Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2012
06/27/2012CN102523691A Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces
06/27/2012CN102523690A Manufacturing method of PCB board with blind slot containing IC foot
06/27/2012CN102523689A Method for manufacturing circuit board with high copper thickness
06/27/2012CN102523688A Method for manufacturing PCB (Printed Circuit Board) with stepped grooves
06/27/2012CN102523687A Method for restraining plate knitting effect
06/27/2012CN102523686A Method for increasing surface roughness of insulating board
06/27/2012CN102523685A Manufacturing method for printed circuit board (PCB) with stepped grooves
06/27/2012CN102523684A Manufacture method for printed circuit board (PCB) with step groove
06/27/2012CN102523683A Flex-rigid combined board and manufacturing method of flex-rigid combined board
06/27/2012CN102523680A Organic solderability preservative (OSP) on surface of printed circuit board and presoaking stoste and method for manufacturing OSP
06/27/2012CN102523677A Multilayer printed wiring board
06/27/2012CN102522635A Circuit connecting material, connection structure for circuit member using the same and production method thereof
06/27/2012CN102522345A Ball mounting device and ball mounting method utilizing same
06/27/2012CN102521437A Method for producing printed board by using automatic typesetting
06/27/2012CN102519027A Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof
06/27/2012CN102517617A Device for surface roughening copper plate, and surface roughened copper plate
06/27/2012CN102516896A Heat conductive coating-type polyimide film for copper cladding and preparation method thereof
06/27/2012CN102516497A Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board
06/27/2012CN102514304A Common Tg lead-free copper clad laminate and preparation method thereof
06/27/2012CN102176810B Manufacturing process of reflective layer on circuit board for installing LED (Light Emitting Diode) lamp beads
06/27/2012CN102076180B Circuit board structure and forming method thereof
06/27/2012CN102006726B Composite circuit board device and manufacturing method thereof
06/27/2012CN101917824B Manufacture method of single-sided flexible circuit board
06/27/2012CN101884255B Method of disposing selectively two types of substances on surface of substrate
06/27/2012CN101877944B Full implanting board of printed circuit board and connecting method thereof
06/27/2012CN101779525B Wiring board and liquid crystal display device
06/27/2012CN101521995B Method for manufacturing circuit board module of optical indicator device
06/27/2012CN101521066B TYCO electronics corp
06/27/2012CN101361183B Integrated electronic device and cooling device for an integrated electronic device
06/27/2012CN101331814B Multilayer printed wiring plate, and method for fabricating the same
06/27/2012CN101331813B Multilayer printed-circuit board, and its parts mounting method
06/27/2012CN101325175B Contact hole, conducting post forming method, and multilayered wiring substrate producing method
06/27/2012CN101309993B Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
06/27/2012CN101286411B Coil unit, method of manufacturing the same, and electronic instrument
06/27/2012CN101263750B Laminated substrate for mounting electronic parts
06/27/2012CN101226798B Transient voltage protection circuit boards and manufacturing method
06/27/2012CN101222824B Multi-layer substrate and electronic device having the same
06/27/2012CN101211693B Capacitor and multi-layer board embedding the capacitor
06/27/2012CN101199244B Method for manufacturing a circuit board structure, and a circuit board structure
06/27/2012CN101155466B Printed circuit board
06/26/2012US8208266 Shaped integrated passives
06/26/2012US8206515 Lead-free solder composition including microcapsules
06/26/2012US8205329 Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming piece obtained thereby; and multi-layer printed wiring board obtained by using dielectric layer constituting material and/or capacitor circuit forming piece
06/26/2012US8205328 Components packaging method
06/26/2012US8205327 Method for manufacturing circuit board on which electronic component is mounted
06/21/2012WO2012081680A1 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
06/21/2012WO2012081425A1 Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
06/21/2012WO2012081295A1 Novel photosensitive resin composition and use thereof
06/21/2012WO2012081255A1 Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method
06/21/2012WO2012079391A1 Composite material, high frequency circuit substrate manufactured therefrom and manufacture method thereof
06/21/2012WO2012057568A3 Method for manufacturing a pad for a touch panel, and pad for a touch panel manufactured by the method
06/21/2012WO2012049087A3 Semiconductor module and method of manufacturing a semiconductor module
