Patents for H05K 1 - Printed circuits (98,583)
05/2014
05/15/2014US20140131073 Multi-layer wiring board
05/15/2014US20140131072 Connection structure for a substrate and a method of fabricating the connection structure
05/15/2014US20140131071 Wiring material, method for fabricating the same, and secondary battery device and electronic equipment using the same
05/15/2014US20140131070 Touch panel structure and manufacturing method thereof
05/15/2014US20140131069 Touch-sensing electrode structure and method of manufacturing the same
05/15/2014US20140131068 Circuit board and method for manufacturing the same
05/15/2014US20140131067 Transparent conductor and preparation method thereof
05/15/2014DE10300818B4 Stanzwerkzeug, insbesondere für Green Sheets Punch, especially for Green Sheets
05/15/2014DE102013112279A1 Eingebettettes Funkfrequenz-Identifikations-Gehäuse (RFID-Gehäuse) Eingebettettes radio frequency identification housing (RFID housing)
05/15/2014DE102013104305A1 Schwenkbare Baugruppe für eine Platine Swivel assembly for a circuit board
05/15/2014DE102012016912A1 Platine zur Verwendung in einer elektrischen Maschine, insbesondere in einem Elektromotor, vorzugsweise einem Außenläufermotor, sowie elektrische Maschine mit einer solchen Platine Board for use in an electrical machine, in particular in an electric motor, preferably an external rotor motor, and electric machine with such a board
05/14/2014EP2731411A2 Connection structure of circuit board
05/14/2014EP2731410A1 Opto-electric hybrid board
05/14/2014EP2730834A1 LED Illumination Device
05/14/2014EP2730153A1 Arrangement for cooling subassemblies of an automation or control system
05/14/2014CN203596977U 一种pcb和功率管散热器的安装结构 Installation structure for a pcb and power tube radiator
05/14/2014CN203596976U 电路板及相机模组 Circuit boards and camera module
05/14/2014CN203596975U 一种带有pin连接针的pcb板 Pcb board a connecting pin with the pin
05/14/2014CN203596974U 分离式PCB型Rogowski线圈 Separate PCB Rogowski coil type
05/14/2014CN203596973U 电路板 Board
05/14/2014CN203596972U 防水型陶瓷基板保护板 Waterproof ceramic substrate protection board
05/14/2014CN203596971U 一种具有散热功能的电路板 A circuit having a heat dissipation plate
05/14/2014CN203596970U 免焊接定位连接汽车遥控器线路板装置 Free welding positioning remote control car circuit board connector device
05/14/2014CN203596969U 用于电路板的连接导线 A circuit board for connecting the wire
05/14/2014CN203596344U 电子陶瓷基板 Electronic ceramic substrates
05/14/2014CN103797900A 用于冷却自动化系统或控制系统的部件的组件 Cooling system components for automation or control system components
05/14/2014CN103797899A 用于确保电动机连接的印刷电路和包括印刷电路的电动机 Used to ensure that the printed circuit connected to the motor and includes a printed circuit motor
05/14/2014CN103797575A 制造包括封装的支持结构内的嵌入式电路组件的半导体封装 Manufacturing includes embedded circuit components encapsulated within the support structure of a semiconductor package
05/14/2014CN103797078A 电路连接材料以及使用该电路连接材料的连接方法和连接结构体 Circuit connecting material and the use of the circuit connecting material connection method and connecting structure
05/14/2014CN103796474A 电路板散热结构 Board heat dissipation structure
05/14/2014CN103796451A 印刷布线板及印刷布线板的制造方法 The method of manufacturing a printed wiring board and a printed wiring board
05/14/2014CN103796445A 具有内埋元件的电路板及其制作方法 Circuit board and a method of preparing a buried element
05/14/2014CN103796428A 一种节能灯用线路板跳线的连接方法 Connection method for energy-saving lamp circuit board jumper
05/14/2014CN103796427A 控制设备的印制电路板组件、控制设备和信号处理装置 Printed circuit board assembly control equipment, control equipment and signal processing device
05/14/2014CN103796426A 应用片式多层电容器的电路模块和电子设备 Application of multi-layer capacitor circuit modules and electronic equipment
05/14/2014CN103796425A 用于使在低温基底上的薄膜高速反应的方法和装置 High-speed response for the film substrate on a low temperature method and apparatus
05/14/2014CN103796424A 一种多层电路板及其阻抗控制方法 A multilayer circuit board and the impedance control method
05/14/2014CN103796423A 具有减少的电磁辐射的发射的印刷电路板 Having a reduced emission of electromagnetic radiation of the printed circuit board
05/14/2014CN103796422A 带载体的铜箔、使用它的覆铜板、印刷布线板、印刷电路板和印刷布线板的制造方法 The copper foil with a carrier, the use of the method of manufacturing it CCL, printed wiring boards, printed circuit boards and printed wiring board
05/14/2014CN103796421A 具有低热阻的低电感柔性粘合 Low inductor has a low thermal resistance of flexible adhesive
05/14/2014CN103796420A 多层配线基板和使用该多层配线基板的探针卡 Multi-layer wiring substrate and a probe card using the multilayer wiring board
05/14/2014CN103796419A 用于印刷电路板的消光性黑色补强板 For printed circuit boards extinction black reinforcement plate
05/14/2014CN103796418A 一种电路板及电路板的制作方法 A method of manufacturing a circuit board and the circuit board
05/14/2014CN103796417A 电路板及其制作方法 Circuit board and its manufacturing method
05/14/2014CN103796416A 软硬结合电路板及其制作方法 Flex circuit board and its manufacturing method
05/14/2014CN103796415A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
05/14/2014CN103796414A 印制电路板及印制电路板的制造方法 The method of manufacturing printed circuit boards and printed circuit boards
