| 06/28/2012 | US20120160549 Printed circuit board having embedded electronic component and method of manufacturing the same |
| 06/28/2012 | US20120160398 Apparatus and method for pressing printed circuit board |
| 06/28/2012 | US20120159782 Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process |
| 06/28/2012 | US20120159781 Rotary mounting head unit, and method and apparatus for mounting component |
| 06/28/2012 | US20120159780 Method for fabricating a touch panel |
| 06/28/2012 | US20120159779 Integrated circuit package architecture |
| 06/28/2012 | US20120159778 Method for Connecting a Plurality of Unpackaged Substrates |
| 06/28/2012 | DE112010002844T5 Siebdruckvorrichtung und Siebdruckverfahren Screen printer and screen printing method |
| 06/28/2012 | DE102008031573B4 Dehnbares Vlies mit Leiterstrukturen Stretch fleece with conductor structures |
| 06/27/2012 | EP2469993A1 Environmental Protection Coating System and Method |
| 06/27/2012 | EP2469992A1 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates |
| 06/27/2012 | EP2469991A2 Sticker with an electronic function element |
| 06/27/2012 | EP2469990A2 Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 06/27/2012 | EP2468082A1 A method of producing an electrically conducting via in a substrate |
| 06/27/2012 | EP2468081A1 Dielectric protective layer for a self-organizing monolayer (sam) |
| 06/27/2012 | EP2248401B1 Method for producing printed circuit boards comprising fitted components |
| 06/27/2012 | EP2226747B1 Method and device for creating a wiring pattern on a substrate |
| 06/27/2012 | EP2073261B1 Ceramic substrate component and electronic component using the same |
| 06/27/2012 | EP1884960B1 Conductive paste and wiring board using it |
| 06/27/2012 | EP1587892B1 Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 06/27/2012 | CN202285460U Smt通孔回流技术工艺装备 Smt through-hole reflow process technology and equipment |
| 06/27/2012 | CN202285459U 用于制造直角型线路板铜导体的底板结构 For the manufacture of right angle PCB copper conductors floor structure |
| 06/27/2012 | CN1930323B Metal surface treating agent |
| 06/27/2012 | CN1920574B Solder material test apparatus, and method of controlling the same |
| 06/27/2012 | CN1870859B Manufacturing method of two-face exposed flexible circuit board |
| 06/27/2012 | CN1747623B Flexible pcb |
| 06/27/2012 | CN102523704A Production method of multi-stage HDI plate |
| 06/27/2012 | CN102523703A Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
| 06/27/2012 | CN102523702A Electroplating manufacturing process of circuit board with back-drilled blind hole |
| 06/27/2012 | CN102523701A Method for manufacturing stair boss video interface processor (VIP) hole resin plugging plate |
| 06/27/2012 | CN102523700A Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
| 06/27/2012 | CN102523699A Resin plug-hole apparatus of PCB back borehole and method thereof |
| 06/27/2012 | CN102523698A Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| 06/27/2012 | CN102523697A Method for connecting antenna plate and control plate, control plate and electromagnetic input device |
| 06/27/2012 | CN102523696A Solder resist manufacturing method of thick copper plate |
| 06/27/2012 | CN102523695A Plate cleaning device and plate cleaning method |
| 06/27/2012 | CN102523694A Method for avoiding substrate exposure during pattern transfer of step circuit boards |
| 06/27/2012 | CN102523693A Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| 06/27/2012 | CN102523692A Stepped circuit board manufacturing process |