06/21/2012US20120155684 Hearing Aid Device and Method of Producing a Hearing Aid Device
06/21/2012US20120155055 Semiconductor chip assembly and method for making same
06/21/2012US20120155048 Wiring board, semiconductor apparatus and method of manufacturing them
06/21/2012US20120155044 Electronic circuit board and a related method thereof
06/21/2012US20120155038 Flexible circuit board and manufacturing method thereof
06/21/2012US20120154053 Power Transistor Output Match Network with High Q RF Path and Low Q Low Frequency Path
06/21/2012US20120153981 System and Method for Manufacturing a Swallowable Sensor Device
06/21/2012US20120153872 Light emitting module and method of manufacturing the same
06/21/2012US20120153463 Multilayer wiring substrate and method of manufacturing the same
06/21/2012US20120152890 Methods for manufacturing radio frequency (rf) powder
06/21/2012US20120152758 Method for processing of glass, process for production of wiring substrate, process for production of microchip, and process for production of microlens array substrate
06/21/2012US20120152753 Method of manufacturing printed circuit board
06/21/2012US20120152606 Printed wiring board
06/21/2012US20120152605 Circuitized substrate with dielectric interposer assembly and method
06/21/2012US20120152604 Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof
06/21/2012US20120152603 Printed circuit board including at least one layer
06/21/2012US20120152599 Printed wiring board, build-up multi-layer board, and production method therefor
06/21/2012US20120152598 Wiring board and method of manufacturing the same
06/21/2012US20120152597 Wiring board and method of manufacturing the same
06/21/2012US20120152595 Multilayer printed circuit board and method of manufacturing the same
06/21/2012US20120152592 Method for manufacturing printed circuit board, method for manufacturing printed circuit board assembly sheet, printed circuit board, and printed circuit board assembly sheet
06/21/2012US20120151764 Method for manufacturing printed wiring board and printed wiring board
06/21/2012US20120151763 Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component using the same
06/21/2012US20120151762 Sliding package retention device for lga sockets
06/21/2012US20120151761 Electronic component mounting device and electronic component mounting method
06/21/2012US20120151760 Non-planar display glass for mobile device
06/21/2012US20120151757 Wire forming device
06/21/2012DE112010000732T5 Laminattyp-keramik-elektronikkomponente und verfahren zum fertigen derselben Laminate-type ceramic-electronics component and process for manufacture thereof
06/21/2012DE102011088587A1 Verfahren zum Ausbilden eines Leiters A method for forming a conductor
06/21/2012DE102011003622A1 Flexible multilayered circuit substrate, has flexible film substrates with opposing main surfaces, where bonding material of specific thickness is applied at connecting areas for separating flexible film substrates
06/21/2012DE102010063709A1 Vorrichtung zur elektrischen Kontaktierung von Elektronikeinheiten An apparatus for electrically contacting electronic units
06/21/2012DE102010063387A1 Schaltungsanordnung mit mindestens zwei Teilmoduln Circuit arrangement with at least two sub-modules
06/21/2012DE102010054974A1 Leiterplatte und Verfahren zur Herstellung von Leiterplatten Printed circuit board and process for the production of printed circuit boards
06/21/2012DE102010019406B4 Verfahren zum partiellen Lösen einer definierten Fläche einer leitfähigen Schicht A method for partial release of a defined area of ​​a conductive layer
06/21/2012DE102008057154B4 Kreiselpumpe mit einem bürstenlosen Gleichstrommotor Centrifugal pump with a brushless direct current motor
06/21/2012DE10165046B4 Verfahren zum Herstellen einer Schaltungsplatte unter Anwendung einer Zusammensetzung zum Mikroätzen A method of manufacturing a circuit board by applying a composition for microetching
06/20/2012EP2467004A2 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
06/20/2012EP2467003A2 Circuit board and method for producing circuit boards
06/20/2012EP2467002A2 Electronic component on-substrate mounting structure
06/20/2012EP2467000A1 Moulded part with a substrate with removable protective varnish coating and method for producing same
06/20/2012EP2465973A2 Plating catalyst and method
06/20/2012EP2465965A1 Device and method for spraying a structure made of conductive material on a substrate
06/20/2012EP2187717B1 Circuit board manufacturing method
06/20/2012EP2179844B1 Release sheet and method for producing it
06/20/2012EP1446238B1 Ultrasonic printed circuit board transducer
06/20/2012EP1438446B1 System and method for electrolytic plating
06/20/2012CN202282916U Compression joint device
06/20/2012CN202282915U 一种夹具 A clamp
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