05/14/2014CN103795370A 电子元件模块 The electronics module
05/14/2014CN103795273A 一种具有pcb集成型变压器的开关电源模块 Switching power supply module having an integrated transformer pcb
05/14/2014CN103794746A 电路板之间的连接结构和具有该连接结构的电池组 Having a connection structure of the connection structure between a circuit board of the battery pack
05/14/2014CN103794364A 多层片式电子元件和用于安装该电子元件的板 Board of the electronic components and multi-chip electronic components for installation
05/14/2014CN103788342A 一种紫外光热双重固化树脂及含该树脂的防焊油墨和应用 One kind of UV-curable resin and heat-double resist ink and applications containing the resin
05/14/2014CN103787665A 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 Coupling agent, an organic ceramic material, an organic ceramic circuit board and a method for preparing
05/14/2014CN103786389A 带载体的铜箔、使用它的覆铜板、印刷布线板、印刷电路板和印刷布线板的制造方法 The copper foil with a carrier, the use of the method of manufacturing it CCL, printed wiring boards, printed circuit boards and printed wiring board
05/14/2014CN102571135B 射频半集成应用装置 RF semi-integrated application devices
05/14/2014CN102504333B 一种无机填充物、树脂组合物及其应用 An inorganic filler, a resin composition and its Applications
05/14/2014CN102333835B 粘合剂树脂组合物及利用其的层叠体和挠性印刷线路板 The adhesive resin composition and the use thereof in the laminate and the flexible printed circuit
05/13/2014US8724342 Shield with resilient spring snaps for removable attachment to an electrical circuit board without the use of adhesive or solder
05/13/2014US8724341 Backplane and backlight module
05/13/2014US8724340 Data carrier for contactless data transmission and a method for producing such a data carrier
05/13/2014US8724339 Compact media player
05/13/2014US8724333 Electrical field device and expansion module for insertion into an electrical field device
05/13/2014US8724070 Connecting structure of electronic apparatus and display device using the same
05/13/2014US8723052 Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
05/13/2014US8723051 Wiring substrate and method for manufacturing wiring substrate
05/13/2014US8723050 Multilayer printed circuit board and method for making same
05/13/2014US8723049 Low-stress TSV design using conductive particles
05/13/2014US8723048 Three-dimensional coiling via structure for impedance tuning of impedance discontinuity
05/13/2014US8723047 Printed circuit board, design method thereof and mainboard of terminal product
05/13/2014US8723046 Narrow frame touch input sheet with good anticorrosion property and manufacturing method thereof
05/13/2014US8722191 Intermediate layer material and composite laminate
05/13/2014US8721921 Liquid crystal polyester composition
05/13/2014US8721350 Electrical connector and electrical connector assembly
05/13/2014US8721349 Connector, optical transmission device, and connector connection method
05/13/2014US8721117 Lighting device
05/08/2014WO2014070253A1 Current redistribution in a printed circuit board
05/08/2014WO2014069824A1 Printed circuit board and lighting device
05/08/2014WO2014069734A1 Printed circuit board
05/08/2014WO2014069733A1 Printed circuit board for mounting chip and method of manufacturing the same
05/08/2014WO2014069436A1 Photosensitive conductive paste and method for producing conductive pattern
05/08/2014WO2014069389A1 Printed wiring board
05/08/2014WO2014069306A1 Substrate and metal layer manufacturing method
05/08/2014WO2014069305A1 Substrate and method for producing substrate
05/08/2014WO2014069143A1 Module
05/08/2014WO2014069095A1 High-frequency signal line and manufacturing method therefor
05/08/2014WO2014069061A1 High-frequency signal line and manufacturing method therefor
05/08/2014WO2014068798A1 Conductive adhesive for screen printing, joined body of inorganic material, and method for producing same
05/08/2014WO2014068005A1 Contact assembly, switching configuration
05/08/2014US20140127494 Polyimide porous body and method for producing same
05/08/2014US20140127493 Ceramic electronic component and method for manufacturing the same
05/08/2014US20140127483 Copper-clad laminate. method for manufacturing the same, and printed circuit board including the same
05/08/2014US20140127462 Prepreg comprising polyphenylene ether particles
05/08/2014US20140126168 Wireless module
05/08/2014US20140126167 Using millisecond pulsed laser welding in mems packaging
05/08/2014US20140126166 Method of forming solder resist post, method of manufacturing electronic device package usong solder resist post, and electronic device package manufactured by using methods
05/08/2014US20140126162 Substrate inductive device methods and apparatus
05/08/2014US20140126161 Electronic pacakge module and method of manufacturing the same
05/08/2014US20140126159 Electronic device, system package module and method of manufacturing system package module
05/08/2014US20140126156 Circuit module
05/08/2014US20140125426 High-frequency signal transmission line and electronic apparatus
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